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SN54LS49FK

Texas Instruments

SN54LS49FK by Texas Instruments

SN54LS49FK by Texas Instruments is a TTL decoder with 20 terminals, operating at 5V. It features a propagation delay of 100ns and open-collector output characteristics. Ideal for military-grade applications requiring standard input conditioning and a load capacitance of 15pF.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,199 parts In-Stock

1+ parts

-

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5,199

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Digiode

USA . 4,156 parts In-Stock

1+ parts

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4,156

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 2,108 parts In-Stock

1+ parts

$12.996

100+ parts

-

1k+ parts

$13.488

10k+ parts

-

2,108

$12.996

-

$13.488

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ChromeModa Solutions

Germany . 5,616 parts In-Stock

1+ parts

$14.602

100+ parts

$11.974

1k+ parts

-

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5,616

$14.602

$11.974

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IDEA Electronic Components Group

UK . 1,325 parts In-Stock

1+ parts

$14.602

100+ parts

$13.872

1k+ parts

$13.142

10k+ parts

-

1,325

$14.602

$13.872

$13.142

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AZTECH Wire

Italy . 846 parts In-Stock

1+ parts

$17.938

100+ parts

-

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846

$17.938

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One Stop Electronics

USA . 1,391 parts In-Stock

1+ parts

$35.000

100+ parts

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1,391

$35.000

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Corphita

USA . 3,364 parts In-Stock

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3,364

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DigiPath Technology Company

USA . 74 parts In-Stock

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$13.165

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74

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$13.165

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Overview

Enhance your electronic projects with the high-quality SN54LS49FK by Texas Instruments, a premium manufacturer known for delivering top-notch components. This decoder & driver boasts reliability and efficiency in various applications, offering unparalleled value to customers seeking superior performance. With its cutting-edge technology and trusted brand reputation, the SN54LS49FK provides exceptional benefits and advantages that set it apart from the competition. Upgrade your designs with this versatile chip carrier package and experience seamless operation at a nominal supply voltage of 5V. Choose Texas Instruments for excellence in electronic solutions.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

The ceramic and metal-sealed cofired package body material ensures durability and reliability for long-term use.

Surface Mount: YES

The surface mount capability makes installation and integration of this decoder & driver easier and more convenient.

Propogation Delay (tpd): 100 ns

The low propagation delay of 100 ns ensures quick response and high speed performance.

Temperature Grade: MILITARY

Being military grade ensures that this decoder & driver can withstand harsh environmental conditions with reliability.

Technical Specifications

Decoder & Drivers SN54LS49FK attributes and parameters. Explore more Decoder & Drivers devices from Texas Instruments

Specs

Additional Features:

BLANKING INPUT

Family:

LS

Input Conditioning:

STANDARD

JESD-30 Code:

S-CQCC-N20

Length:

8.89 mm

Load Capacitance (CL):

15 pF

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

OPEN-COLLECTOR

Output Polarity:

TRUE

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

Package Equivalence Code:

LCC20,.35SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

15 mA

Propagation Delay (tpd):

100 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.03 mm

Sub-Category:

Decoder/Drivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

8.89 mm

Trade Compliance

SN54LS49FK Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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