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MC74HC138ADR2G

Onsemi

MC74HC138ADR2G by Onsemi

MC74HC138ADR2G by Onsemi is a CMOS decoder with 41ns propagation delay, 205ns tpd, and inverted output polarity. It operates at -55 to 125 °C and has a load capacitance of 50pF. Ideal for military-grade applications requiring fast signal decoding in compact spaces.

Median Price

$0.284

Lifecycle Status

Suppliers In-Stock

38

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1k+

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Mouser Electronics

USA . 10,019 parts In-Stock

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$0.340

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$0.168

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10,019

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$0.200

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$0.141

DigiKey

USA . 11,501 parts In-Stock

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$0.370

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$0.199

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$0.168

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$0.155

Newark

USA . 414 parts In-Stock

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Adafruit Industries

USA . 17 parts In-Stock

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Rochester

USA . 1,086,410 parts In-Stock

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Verical

USA . 645,162 parts In-Stock

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EBV Elektronik

Germany . 482,500 parts In-Stock

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Arrow

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Future Electronics

Canada . 20,000 parts In-Stock

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Avnet

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Master Electronics

USA . 9,750 parts In-Stock

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Farnell

UK . 2,757 parts In-Stock

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Element14

Singapore . 2,757 parts In-Stock

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Chip1Stop

Japan . 142 parts In-Stock

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Digiode

USA . 624 parts In-Stock

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TME

Poland . 2,613 parts In-Stock

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Nova Conductors

Japan . 450 parts In-Stock

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IBS Electronics

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Vyrian

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NAC Semi

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Chip Stock

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Bristol Electronics

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North Shore Components

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Connector Distribution Corp

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Inventory MP

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Component Sense

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PC Components Company LLC

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Ampacity Inc.

Singapore . 138,097 parts In-Stock

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Semicontronic

India . 138,047 parts In-Stock

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Corphita

USA . 691 parts In-Stock

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Corohmni

South Africa . 290 parts In-Stock

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Argo Parts USA

USA . 3,727 parts In-Stock

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Netroflash

USA . 500 parts In-Stock

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Aztec Data Supply Inc.

USA . 300 parts In-Stock

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Advanced Electronics

New Zealand . 17 parts In-Stock

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Continental Prestige Electronics

USA . 1,082,706 parts In-Stock

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Perfect Parts

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USA . 52,965 parts In-Stock

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Infinite Electronics LLP (Excess)

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QUARKTWIN TECHNOLOGY LTD

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Metaverse IC Inc.

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Authorized Procurement Solutions

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ChipstoGo Electronic ltd

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Denmark . 4,238 parts In-Stock

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SupplyDigital Components

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Kulean Microsystems

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A-Z Elektronik GmbH

Germany . 2,327 parts In-Stock

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Kepictronics

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iodParts Technologies Inc.

India . 1,539 parts In-Stock

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Futuretech Components

Singapore . 991 parts In-Stock

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UHIMA Technologies

Türkiye . 185 parts In-Stock

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Overview

Unlock the potential of your electronic projects with the MC74HC138ADR2G by Onsemi. Known for its exceptional quality and reliability, Onsemi is a trusted manufacturer in the industry. The MC74HC138ADR2G falls under the Decoder & Drivers category, offering versatility and efficiency in various applications. With a nominal supply voltage of 5V and fast propagation delay, this product ensures seamless performance. Experience the value and benefits of this decoder with inverted output polarity, making it a must-have for your projects. Elevate your designs with the MC74HC138ADR2G from Onsemi today!

Feature Benefit Bullets

Package Body Material:

PLASTIC/EPOXY - Provides durability and ensures reliable performance.

Propagation Delay At Nominal Supply:

41 ns - Offers fast signal processing for efficient operation.

Surface Mount:

YES - Allows for easy installation and space-saving design.

Input Conditioning:

STANDARD - Ensures compatibility with a wide range of input signals.

No. of Functions:

1 - Simplifies circuit design and enhances overall functionality.

Package Shape:

RECTANGULAR - Enables versatile placement options in various applications.

Nominal Supply Voltage / Vsup (V):

5 - Ideal for standard voltage requirements in most systems.

Load Capacitance (CL):

50 pF - Helps in maintaining stable performance under varying load conditions.

Power Supplies (V):

2/6 - Compatible with multiple power supply configurations.

No. of Terminals:

16 - Provides ample connection options for different circuit configurations.

Technical Specifications

Decoder & Drivers MC74HC138ADR2G attributes and parameters. Explore more Decoder & Drivers devices from Onsemi

Specs

Family:

HC/UH

Input Conditioning:

STANDARD

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e3

Length:

9.9 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

4 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

INVERTED

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/6

Propagation Delay At Nominal Supply:

41 ns

Propagation Delay (tpd):

205 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Decoder/Drivers

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

MC74HC138ADR2G Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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