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MC14555BD

Onsemi

MC14555BD by Onsemi

MC14555BD by Onsemi is a CMOS Decoder & Driver with 440ns propagation delay, 2 functions, and 16 terminals. It operates at supply voltages of 5/15V and has a load capacitance of 50pF. Ideal for military-grade applications requiring true output polarity control in compact designs.

Median Price

$0.211

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Rochester

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$0.211

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$0.175

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$0.156

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Farnell

UK . 1,169 parts In-Stock

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Nova Conductors

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Digiode

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Vyrian

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Right Parts Inc.

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ABC Electronics Ltd.

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PC Components Company LLC

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Argo Parts USA

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Bastille Electronics

Australia . 200 parts In-Stock

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Corphita

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Corohmni

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Ampacity Inc.

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$0.310

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Aztec Data Supply Inc.

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Component Stockers USA

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Overview

Discover the power of the MC14555BD by Onsemi, a top-quality Decoder & Driver that delivers unparalleled performance and reliability. Onsemi is known for their cutting-edge technology and commitment to excellence, making this product a standout in its category. With fast propagation delay and true output polarity, this decoder offers seamless functionality for various applications. Experience the value and benefits of this product, from its compact design to its wide operating temperature range. Trust Onsemi to provide you with superior solutions for your decoding needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protection for the internal components of the decoder & driver, ensuring a longer lifespan.

Propagation Delay At Nominal Supply: 440 ns

Fast propagation delay ensures quick response times, making this decoder & driver suitable for high-speed applications.

Surface Mount: YES

Surface mount capability allows for easy and secure installation on circuit boards, saving space and simplifying assembly processes.

Input Conditioning: STANDARD

Standard input conditioning ensures compatibility with a wide range of signal inputs, making this decoder & driver versatile and easy to integrate into existing systems.

No. of Functions: 2

Two functions in one device provide flexibility and efficiency in circuit design, reducing the need for multiple components.

Nominal Supply Voltage / Vsup (V): 5

Operates at a standard 5V supply voltage, making it compatible with many common power sources.

Load Capacitance (CL): 50 pF

Suitable for driving loads with capacitance of up to 50 pF, making it suitable for a variety of applications.

Power Supplies (V): 5/15

Can be powered by either 5V or 15V supplies, offering flexibility in power source options.

No. of Terminals: 16

16 terminals provide ample connectivity options for interfacing with other components and systems.

Package Style (Meter): SMALL OUTLINE

Small outline package style saves space on the circuit board, ideal for compact designs.

Maximum I (ol): 0.64 Amp

High output current capability of 0.64 Amp allows for driving a variety of loads without the need for external amplification.

Maximum Operating Temperature: 125 °C

High maximum operating temperature of 125°C ensures reliable performance even in harsh environmental conditions.

Minimum Operating Temperature: -55 °C

Low minimum operating temperature of -55°C allows for operation in a wide range of temperature conditions.

Terminal Finish: TIN LEAD

Tin lead terminal finish provides good solderability and ensures a reliable electrical connection.

Terminal Position: DUAL

Dual terminal position provides flexibility in mounting options, allowing for versatile installation.

Maximum Seated Height: 1.75 mm

Low profile with a maximum seated height of 1.75 mm saves space in compact designs.

Width: 3.9 mm

Compact width of 3.9 mm allows for dense packing on the circuit board.

Output Polarity: TRUE

True output polarity ensures compatibility with standard signal conventions, simplifying integration into existing systems.

Minimum Supply Voltage (Vsup): 3 V

Low minimum supply voltage of 3V allows for operation in low-power applications.

Peak Reflow Temperature °C: 235

High peak reflow temperature of 235°C ensures reliable soldering during assembly processes.

Length: 9.9 mm

Compact length of 9.9 mm saves space on the circuit board, ideal for miniaturized designs.

Temperature Grade: MILITARY

Military-grade temperature specifications ensure reliable performance in extreme conditions, making this decoder & driver suitable for rugged applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making this decoder & driver energy-efficient and reliable in noisy environments.

Terminal Form: GULL WING

Gull wing terminal form provides secure mechanical connection for reliable operation.

Terminal Pitch: 1.27 mm

Compact terminal pitch of 1.27 mm allows for high-density mounting on the circuit board.

Maximum Supply Voltage (Vsup): 18 V

High maximum supply voltage of 18V allows for compatibility with a wide range of power sources.

Technical Specifications

Decoder & Drivers MC14555BD attributes and parameters. Explore more Decoder & Drivers devices from Onsemi

Specs

Family:

4000/14000/40000

Input Conditioning:

STANDARD

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e0

Length:

9.9 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

.64 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

2

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

235

Power Supplies (V):

5/15

Propagation Delay At Nominal Supply:

440 ns

Propagation Delay (tpd):

440 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Decoder/Drivers

Maximum Supply Voltage (Vsup):

18 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

3.9 mm

Trade Compliance

MC14555BD Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-407-7435, 5962014077435

NIIN

014077435

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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