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CD74HC237M96

Texas Instruments

CD74HC237M96 by Texas Instruments

CD74HC237M96 by Texas Instruments is an 8-bit decoder with 36ns propagation delay. It operates at a supply voltage of 4.5V and can handle load capacitance of 50pF. Ideal for applications requiring fast decoding in compact spaces.

Median Price

$0.441

Lifecycle Status

Suppliers In-Stock

18

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1k+

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Texas Instruments

USA . 47,215 parts In-Stock

1+ parts

$0.313

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$0.213

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$0.109

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47,215

$0.313

$0.213

$0.109

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Mouser Electronics

USA . 4,459 parts In-Stock

1+ parts

$0.940

100+ parts

$0.530

1k+ parts

$0.469

10k+ parts

$0.347

4,459

$0.940

$0.530

$0.469

$0.347

Farnell

UK . 2,522 parts In-Stock

1+ parts

-

100+ parts

$0.401

1k+ parts

$0.313

10k+ parts

$0.283

2,522

-

$0.401

$0.313

$0.283

Element14

Singapore . 2,522 parts In-Stock

1+ parts

-

100+ parts

$0.660

1k+ parts

$0.558

10k+ parts

$0.458

2,522

-

$0.660

$0.558

$0.458

Rochester

USA . 2,500 parts In-Stock

1+ parts

-

100+ parts

$0.433

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$0.359

10k+ parts

$0.320

2,500

-

$0.433

$0.359

$0.320

Verical

USA . 2,500 parts In-Stock

1+ parts

-

100+ parts

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$0.449

10k+ parts

$0.400

2,500

-

-

$0.449

$0.400

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,710 parts In-Stock

1+ parts

$0.143

100+ parts

-

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3,710

$0.143

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Freelance Electronics

USA . 1,729 parts In-Stock

1+ parts

$0.178

100+ parts

$0.187

1k+ parts

$0.176

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1,729

$0.178

$0.187

$0.176

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Nova Conductors

Japan . 100 parts In-Stock

1+ parts

$0.266

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100

$0.266

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DF Sales Co.

USA . 500 parts In-Stock

1+ parts

$0.280

100+ parts

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500

$0.280

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DF Sales Co.

USA . 500 parts In-Stock

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$0.280

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500

$0.280

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Vyrian

USA . 9,938 parts In-Stock

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Chip Stock

USA . 3,710 parts In-Stock

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Magnum Semiconductors LLP

India . 2,500 parts In-Stock

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Zilex Electronics Inc.

Canada . 2,494 parts In-Stock

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A2Z Electronics, Inc.

USA . 771 parts In-Stock

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771

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Ashlea Components Ltd

UK . 55 parts In-Stock

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55

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Infinite Electronics LLP

India . 20 parts In-Stock

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Distributors (Availability)

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Ampacity Inc.

Singapore . 10,044 parts In-Stock

1+ parts

$0.128

100+ parts

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10,044

$0.128

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Corphita

USA . 374 parts In-Stock

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$0.136

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374

$0.136

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Argo Parts USA

USA . 1,359 parts In-Stock

1+ parts

$0.266

100+ parts

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10k+ parts

$0.258

1,359

$0.266

-

-

$0.258

Bastille Electronics

Australia . 45 parts In-Stock

1+ parts

$0.266

100+ parts

$0.253

1k+ parts

$0.240

10k+ parts

$0.237

45

$0.266

$0.253

$0.240

$0.237

Continental Prestige Electronics

USA . 4,717 parts In-Stock

1+ parts

$0.455

100+ parts

$0.255

1k+ parts

$0.195

10k+ parts

$0.181

4,717

$0.455

$0.255

$0.195

$0.181

Parana Technologies

USA . 454 parts In-Stock

1+ parts

$14.071

100+ parts

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$14.536

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454

$14.071

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$14.536

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DigiPath Technology Company

USA . 1,610 parts In-Stock

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$15.494

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$15.494

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IDEA Electronic Components Group

UK . 2,310 parts In-Stock

1+ parts

$15.810

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$15.020

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$14.229

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2,310

$15.810

$15.020

$14.229

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ChromeModa Solutions

Germany . 2,166 parts In-Stock

1+ parts

$15.810

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$12.964

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2,166

$15.810

$12.964

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Corohmni

South Africa . 348 parts In-Stock

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$19.962

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348

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Perfect Parts

USA . 43,783 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 28,972 parts In-Stock

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Glotronic Ltd.

UK . 3,790 parts In-Stock

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Authorized Procurement Solutions

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Supply Digital

USA . 1,812 parts In-Stock

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iodParts Technologies Inc.

India . 100 parts In-Stock

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100

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Overview

Enhance your electronic projects with the Texas Instruments CD74HC237M96, a high-quality decoder and driver that offers precision and reliability. Manufactured by the industry leader in semiconductor technology, this product provides seamless input conditioning and fast propagation delay, making it ideal for a wide range of applications. Whether you're a hobbyist or a professional, this small outline package with dual terminal position will streamline your designs and enhance performance. Upgrade your projects today with the CD74HC237M96 and experience the value and benefits it brings to your work.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package lightweight and durable, suitable for various applications.

Propagation Delay At Nominal Supply: 36 ns

The low propagation delay ensures quick response times, making it efficient for real-time applications.

Surface Mount: YES

Surface mount technology allows for easy installation and space-saving on PCBs.

Input Conditioning: LATCHED

Latched input conditioning helps in retaining the input state, ensuring data integrity and stability.

Package Shape: RECTANGULAR

The rectangular shape allows for easy integration and placement on a circuit board.

No. of Bits: 8

With 8 bits, this decoder and driver can handle a wide range of data inputs effectively.

Nominal Supply Voltage / Vsup (V): 4.5

Operates at a nominal supply voltage of 4.5V, suitable for a variety of electronic systems.

Load Capacitance (CL): 50 pF

The low load capacitance ensures efficient performance and minimal power consumption.

Power Supplies (V): 2/6

Compatible with a range of power supplies, offering flexibility in system design.

No. of Terminals: 16

With 16 terminals, this decoder and driver can accommodate multiple connections and configurations.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the PCB and is suitable for compact electronic devices.

Maximum I (ol): 5.2 Amp

Capable of handling high output currents, making it suitable for driving various loads.

Propagation Delay (tpd): 240 ns

The propagation delay of 240 ns ensures reliable and quick signal processing.

Maximum Operating Temperature: 125 °C

Operates effectively in high-temperature environments, suitable for industrial and automotive applications.

Minimum Operating Temperature: -55 °C

Capable of functioning in low-temperature conditions, ideal for outdoor and harsh environments.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The terminal finish ensures good conductivity and resistance to corrosion, enhancing the product's lifespan.

Terminal Position: DUAL

Dual terminal position allows for flexible mounting options and ease of connection in different configurations.

Maximum Seated Height: 1.75 mm

The low seated height saves space in compact electronic designs and facilitates efficient PCB layout.

Width: 3.9 mm

The compact width of 3.9 mm allows for secure placement in tight spaces and reduces the overall footprint on the PCB.

Output Polarity: TRUE

True output polarity ensures accurate signal transmission and compatibility with other components in the system.

Minimum Supply Voltage (Vsup): 2 V

Capable of operating at low supply voltages, suitable for battery-powered devices and energy-efficient applications.

Peak Reflow Temperature °C: 260

The high peak reflow temperature of 260°C allows for reliable soldering during PCB assembly processes.

Length: 9.9 mm

The length of 9.9 mm provides a compact form factor, ideal for space-constrained electronic designs.

Temperature Grade: MILITARY

Designed to meet military-grade standards, ensuring reliability and durability in harsh operating conditions.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing the product's efficiency and reliability.

Terminal Form: GULL WING

The gull wing terminal form provides good solder joint strength and ease of inspection during the manufacturing process.

Packing Method: TR

The Tape and Reel (TR) packing method offers convenient storage, handling, and automated assembly of the product.

Terminal Pitch: 1.27 mm

The 1.27 mm terminal pitch allows for high-density mounting and efficient PCB layout, suitable for compact designs.

Maximum Supply Voltage (Vsup): 6 V

Capable of handling high supply voltages, providing flexibility in system design and compatibility with various power sources.

Maximum Power Supply Current (ICC): 0.16 mA

The low power supply current of 0.16 mA ensures energy efficiency and minimal power consumption in the system.

Technical Specifications

Decoder & Drivers CD74HC237M96 attributes and parameters. Explore more Decoder & Drivers devices from Texas Instruments

Specs

Additional Features:

ADDRESS LATCHES; 3 ENABLE INPUTS

Family:

HC/UH

Input Conditioning:

LATCHED

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

9.9 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

5.2 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/6

Maximum Power Supply Current (ICC):

.16 mA

Propagation Delay At Nominal Supply:

36 ns

Propagation Delay (tpd):

240 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Decoder/Drivers

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

4.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

3.9 mm

Trade Compliance

CD74HC237M96 Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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