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MC74HC138ANG

Onsemi

MC74HC138ANG by Onsemi

MC74HC138ANG by Onsemi is a CMOS Decoder & Driver with 16 terminals. It operates at 5V, has a propagation delay of 41ns, and can handle load capacitance of 50pF. Ideal for military-grade applications due to its inverted output polarity and standard input conditioning.

Median Price

$13.610

Lifecycle Status

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11

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1k+

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Nova Conductors

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Vyrian

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ACDS - Activité Composants Distribution Service

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Flip Electronics

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Lantek

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QIE Inc.

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Sensible Micro Corp

USA . 16 parts In-Stock

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$26.930

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Bristol Electronics

USA . 16 parts In-Stock

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PC Components Company LLC

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Argo Parts USA

USA . 2,947 parts In-Stock

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$0.281

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Netroflash

USA . 100 parts In-Stock

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Continental Prestige Electronics

USA . 44 parts In-Stock

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AZTECH Wire

Italy . 625 parts In-Stock

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$13.756

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Advanced Electronics

New Zealand . 1,000 parts In-Stock

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Corohmni

South Africa . 304 parts In-Stock

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Aztec Data Supply Inc.

USA . 2,746 parts In-Stock

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Ampacity Inc.

Singapore . 131 parts In-Stock

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Semicontronic

India . 618 parts In-Stock

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SupplyDigital Components

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Kulean Microsystems

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Perfect Parts

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Robosynatics

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Lucentia Tech

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Kepictronics

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UHIMA Technologies

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Glotronic Ltd.

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GreenTree Electronics

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Microchip USA

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Overview

Unlock the power of efficient data processing with the MC74HC138ANG decoder & driver by Onsemi. Crafted with precision and reliability in mind, this high-quality product boasts quick propagation delay and inverted output polarity, making it ideal for a wide range of applications. From industrial automation to consumer electronics, this versatile component offers unparalleled value and performance, ensuring seamless operation and optimal results for all customers. Trust Onsemi for top-notch technology that delivers on both quality and innovation.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the decoder, ensuring a longer lifespan.

Propagation Delay At Nominal Supply: 41 ns

Offers fast response times for decoding signals, making it suitable for quick data processing applications.

Nominal Supply Voltage / Vsup (V): 5

Standard voltage requirement makes it compatible with common power sources, easy to integrate into existing systems.

Maximum Operating Temperature: 125 °C

Can operate in high temperature environments without risk of overheating, suitable for industrial applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, improving the efficiency and reliability of the decoder.

Technical Specifications

Decoder & Drivers MC74HC138ANG attributes and parameters. Explore more Decoder & Drivers devices from Onsemi

Specs

Family:

HC/UH

Input Conditioning:

STANDARD

JESD-30 Code:

R-PDIP-T16

JESD-609 Code:

e3

Length:

19.175 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

4 Amp

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

INVERTED

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Packing Method:

RAIL

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/6

Propagation Delay At Nominal Supply:

41 ns

Propagation Delay (tpd):

205 ns

Qualification:

Not Qualified

Maximum Seated Height:

4.44 mm

Sub-Category:

Decoder/Drivers

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin (Sn)

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

MC74HC138ANG Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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