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8406201FC

STMicroelectronics

8406201FC by STMicroelectronics

8406201FC by STMicroelectronics is a CMOS decoder/driver with a propagation delay of 54 ns and operates b/w 2-6 V. It features a ceramic, glass-sealed package and supports military-grade applications with a max temp of 125 °C. Ideal for high-reliability systems requiring low power consumption.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Digiode

USA . 1,762 parts In-Stock

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Anansix

USA . 1,198 parts In-Stock

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Vyrian

USA . 847 parts In-Stock

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Native Components

USA . 238 parts In-Stock

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$15.765

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Northwest PG Solutions

USA . 466 parts In-Stock

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$17.342

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$15.607

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IDEA Electronic Components Group

UK . 1,982 parts In-Stock

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$28.909

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$26.018

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MKK Technologies

India . 2,188 parts In-Stock

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$54.362

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DigiPath Technology Company

USA . 2,188 parts In-Stock

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$54.362

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Corphita

USA . 2,282 parts In-Stock

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Parana Technologies

USA . 641 parts In-Stock

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$34.565

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Overview

Unlock the power of precision with the 8406201FC from STMicroelectronics, a leader in innovation and quality. This ceramic, glass-sealed decoder and driver delivers unmatched reliability across demanding applications—from aerospace to telecommunications. With its robust design and superior screening levels, it ensures optimal performance even in extreme conditions. Elevate your projects with STMicroelectronics’ commitment to excellence, bringing you efficiency and peace of mind.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

The ceramic and glass-sealed construction ensures excellent durability and resistance to environmental factors, making this decoder and driver suitable for harsh conditions.

Propagation Delay At Nominal Supply: 54 ns

With a low propagation delay, this product allows for faster signal processing, enhancing overall system performance.

Surface Mount: YES

Surface mount technology provides compact design and ease of integration into various PCB layouts, enabling efficient use of space.

Input Conditioning: STANDARD

Standard input conditioning allows for reliable and consistent performance across a range of applications.

Screening Level: 38535Q/M; 38534H; 883B

These screening levels affirm the component's high reliability, making it a dependable choice for military and aerospace applications.

Package Shape: RECTANGULAR

The rectangular shape contributes to efficient layout options on printed circuit boards, enhancing versatility in design.

Nominal Supply Voltage / Vsup (V): 5

The standard nominal supply voltage of 5V makes it compatible with a wide range of existing systems.

Load Capacitance (CL): 50 pF

A moderate load capacitance aids in ensuring stable operation and minimizing signal degradation.

Power Supplies (V): 2/6

This flexibility in power supply voltage range accommodates various applications, allowing for design adaptability.

No. of Terminals: 16

With 16 terminals, this component provides ample connections for complex circuitry, enhancing functionality.

Package Style (Meter): FLATPACK

Flatpack packaging allows for efficient heat dissipation and compact assembly in tight spaces.

Maximum I (ol): 4 Amp

The ability to handle a maximum output current of 4 A ensures robust performance in high-demand applications.

Propagation Delay (tpd): 270 ns

While slightly higher than nominal, this propagation delay is still within acceptable ranges for many applications, ensuring decent performance.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature makes this product suitable for use in environments with elevated thermal conditions.

Minimum Operating Temperature: -55 °C

The ability to operate at extremely low temperatures ensures reliability in cold environments, ideal for military and aerospace use.

Terminal Position: DUAL

Dual terminal positions facilitate easier mounting on the PCB, optimizing layout and reducing assembly complexity.

Output Polarity: INVERTED

Inverted output polarity allows for compatibility with specific logic designs, broadening its application scope.

Minimum Supply Voltage (Vsup): 2 V

Operating down to 2V allows for power-efficient designs catering to low-voltage systems.

Temperature Grade: MILITARY

Designed to military standards, this product ensures high reliability and performance in critical applications.

Technology: CMOS

The use of CMOS technology enhances energy efficiency while maintaining high speed and performance.

Terminal Form: FLAT

Flat terminals enable easier soldering and secure connections on the PCB.

Terminal Pitch: 1.27 mm

The 1.27 mm terminal pitch is compatible with a wide range of PCB layouts and assembly techniques.

Maximum Supply Voltage (Vsup): 6 V

The capability to support a maximum supply voltage of 6V allows for flexibility in design while accommodating various system requirements.

Technical Specifications

Decoder & Drivers 8406201FC attributes and parameters. Explore more Decoder & Drivers devices from STMicroelectronics

Specs

Additional Features:

3 ENABLE INPUTS

Family:

HC/UH

Input Conditioning:

STANDARD

JESD-30 Code:

R-GDFP-F16

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

4 Amp

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

INVERTED

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DFP

Package Equivalence Code:

FL16,.3

Package Shape:

Package Style (Meter):

FLATPACK

Power Supplies (V):

2/6

Propagation Delay At Nominal Supply:

54 ns

Propagation Delay (tpd):

270 ns

Qualification:

Not Qualified

Screening Level:

38535Q/M;38534H;883B

Sub-Category:

Decoder/Drivers

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Trade Compliance

8406201FC Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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