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SN74LS139ANSR

Texas Instruments

SN74LS139ANSR by Texas Instruments

SN74LS139ANSR by Texas Instruments is a TTL technology decoder & driver with 2 functions, 4 bits, and inverted output polarity. It has a propagation delay of 33 ns at 5V supply voltage, suitable for applications requiring fast response times in commercial temperature environments. This small outline package with surface mount capability is ideal for compact electronic designs.

Median Price

$1.060

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 1,925 parts In-Stock

1+ parts

$1.060

100+ parts

$0.611

1k+ parts

$0.551

10k+ parts

$0.486

1,925

$1.060

$0.611

$0.551

$0.486

Mouser Electronics

USA . 344 parts In-Stock

1+ parts

$1.060

100+ parts

$0.611

1k+ parts

$0.551

10k+ parts

$0.498

344

$1.060

$0.611

$0.551

$0.498

Arrow

USA . 2,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.334

2,000

-

-

-

$0.334

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 100 parts In-Stock

1+ parts

$0.325

100+ parts

-

1k+ parts

-

10k+ parts

-

100

$0.325

-

-

-

Digiode

USA . 2,898 parts In-Stock

1+ parts

$0.770

100+ parts

-

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2,898

$0.770

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Vyrian

USA . 1,286 parts In-Stock

1+ parts

-

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1,286

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-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 1,060 parts In-Stock

1+ parts

$0.263

100+ parts

-

1k+ parts

-

10k+ parts

-

1,060

$0.263

-

-

-

Aranea Global

USA . 2,000 parts In-Stock

1+ parts

$0.318

100+ parts

-

1k+ parts

$0.306

10k+ parts

-

2,000

$0.318

-

$0.306

-

Argo Parts USA

USA . 3,854 parts In-Stock

1+ parts

$0.325

100+ parts

-

1k+ parts

-

10k+ parts

$0.315

3,854

$0.325

-

-

$0.315

Continental Prestige Electronics

USA . 1,102 parts In-Stock

1+ parts

$0.325

100+ parts

-

1k+ parts

-

10k+ parts

$0.318

1,102

$0.325

-

-

$0.318

Corphita

USA . 2,205 parts In-Stock

1+ parts

$0.729

100+ parts

-

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2,205

$0.729

-

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Microchip USA

USA . 1,901 parts In-Stock

1+ parts

$2.445

100+ parts

-

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1,901

$2.445

-

-

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Corohmni

South Africa . 104 parts In-Stock

1+ parts

$18.040

100+ parts

-

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10k+ parts

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104

$18.040

-

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Parana Technologies

USA . 1,826 parts In-Stock

1+ parts

$23.704

100+ parts

$2,201.300

1k+ parts

$21.334

10k+ parts

-

1,826

$23.704

$2,201.300

$21.334

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DigiPath Technology Company

USA . 1,807 parts In-Stock

1+ parts

$26.101

100+ parts

$24.013

1k+ parts

-

10k+ parts

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1,807

$26.101

$24.013

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ChromeModa Solutions

Germany . 5,599 parts In-Stock

1+ parts

$26.634

100+ parts

$21.840

1k+ parts

-

10k+ parts

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5,599

$26.634

$21.840

-

-

IDEA Electronic Components Group

UK . 896 parts In-Stock

1+ parts

$26.634

100+ parts

$25.302

1k+ parts

$23.971

10k+ parts

-

896

$26.634

$25.302

$23.971

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Perfect Parts

USA . 10,647 parts In-Stock

1+ parts

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100+ parts

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10,647

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Kepictronics

USA . 135 parts In-Stock

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135

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Overview

Enhance your electronic projects with the high-quality SN74LS139ANSR by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments ensures superior performance and reliability. This versatile decoder & driver is perfect for a wide range of applications, offering customers value and efficiency. With its innovative design and advanced technology, this product provides countless benefits and advantages for your projects. Upgrade your electronics with the SN74LS139ANSR and experience the difference today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used for the package body provides durability and protection for the internal components of the decoder and drivers.

Propagation Delay At Nominal Supply: 33 ns

The low propagation delay ensures fast signal processing, making this product ideal for applications that require quick response times.

Surface Mount: YES

Being surface mountable allows for easy integration onto circuit boards, saving space and simplifying assembly processes.

Input Conditioning: STANDARD

Standard input conditioning ensures compatibility with a wide range of input signals, enhancing the versatility of this product.

No. of Functions: 2

Having two functions in one device increases functionality and efficiency in circuit design.

Package Shape: RECTANGULAR

The rectangular package shape provides a standardized form factor for easy integration into existing circuit layouts.

No. of Bits: 4

With 4 bits, this decoder and driver can handle a range of inputs and outputs, making it suitable for various applications.

Nominal Supply Voltage / Vsup (V): 5

Operating at a nominal 5V supply voltage makes this product compatible with standard power sources, ensuring widespread usability.

Load Capacitance (CL): 15 pF

The low load capacitance helps minimize signal distortion and interference, resulting in more accurate signal processing.

Power Supplies (V): 5

Operating at 5V power supplies simplifies power management and compatibility considerations in circuit design.

No. of Terminals: 16

Having 16 terminals provides ample connectivity options for interfacing with other components in a circuit.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space, making it suitable for compact electronic devices and PCB designs.

Maximum I (ol): 8 Amp

The high maximum output current of 8A allows for driving power-hungry devices or loads with ease.

Propagation Delay (tpd): 38 ns

The low propagation delay ensures minimal delays in signal transmission, improving overall system performance.

Maximum Operating Temperature: 70 °C

The wide maximum operating temperature range of 0-70°C makes this product suitable for use in various environmental conditions.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature of 0°C ensures reliable operation even in colder environments.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The terminal finish of nickel/palladium/gold provides good electrical conductivity and corrosion resistance for long-term reliability.

Terminal Position: DUAL

The dual terminal position offers flexibility in mounting options and facilitates easy connection to external components.

Maximum Seated Height: 2 mm

The low maximum seated height allows for slim and compact device designs.

Width: 5.3 mm

The narrow width of 5.3mm enables space-saving integration on PCBs with constrained dimensions.

Output Polarity: INVERTED

Having inverted output polarity can be advantageous in certain circuit configurations where complementary signals are required.

Minimum Supply Voltage (Vsup): 4.75 V

The low minimum supply voltage requirement of 4.75V ensures compatibility with a wide range of power sources.

Peak Reflow Temperature °C: 260

The high peak reflow temperature of 260°C allows for reliable soldering during assembly processes.

Length: 10.2 mm

The compact length of 10.2mm facilitates space-efficient placement on PCBs.

Temperature Grade: COMMERCIAL

Being rated for commercial temperature grades ensures reliability and performance in standard operating conditions.

Technology: TTL

Using TTL technology provides high-speed operation and compatibility with other TTL components in the circuit.

Terminal Form: GULL WING

The gull wing terminal form is suitable for surface mount assembly, offering secure solder joints and mechanical stability.

Packing Method: TR

The tape and reel packing method simplifies storage, handling, and automated assembly of multiple units.

Terminal Pitch: 1.27 mm

The standard terminal pitch of 1.27mm allows for easy PCB layout and compatibility with common soldering equipment.

Maximum Supply Voltage (Vsup): 5.25 V

The maximum supply voltage of 5.25V ensures safe operation within specified limits, protecting the device from overvoltage conditions.

Maximum Power Supply Current (ICC): 11 mA

The low maximum power supply current of 11mA minimizes power consumption and heat generation, enhancing energy efficiency.

Technical Specifications

Decoder & Drivers SN74LS139ANSR attributes and parameters. Explore more Decoder & Drivers devices from Texas Instruments

Specs

Additional Features:

SCHOTTKY CLAMPED FOR HIGH PERFORMANCE

Family:

LS

Input Conditioning:

STANDARD

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

10.2 mm

Load Capacitance (CL):

15 pF

Logic IC Type:

Maximum I (ol):

8 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

4

No. of Functions:

2

No. of Terminals:

16

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Output Polarity:

INVERTED

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

11 mA

Propagation Delay At Nominal Supply:

33 ns

Propagation Delay (tpd):

38 ns

Qualification:

Not Qualified

Maximum Seated Height:

2 mm

Sub-Category:

Decoder/Drivers

Maximum Supply Voltage (Vsup):

5.25 V

Minimum Supply Voltage (Vsup):

4.75 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

5.3 mm

Trade Compliance

SN74LS139ANSR Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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