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CD74ACT139M

Texas Instruments

CD74ACT139M by Texas Instruments

CD74ACT139M by Texas Instruments is a decoder & driver with 2 functions, 4 bits, and 16 terminals. It has a propagation delay of 10.5 ns at 5V supply voltage, making it ideal for applications requiring fast signal processing in military-grade environments. With surface mount capability and inverted output polarity, this CMOS technology device is suitable for compact electronic designs.

Median Price

$1.065

Lifecycle Status

Suppliers In-Stock

30

In-Stock Inventory

1k+

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Arrow

USA . 15 parts In-Stock

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$0.147

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$0.143

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$0.147

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Chip1Stop

Japan . 15 parts In-Stock

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$0.839

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$0.839

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Mouser Electronics

USA . 962 parts In-Stock

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$0.970

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$0.749

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$0.748

962

$0.970

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$0.748

Rochester

USA . 11,924 parts In-Stock

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$1.160

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$0.963

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$0.858

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DigiKey

USA . 9,782 parts In-Stock

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Verical

USA . 6,684 parts In-Stock

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Distributors (In-Stock)

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Digiode

USA . 1,087 parts In-Stock

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$0.556

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Nova Conductors

Japan . 15 parts In-Stock

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DigiKey Marketplace

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ACDS - Activité Composants Distribution Service

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Bristol Electronics

USA . 4,480 parts In-Stock

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$1.136

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$0.636

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$0.600

4,480

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$1.136

$0.636

$0.600

Dan-Mar Components

USA . 4,480 parts In-Stock

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Vyrian

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Mentor Electronics Marketing, LLC

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Sunrise Surplus Inc.

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R&J Components

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Inland Empire Components Inc.

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PC Components Company LLC

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480

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Q Components

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Specialty Parts & Electronic Components, Inc. (S.P.E.C.)

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Elcom Components

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Inventory MP

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CirComp Electronics, Inc.

USA . 187 parts In-Stock

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LWI Electronics Inc

India . 128 parts In-Stock

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Prism Electronics

USA . 76 parts In-Stock

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Cogito LLC

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ComSIT Distribution GmbH

Germany . 62 parts In-Stock

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A2Z Electronics, Inc.

USA . 40 parts In-Stock

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Mil-Aero Solutions, Inc.

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Resion

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Distributors (Availability)

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Ampacity Inc.

Singapore . 3,290 parts In-Stock

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$0.497

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Semicontronic

India . 3,251 parts In-Stock

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$0.497

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$0.485

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$0.482

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Corphita

USA . 4,895 parts In-Stock

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$0.526

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Aranea Global

USA . 2,000 parts In-Stock

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$0.614

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$0.590

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$0.614

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Argo Parts USA

USA . 2,092 parts In-Stock

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$0.627

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$0.608

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Continental Prestige Electronics

USA . 1,780 parts In-Stock

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$0.627

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$0.614

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Component Stockers USA

USA . 833 parts In-Stock

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$1.460

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$1.060

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$0.610

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$0.610

833

$1.460

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$0.610

$0.610

Microchip USA

USA . 109 parts In-Stock

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$2.665

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Corohmni

South Africa . 303 parts In-Stock

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$12.393

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Parana Technologies

USA . 1,534 parts In-Stock

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$27.360

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$34.970

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DigiPath Technology Company

USA . 296 parts In-Stock

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$30.127

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$27.717

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ChromeModa Solutions

Germany . 6,965 parts In-Stock

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$30.742

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$25.208

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IDEA Electronic Components Group

UK . 1,578 parts In-Stock

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$30.742

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$29.205

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$27.668

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QUARKTWIN TECHNOLOGY LTD

USA . 18,049 parts In-Stock

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Perfect Parts

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Authorized Procurement Solutions

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Glotronic Ltd.

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Metaverse IC Inc.

Canada . 2,500 parts In-Stock

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Supply Digital

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Overview

Unlock the power of precision with the CD74ACT139M by Texas Instruments, a top-tier manufacturer renowned for quality and innovation. This versatile decoder and driver component is a game-changer in electronic applications, offering unrivaled performance and reliability. Experience seamless operation and enhanced efficiency with its advanced technology, making it an indispensable tool for your projects. Elevate your designs with the CD74ACT139M and discover a world of possibilities at your fingertips.

Feature Benefit Bullets

Package Body Material:

PLASTIC/EPOXY - This material offers good protection and durability for the product.

Propagation Delay At Nominal Supply:

10.5 ns - This low delay ensures fast and efficient operation.

Surface Mount:

YES - Allows for easy and convenient installation on circuit boards.

Input Conditioning:

STANDARD - Ensures compatibility with different input signal types.

No. of Functions:

2 - Provides versatility and flexibility in application.

Package Shape:

RECTANGULAR - Helps in saving space and efficient layout on PCBs.

No. of Bits:

4 - Offers multiple input options for data processing.

Nominal Supply Voltage / Vsup (V):

5 - Common and easily available supply voltage for powering the device.

Load Capacitance (CL):

50 pF - Helps in stabilizing and filtering the output signals.

Power Supplies (V):

5 - Indicates the power supply requirements for the product.

No. of Terminals:

16 - Sufficient terminals for connecting multiple components.

Package Style (Meter):

SMALL OUTLINE - Compact design for space-saving applications.

Maximum I (ol):

24 Amp - Can handle high output currents without risk of damage.

Propagation Delay (tpd):

11.5 ns - Ensures quick response time for data processing.

Maximum Operating Temperature:

125 °C - Suitable for operation in a wide range of environments.

Minimum Operating Temperature:

55 °C - Can withstand low temperature conditions.

Terminal Finish:

NICKEL PALLADIUM GOLD - Provides good conductivity and protection against corrosion.

Terminal Position:

DUAL - Offers flexibility in mounting and connecting the device.

Maximum Seated Height:

1.75 mm - Low profile design for compact installations.

Width:

3.9 mm - Compact width for efficient PCB layout.

Output Polarity:

INVERTED - Allows for different logic levels in the output signals.

Minimum Supply Voltage (Vsup):

4.5 V - Indicates the minimum voltage required to operate the device.

Maximum Time At Peak Reflow Temperature (s):

30 - Ensures stable performance during reflow processes.

Peak Reflow Temperature °C:

260 - Can withstand high-temperature soldering processes.

Length:

9.9 mm - Compact length for space-saving designs.

Temperature Grade:

MILITARY - Suitable for use in demanding military applications.

Technology:

CMOS - Offers low power consumption and high noise immunity.

Terminal Form:

GULL WING - Easy to solder and ensures secure connections.

Packing Method:

TUBE - Convenient packaging for storage and transportation.

Terminal Pitch:

1.27 mm - Standard pitch for easy connection with other components.

Maximum Supply Voltage (Vsup):

5.5 V - Indicates the maximum voltage limit for safe operation.

Maximum Power Supply Current (ICC):

0.16 mA - Low power consumption for energy-efficient operation.

Technical Specifications

Decoder & Drivers CD74ACT139M attributes and parameters. Explore more Decoder & Drivers devices from Texas Instruments

Specs

Additional Features:

2 ENABLE INPUTS

Family:

ACT

Input Conditioning:

STANDARD

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

9.9 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

4

No. of Functions:

2

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

INVERTED

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TUBE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

.16 mA

Propagation Delay At Nominal Supply:

10.5 ns

Propagation Delay (tpd):

11.5 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Decoder/Drivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

CD74ACT139M Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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