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CD4555BM96E4

Texas Instruments

CD4555BM96E4 by Texas Instruments

CD4555BM96E4 by Texas Instruments is a CMOS decoder/driver with 2 functions. It has a propagation delay of 440 ns and operates at a nominal voltage of 5V. This small outline package is commonly used in military applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 5,247 parts In-Stock

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Digiode

USA . 1,290 parts In-Stock

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Nova Conductors

Japan . 86 parts In-Stock

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AZTECH Wire

Italy . 220 parts In-Stock

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$10.842

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Parana Technologies

USA . 1,107 parts In-Stock

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$14.798

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$15.229

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DigiPath Technology Company

USA . 1,255 parts In-Stock

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$16.294

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$14.991

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$16.294

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ChromeModa Solutions

Germany . 1,188 parts In-Stock

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$16.627

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$13.634

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$16.627

$13.634

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IDEA Electronic Components Group

UK . 13 parts In-Stock

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$16.627

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$15.796

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$14.964

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13

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One Stop Electronics

USA . 1,021 parts In-Stock

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$25.000

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Ampacity Inc.

Singapore . 216 parts In-Stock

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$57.000

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Continental Prestige Electronics

USA . 6,216 parts In-Stock

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Argo Parts USA

USA . 4,581 parts In-Stock

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Corphita

USA . 1,262 parts In-Stock

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Bastille Electronics

Australia . 84 parts In-Stock

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Overview

Discover the CD4555BM96E4 by Texas Instruments, a high-quality decoder and driver that offers exceptional value and benefits to customers. Manufactured by Texas Instruments, a renowned industry leader, this product ensures reliability and durability. With its compact design and surface mount capability, it is suitable for various applications. Whether you need accurate decoding or efficient driving, the CD4555BM96E4 delivers outstanding performance. Experience the advantages of this versatile device and unlock new possibilities for your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for portable or rugged applications.

Propagation Delay At Nominal Supply: 440 ns

Fast propagation delay ensures quick response times in decoding and driving signals, making the product efficient in data transmission.

Surface Mount: YES

Surface mount capability allows for easy installation on circuit boards, saving space and facilitating automated assembly processes.

Maximum Operating Temperature: 125 °C

High maximum operating temperature ensures reliability and stability under varying environmental conditions, making the product suitable for industrial and automotive applications.

Nominal Supply Voltage / Vsup (V): 5

Operates at a standard voltage of 5V, making it compatible with a wide range of systems and power sources.

Technical Specifications

Decoder & Drivers CD4555BM96E4 attributes and parameters. Explore more Decoder & Drivers devices from Texas Instruments

Specs

Family:

4000/14000/40000

Input Conditioning:

STANDARD

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

9.9 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Functions:

2

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

5/15

Propagation Delay At Nominal Supply:

440 ns

Propagation Delay (tpd):

440 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Decoder/Drivers

Maximum Supply Voltage (Vsup):

18 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

CD4555BM96E4 Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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