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CD74HC238M96G4

Texas Instruments

CD74HC238M96G4 by Texas Instruments

CD74HC238M96G4 by Texas Instruments is a 16-terminal decoder with a propagation delay of 45ns at 4.5V, suitable for military-grade applications. It features a max operating temperature of 125°C, surface mount capability, and a load capacitance of 50pF.

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3

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1k+

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Vyrian

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AZTECH Wire

Italy . 871 parts In-Stock

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Corohmni

South Africa . 877 parts In-Stock

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One Stop Electronics

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Parana Technologies

USA . 1,106 parts In-Stock

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DigiPath Technology Company

USA . 27 parts In-Stock

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Semicontronic

India . 1,165 parts In-Stock

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ChromeModa Solutions

Germany . 2,509 parts In-Stock

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IDEA Electronic Components Group

UK . 480 parts In-Stock

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Ampacity Inc.

Singapore . 1,573 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

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Continental Prestige Electronics

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Glotronic Ltd.

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Argo Parts USA

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Overview

Elevate your electronic designs with the CD74HC238M96G4 by Texas Instruments, a top-tier manufacturer known for quality and reliability. This Decoder & Drivers category product offers fast propagation delay, true output polarity, and a wide operating temperature range, making it ideal for a variety of applications. With a compact package style and standard input conditioning, this decoder provides exceptional value and performance to customers looking to enhance their projects with precision and efficiency. Trust Texas Instruments to deliver cutting-edge solutions that exceed expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material ensures durability and reliability of the product.

Propagation Delay At Nominal Supply: 45 ns

Low propagation delay ensures fast response time in decoding and driving operations.

Surface Mount: YES

Surface mount capability makes installation easy and saves space on the PCB.

Nominal Supply Voltage / Vsup (V): 4.5

Compatible with a common supply voltage for ease of integration in various circuits.

Maximum Operating Temperature: 125 °C

Wide operating temperature range makes this product suitable for a variety of environments.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity.

Technical Specifications

Decoder & Drivers CD74HC238M96G4 attributes and parameters. Explore more Decoder & Drivers devices from Texas Instruments

Specs

Additional Features:

TWO ACTIVE LOW AND ONE ACTIVE HIGH ENABLE INPUTS

Family:

HC/UH

Input Conditioning:

STANDARD

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

9.9 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

4 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/6

Propagation Delay At Nominal Supply:

45 ns

Propagation Delay (tpd):

225 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Decoder/Drivers

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

4.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

CD74HC238M96G4 Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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