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84062012A

Texas Instruments

84062012A by Texas Instruments

Texas Instruments 84062012A is an 8-bit decoder with a propagation delay of 45ns at 5V. It features a ceramic, metal-sealed package and operates in military-grade temperatures. Ideal for applications requiring fast decoding and inverted output polarity.

Median Price

$24.369

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Freelance Electronics

USA . 6 parts In-Stock

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Vyrian

USA . 3,766 parts In-Stock

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Anansix

USA . 911 parts In-Stock

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Digiode

USA . 545 parts In-Stock

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Electronic Expediters

USA . 9 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 502 parts In-Stock

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$15.944

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One Stop Electronics

USA . 886 parts In-Stock

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Parana Technologies

USA . 1,399 parts In-Stock

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$26.607

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$27.172

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DigiPath Technology Company

USA . 1,244 parts In-Stock

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$29.298

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ChromeModa Solutions

Germany . 3,069 parts In-Stock

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$29.896

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$24.515

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IDEA Electronic Components Group

UK . 1,182 parts In-Stock

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$29.896

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$28.401

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$26.906

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Native Components

USA . 295 parts In-Stock

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$48.951

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Northwest PG Solutions

USA . 2,034 parts In-Stock

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Glotronic Ltd.

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Corphita

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Microchip USA

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Overview

Elevate your projects with the 84062012A by Texas Instruments, a top-tier manufacturer known for quality and reliability. This Decoder & Driver chip offers lightning-fast response times and versatile applications, making it an essential component for a wide range of electronics. With its military-grade screening level and cutting-edge technology, this chip ensures optimal performance in extreme conditions. Trust Texas Instruments to deliver superior products that exceed expectations. Unlock the possibilities with the 84062012A today.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

This material ensures durability and reliability for the decoder & driver, making it suitable for various applications.

Propagation Delay At Nominal Supply: 45 ns

Low propagation delay ensures quick response time, making this decoder & driver efficient for time-sensitive tasks.

Surface Mount: YES

The surface mount feature allows for easy installation and space-saving design, making it convenient for compact electronic devices.

Nominal Supply Voltage / Vsup (V): 5

The nominal supply voltage of 5V ensures compatibility with standard power sources, making it easy to integrate into existing systems.

No. of Bits: 8

Having 8 bits allows for a wide range of encoding or decoding options, making this decoder & driver versatile for different applications.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this decoder & driver can withstand harsh operating conditions, ensuring long-term reliability.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making this decoder & driver energy-efficient and reliable.

Technical Specifications

Decoder & Drivers 84062012A attributes and parameters. Explore more Decoder & Drivers devices from Texas Instruments

Specs

Additional Features:

3 ENABLE INPUTS

Family:

HC/UH

Input Conditioning:

STANDARD

JESD-30 Code:

S-CQCC-N20

JESD-609 Code:

e0

Length:

8.89 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

5.2 Amp

No. of Bits:

8

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

INVERTED

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

Package Equivalence Code:

LCC20,.35SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Packing Method:

TUBE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

2/6

Maximum Power Supply Current (ICC):

.16 mA

Propagation Delay At Nominal Supply:

45 ns

Propagation Delay (tpd):

270 ns

Qualification:

Qualified

Screening Level:

MIL-STD-883

Maximum Seated Height:

2.03 mm

Sub-Category:

Decoder/Driver

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

8.89 mm

Trade Compliance

84062012A Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-244-3367, 5962012443367

NIIN

012443367

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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