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74HC138DR2G

Onsemi

74HC138DR2G by Onsemi

74HC138DR2G by Onsemi is a CMOS Decoder & Driver with 41ns propagation delay, 205ns tpd, and 4A max I (ol). It is used in applications requiring inverted output polarity, operates at -55 to 125 °C, and has a small outline package style.

Median Price

$0.122

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 39,794 parts In-Stock

1+ parts

-

100+ parts

$0.132

1k+ parts

$0.110

10k+ parts

$0.098

39,794

-

$0.132

$0.110

$0.098

DigiKey

USA . 39,794 parts In-Stock

1+ parts

-

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$0.110

39,794

-

-

-

$0.110

Verical

USA . 32,561 parts In-Stock

1+ parts

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$0.122

32,561

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$0.122

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,842 parts In-Stock

1+ parts

$0.103

100+ parts

-

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1,842

$0.103

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Nova Conductors

Japan . 57 parts In-Stock

1+ parts

$0.186

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57

$0.186

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Vyrian

USA . 37,032 parts In-Stock

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37,032

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Velocity Electronics

USA . 15,000 parts In-Stock

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15,000

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Semi Source

USA . 2,500 parts In-Stock

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2,500

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VNN

France . 979 parts In-Stock

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979

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Chip Stock

USA . 135 parts In-Stock

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135

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 36,916 parts In-Stock

1+ parts

$0.092

100+ parts

-

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36,916

$0.092

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Corphita

USA . 433 parts In-Stock

1+ parts

$0.097

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433

$0.097

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Corohmni

South Africa . 192 parts In-Stock

1+ parts

$0.108

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192

$0.108

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Aranea Global

USA . 100 parts In-Stock

1+ parts

$0.183

100+ parts

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1k+ parts

$0.175

10k+ parts

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100

$0.183

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$0.175

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Argo Parts USA

USA . 708 parts In-Stock

1+ parts

$0.186

100+ parts

-

1k+ parts

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$0.181

708

$0.186

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$0.181

Continental Prestige Electronics

USA . 39,794 parts In-Stock

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$0.093

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39,794

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$0.093

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Perfect Parts

USA . 17,114 parts In-Stock

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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Kulean Microsystems

USA . 4,471 parts In-Stock

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Problanco Electronics

Mexico . 3,979 parts In-Stock

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3,979

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TANS Electronics

Latvia . 3,591 parts In-Stock

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GreenTree Electronics

Israel . 3,168 parts In-Stock

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SupplyDigital Components

Austria . 716 parts In-Stock

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716

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UHIMA Technologies

Türkiye . 482 parts In-Stock

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482

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Microchip USA

USA . 271 parts In-Stock

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271

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Overview

Unlock the power of precision with the 74HC138DR2G by Onsemi. Crafted with superior quality and expertise, this decoder & driver is designed to deliver exceptional performance in a variety of applications. From reducing propagation delay to ensuring seamless operation, this product stands out for its reliability and efficiency. Trust Onsemi to provide you with a value-packed solution that will elevate your projects to new heights. Choose the 74HC138DR2G and experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides good durability and protection for the internal components of the decoder & drivers, making it suitable for various environmental conditions.

Propagation Delay At Nominal Supply: 41 ns

Low propagation delay ensures quick response and efficient operation of the decoder & drivers, which is important for high-speed applications.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation of the decoder & drivers on circuit boards, reducing assembly time and costs.

Nominal Supply Voltage / Vsup (V): 3

Operates at a standard supply voltage of 3V, making it compatible with a wide range of electronic systems and devices.

Maximum Operating Temperature: 125 °C

High maximum operating temperature ensures reliability and stability of the decoder & drivers even in harsh operating conditions.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and compatibility with various digital systems, enhancing the performance of the decoder & drivers.

Technical Specifications

Decoder & Drivers 74HC138DR2G attributes and parameters. Explore more Decoder & Drivers devices from Onsemi

Specs

Family:

HC/UH

Input Conditioning:

STANDARD

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e3

Length:

9.9 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

4 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

INVERTED

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/6

Propagation Delay At Nominal Supply:

41 ns

Propagation Delay (tpd):

205 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Decoder/Drivers

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

3.9 mm

Trade Compliance

74HC138DR2G Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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