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SN74LVC138APWG4

Texas Instruments

SN74LVC138APWG4 by Texas Instruments

SN74LVC138APWG4 by Texas Instruments is an 8-bit decoder with a propagation delay of 6.7 ns at 1.8V, suitable for industrial applications. It operates within a temperature range of -40 to 85°C, with a max supply voltage of 3.6V and output polarity inverted for versatile usage in various electronic systems.

Median Price

$0.647

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 542 parts In-Stock

1+ parts

$1.860

100+ parts

$0.868

1k+ parts

$0.669

10k+ parts

$0.532

542

$1.860

$0.868

$0.669

$0.532

Rochester

USA . 1,378 parts In-Stock

1+ parts

-

100+ parts

$0.635

1k+ parts

$0.527

10k+ parts

$0.470

1,378

-

$0.635

$0.527

$0.470

DigiKey

USA . 1,378 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.540

10k+ parts

-

1,378

-

-

$0.540

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Verical

USA . 528 parts In-Stock

1+ parts

-

100+ parts

-

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$0.659

10k+ parts

$0.587

528

-

-

$0.659

$0.587

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,146 parts In-Stock

1+ parts

$0.493

100+ parts

-

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-

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1,146

$0.493

-

-

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Nova Conductors

Japan . 100 parts In-Stock

1+ parts

$0.634

100+ parts

-

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-

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100

$0.634

-

-

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Vyrian

USA . 881 parts In-Stock

1+ parts

-

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881

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Sensible Micro Corp

USA . 167 parts In-Stock

1+ parts

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167

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Pegasus Components GmbH

Germany . 10 parts In-Stock

1+ parts

-

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10

-

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Ashlea Components Ltd

UK . 4 parts In-Stock

1+ parts

-

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-

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4

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 1,100 parts In-Stock

1+ parts

$0.441

100+ parts

$0.430

1k+ parts

$0.428

10k+ parts

-

1,100

$0.441

$0.430

$0.428

-

Ampacity Inc.

Singapore . 951 parts In-Stock

1+ parts

$0.441

100+ parts

-

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-

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951

$0.441

-

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Corphita

USA . 1,232 parts In-Stock

1+ parts

$0.467

100+ parts

-

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1,232

$0.467

-

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Argo Parts USA

USA . 1,835 parts In-Stock

1+ parts

$0.634

100+ parts

-

1k+ parts

-

10k+ parts

$0.615

1,835

$0.634

-

-

$0.615

Continental Prestige Electronics

USA . 641 parts In-Stock

1+ parts

$0.634

100+ parts

-

1k+ parts

-

10k+ parts

$0.621

641

$0.634

-

-

$0.621

Corohmni

South Africa . 486 parts In-Stock

1+ parts

$17.788

100+ parts

-

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-

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486

$17.788

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Advanced Electronics

New Zealand . 1,000 parts In-Stock

1+ parts

$25.141

100+ parts

$23.884

1k+ parts

$23.884

10k+ parts

-

1,000

$25.141

$23.884

$23.884

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Parana Technologies

USA . 2,331 parts In-Stock

1+ parts

$25.457

100+ parts

-

1k+ parts

$26.088

10k+ parts

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2,331

$25.457

-

$26.088

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DigiPath Technology Company

USA . 1,891 parts In-Stock

1+ parts

$28.031

100+ parts

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1,891

$28.031

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IDEA Electronic Components Group

UK . 1,401 parts In-Stock

1+ parts

$28.603

100+ parts

$27.173

1k+ parts

$25.743

10k+ parts

-

1,401

$28.603

$27.173

$25.743

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ChromeModa Solutions

Germany . 1,253 parts In-Stock

1+ parts

$28.603

100+ parts

$23.454

1k+ parts

-

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1,253

$28.603

$23.454

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Perfect Parts

USA . 2,923 parts In-Stock

1+ parts

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2,923

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Microchip USA

USA . 2,458 parts In-Stock

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2,458

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Overview

Unlock the power of precision and reliability with the SN74LVC138APWG4 by Texas Instruments. As a top-tier manufacturer in the industry, Texas Instruments ensures exceptional quality and performance. This decoder & driver chip is perfect for a wide range of applications, offering fast propagation delay and inverted output polarity. With a compact design and industrial-grade temperature tolerance, this product provides unmatched value and efficiency for your projects. Trust Texas Instruments to deliver superior technology that meets your needs and exceeds your expectations.

Feature Benefit Bullets

Package Body Material:

PLASTIC/EPOXY - Durable material for long-lasting use.

Propagation Delay At Nominal Supply:

6.7 ns - Fast response time for efficient operation.

Surface Mount:

YES - Easy installation on circuit boards.

Input Conditioning:

STANDARD - Compatible with various input signals.

Package Shape:

RECTANGULAR - Space-saving design for compact setups.

No. of Bits:

8 - Provides sufficient decoding capabilities.

Nominal Supply Voltage / Vsup (V):

1.8 - Energy-efficient operation.

Load Capacitance (CL):

50 pF - Reliable performance with optimal load capacity.

Power Supplies (V):

3.3 - Standard power supply compatibility.

No. of Terminals:

16 - Sufficient connectivity options for integration.

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH - Convenient packaging for easy handling.

Maximum I (ol):

24 Amp - Can handle high output current requirements.

Propagation Delay (tpd):

22 ns - Quick signal processing for efficient decoding.

Maximum Operating Temperature:

85 °C - Suitable for industrial environments.

Minimum Operating Temperature:

40 °C - Can withstand extreme temperature conditions.

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au) - Corrosion-resistant finish for longevity.

Terminal Position:

DUAL - Provides flexibility in installation orientation.

Maximum Seated Height:

1.2 mm - Compact and low-profile design.

Width:

4.4 mm - Space-efficient form factor.

Output Polarity:

INVERTED - Versatile output options for different applications.

Minimum Supply Voltage (Vsup):

1.65 V - Compatible with a wide range of power sources.

Peak Reflow Temperature °C:

260 - Withstands high-temperature soldering processes.

Length:

5 mm - Compact size for easy integration in circuits.

Temperature Grade:

INDUSTRIAL - Suitable for rugged industrial environments.

Technology:

CMOS - Efficient and reliable technology for decoding operations.

Terminal Form:

GULL WING - Secure terminal connection for stable operation.

Packing Method:

TUBE - Convenient packaging for storage and transportation.

Terminal Pitch:

0.65 mm - Allows for precise terminal spacing.

Maximum Supply Voltage (Vsup):

3.6 V - Can handle higher voltage inputs.

Maximum Power Supply Current (ICC):

0.01 mA - Low power consumption for energy efficiency.

Technical Specifications

Decoder & Drivers SN74LVC138APWG4 attributes and parameters. Explore more Decoder & Drivers devices from Texas Instruments

Specs

Additional Features:

TWO ACTIVE-LOW AND ONE ACTIVE-HIGH ENABLE INPUTS

Family:

LVC/LCX/Z

Input Conditioning:

STANDARD

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Polarity:

INVERTED

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TUBE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Maximum Power Supply Current (ICC):

.01 mA

Propagation Delay At Nominal Supply:

6.7 ns

Propagation Delay (tpd):

22 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Decoder/Drivers

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

4.4 mm

Trade Compliance

SN74LVC138APWG4 Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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