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MC14511BCPG

Onsemi

MC14511BCPG by Onsemi

MC14511BCPG by Onsemi is a CMOS Decoder & Drivers with 16 terminals. It operates b/w -55 to 125 °C and has a supply voltage range of 3-18 V. With latched input conditioning, it offers a propagation delay of 1440 ns, making it suitable for military-grade applications.

Median Price

$0.341

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 10 parts In-Stock

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$0.341

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10

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Euro-Tech

UK . 2,125 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 875 parts In-Stock

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875

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Holdelec - ElecDif-Pro

France . 875 parts In-Stock

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875

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Component Sense

UK . 400 parts In-Stock

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400

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Zilex Electronics Inc.

Canada . 311 parts In-Stock

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Vyrian

USA . 229 parts In-Stock

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Digiode

USA . 163 parts In-Stock

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LIBRA Elektronik GmbH

Germany . 120 parts In-Stock

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Cyclops Electronics Ltd

UK . 45 parts In-Stock

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J2 Sourcing AB

Sweden . 2 parts In-Stock

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Distributors (Availability)

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Benley Electronics

USA . 49 parts In-Stock

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$0.300

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Continental Prestige Electronics

USA . 2,839 parts In-Stock

1+ parts

$0.341

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$0.334

2,839

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Argo Parts USA

USA . 2,593 parts In-Stock

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$0.341

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$0.331

2,593

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Netroflash

USA . 1,000 parts In-Stock

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$0.341

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$0.324

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$0.317

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$0.341

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$0.317

AZTECH Wire

Italy . 229 parts In-Stock

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$14.686

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Semicontronic

India . 1,602 parts In-Stock

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$27.000

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$26.325

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$26.190

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Aztec Data Supply Inc.

USA . 6,337 parts In-Stock

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$28.830

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Ampacity Inc.

Singapore . 1,048 parts In-Stock

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Kepictronics

USA . 17,147 parts In-Stock

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Problanco Electronics

Mexico . 8,174 parts In-Stock

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SupplyDigital Components

Austria . 5,543 parts In-Stock

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Kulean Microsystems

USA . 5,287 parts In-Stock

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TANS Electronics

Latvia . 3,717 parts In-Stock

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Corphita

USA . 1,682 parts In-Stock

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Corohmni

South Africa . 490 parts In-Stock

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Microchip USA

USA . 390 parts In-Stock

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UHIMA Technologies

Türkiye . 379 parts In-Stock

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Overview

Enhance your electronic designs with the MC14511BCPG from Onsemi, a top-tier manufacturer known for quality and reliability. This decoder & driver device offers unparalleled performance and versatility, making it perfect for a wide range of applications. With its latched input conditioning and true output polarity, this product ensures efficient operation and seamless integration into your projects. Trust Onsemi to deliver cutting-edge technology that exceeds expectations, providing you with the value and benefits you need to succeed in today's competitive market. Experience the difference with the MC14511BCPG and unlock endless possibilities for your next innovation.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and resistance to environmental factors, making the product suitable for various applications.

Input Conditioning: LATCHED

Ensures that the input signals are stable and reliable, leading to accurate decoding and driving of outputs.

Nominal Supply Voltage / Vsup (V): 5

Operates at a standard voltage level, compatible with many systems and circuits.

Propagation Delay (tpd): 1440 ns

Offers fast response time, ideal for applications requiring quick decoding and driving of signals.

Maximum Operating Temperature: 125 °C

Can withstand high temperatures, suitable for environments where heat resistance is required.

Technology: CMOS

Utilizes CMOS technology which provides low power consumption and high noise immunity, making the product efficient and reliable.

Technical Specifications

Decoder & Drivers MC14511BCPG attributes and parameters. Explore more Decoder & Drivers devices from Onsemi

Specs

Family:

CMOS

Input Conditioning:

LATCHED

JESD-30 Code:

R-PDIP-T16

JESD-609 Code:

e3

Length:

19.175 mm

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

260

Propagation Delay (tpd):

1440 ns

Qualification:

Not Qualified

Maximum Seated Height:

4.44 mm

Maximum Supply Voltage (Vsup):

18 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin (Sn)

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

MC14511BCPG Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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