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SN74LS145DRG4

Texas Instruments

SN74LS145DRG4 by Texas Instruments

SN74LS145DRG4 by Texas Instruments is a TTL decoder & driver with 16 terminals. It operates at a nominal voltage of 5V and has a propagation delay of 50ns. This small outline package is commonly used in applications requiring inverted output polarity and open-collector output characteristics.

Median Price

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Lifecycle Status

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3

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1k+

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Vyrian

USA . 5,113 parts In-Stock

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Digiode

USA . 2,623 parts In-Stock

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Nova Conductors

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One Stop Electronics

USA . 527 parts In-Stock

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$6.000

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527

$6.000

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AZTECH Wire

Italy . 657 parts In-Stock

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$14.223

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Parana Technologies

USA . 1,636 parts In-Stock

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$24.934

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$25.630

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DigiPath Technology Company

USA . 52 parts In-Stock

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$27.456

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$25.259

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ChromeModa Solutions

Germany . 1,650 parts In-Stock

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$28.016

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$22.973

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$28.016

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IDEA Electronic Components Group

UK . 608 parts In-Stock

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$28.016

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$26.615

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$25.214

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Ampacity Inc.

Singapore . 527 parts In-Stock

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Continental Prestige Electronics

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Argo Parts USA

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Overview

Discover the SN74LS145DRG4 by Texas Instruments, a high-quality decoder and driver that offers numerous advantages. With its plastic/epoxy body and small outline package style, this product delivers reliable performance in various applications. Its standard input conditioning and inverted output polarity ensure seamless integration into your designs. The SN74LS145DRG4 operates at a nominal supply voltage of 5V and has a maximum propagation delay of 50ns, guaranteeing speedy and efficient decoding. Trust Texas Instruments for innovative solutions that provide exceptional value and benefits to customers.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used for the package body provides durability and resistance, making it suitable for various environments.

Surface Mount: YES

With surface mount capability, this product can easily be integrated into circuit boards, saving space and facilitating efficient assembly.

Input Conditioning: STANDARD

The standard input conditioning ensures compatibility with a wide range of input signals, making it versatile and adaptable to different applications.

Package Shape: RECTANGULAR

The rectangular package shape allows for efficient utilization of space and easy placement within a circuit design.

Nominal Supply Voltage / Vsup (V): 5

The nominal supply voltage of 5V provides a stable power source for the decoder and drivers, ensuring reliable and consistent performance.

Load Capacitance (CL): 45 pF

With a load capacitance of 45 pF, this product is capable of driving capacitive loads without compromising signal integrity.

Power Supplies (V): 5

The 5V power supply capability allows for compatibility with standard power sources, making it suitable for a wide range of applications.

No. of Terminals: 16

The 16 terminals provide sufficient connectivity options, enabling the product to interface with various components and systems.

Package Style (Meter): SMALL OUTLINE

The small outline package style offers compact dimensions, making it ideal for space-constrained designs and applications.

Propagation Delay (tpd): 50 ns

With a propagation delay of 50 ns, this product ensures minimal delay in transmitting signals, enhancing overall system responsiveness.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature of 70°C allows the product to withstand demanding operating conditions, ensuring reliability in harsh environments.

Output Characteristics: OPEN-COLLECTOR

The open-collector output characteristics provide flexibility in interfacing with various types of loads, making it compatible with diverse applications.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature of 0°C ensures the product's reliable operation even in cold environments.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold terminal finish provides excellent conductivity and corrosion resistance, ensuring long-term reliability and signal integrity.

Terminal Position: DUAL

The dual terminal position enables flexibility in circuit board layout and allows for efficient routing of signals.

Maximum Seated Height: 1.75 mm

The low maximum seated height of 1.75 mm ensures compatibility with compact designs and facilitates efficient use of space.

Width: 3.9 mm

The narrow width of 3.9 mm allows for compact integration and efficient use of board space.

Output Polarity: INVERTED

The inverted output polarity feature enables compatibility with systems and components that require inverted logic signals.

Minimum Supply Voltage (Vsup): 4.75 V

The minimum supply voltage requirement of 4.75V ensures compatibility with a wide range of power sources, allowing for versatile application possibilities.

Maximum Time At Peak Reflow Temperature (s): 30

The maximum time at peak reflow temperature of 30 seconds ensures safe and reliable soldering during manufacturing and assembly processes.

Peak Reflow Temperature °C: 260

The peak reflow temperature of 260°C allows for efficient soldering and ensures a secure and robust connection between the product and the circuit board.

Length: 9.9 mm

The length of 9.9 mm provides a compact form factor, making it suitable for space-limited applications and designs.

Temperature Grade: COMMERCIAL

The commercial temperature grade indicates the product's suitability for standard consumer and industrial applications within the specified temperature range.

Technology: TTL

The TTL technology employed in this product offers reliable and high-speed signal processing, ensuring accurate decoding and driving capabilities.

Terminal Form: GULL WING

The gull wing terminal form facilitates easy soldering and secure electrical connections, enhancing the product's robustness and reliability.

Terminal Pitch: 1.27 mm

With a terminal pitch of 1.27 mm, this product allows for fine-pitch integration and reliable electrical connections in compact designs.

Maximum Supply Voltage (Vsup): 5.25 V

The maximum supply voltage capability of 5.25V ensures compatibility with various power sources and provides a safety margin for voltage fluctuations.

Maximum Power Supply Current (ICC): 13 mA

The maximum power supply current of 13 mA ensures efficient power consumption and allows for compatibility with various power sources.

Technical Specifications

Decoder & Drivers SN74LS145DRG4 attributes and parameters. Explore more Decoder & Drivers devices from Texas Instruments

Specs

Additional Features:

ION MAX=80MA @ VOL MAX=3V

Family:

LS

Input Conditioning:

STANDARD

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

9.9 mm

Load Capacitance (CL):

45 pF

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Output Characteristics:

OPEN-COLLECTOR

Output Polarity:

INVERTED

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

13 mA

Propagation Delay (tpd):

50 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Decoder/Drivers

Maximum Supply Voltage (Vsup):

5.25 V

Minimum Supply Voltage (Vsup):

4.75 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

SN74LS145DRG4 Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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