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MC74HC139ADR2G

Onsemi

MC74HC139ADR2G by Onsemi

MC74HC139ADR2G by Onsemi is a CMOS decoder with 35ns propagation delay, 16 terminals, and 175ns tpd. It operates b/w -55 to 125 °C and has inverted output polarity. Ideal for military applications due to its small outline package and dual terminal position.

Median Price

$0.204

Lifecycle Status

Suppliers In-Stock

22

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1k+

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Mouser Electronics

USA . 5,157 parts In-Stock

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DigiKey

USA . 4,250 parts In-Stock

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Rochester

USA . 143,981 parts In-Stock

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Verical

USA . 75,253 parts In-Stock

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Avnet

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Chip1Stop

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Arrow

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EBV Elektronik

Germany . 5,000 parts In-Stock

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Element14

Singapore . 2,770 parts In-Stock

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Farnell

UK . 2,505 parts In-Stock

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Digiode

USA . 1,235 parts In-Stock

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Nova Conductors

Japan . 65 parts In-Stock

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Vyrian

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NAC Semi

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IBS Electronics

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Sea View Technologies

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Bristol Electronics

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Chip Stock

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Cyclops Electronics Ltd

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ACDS - Activité Composants Distribution Service

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Connect4Technologies Inc.

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Corohmni

South Africa . 286 parts In-Stock

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Corphita

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Argo Parts USA

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Semicontronic

India . 27,864 parts In-Stock

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Aztec Data Supply Inc.

USA . 2,751 parts In-Stock

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Continental Prestige Electronics

USA . 142,474 parts In-Stock

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RC Electronics

USA . 91,672 parts In-Stock

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Perfect Parts

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Lixinc

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QUARKTWIN TECHNOLOGY LTD

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SupplyDigital Components

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GreenTree Electronics

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TANS Electronics

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Metaverse IC Inc.

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iodParts Technologies Inc.

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Cyclops Electronics Ltd (Excess)

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UHIMA Technologies

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Netroflash

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Speed Components Ltd (Excess)

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Overview

Experience high-quality performance and reliability with the MC74HC139ADR2G by Onsemi. As a leading manufacturer in the industry, Onsemi brings you a top-notch Decoder & Drivers product that offers exceptional value and benefits. With fast propagation delay and inverted output polarity, this product is perfect for a wide range of applications. Trust Onsemi's reputation for excellence and choose the MC74HC139ADR2G for all your decoding and driving needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and reliability of the product.

Propagation Delay At Nominal Supply: 35 ns

Low propagation delay ensures fast response time, making it suitable for time-sensitive applications.

Surface Mount: YES

Surface mount capability makes installation and assembly easier and more efficient.

Nominal Supply Voltage / Vsup (V): 5

Operates at a standard nominal supply voltage, making it compatible with common power sources.

Maximum Operating Temperature: 125 °C

High operating temperature range allows for reliable performance in various environmental conditions.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing the overall efficiency of the product.

Technical Specifications

Decoder & Drivers MC74HC139ADR2G attributes and parameters. Explore more Decoder & Drivers devices from Onsemi

Specs

Family:

HC/UH

Input Conditioning:

STANDARD

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e3

Length:

9.9 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

4 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

2

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

INVERTED

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/6

Propagation Delay At Nominal Supply:

35 ns

Propagation Delay (tpd):

175 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Decoder/Drivers

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

MC74HC139ADR2G Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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