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CD74AC138M96E4

Texas Instruments

CD74AC138M96E4 by Texas Instruments

CD74AC138M96E4 by Texas Instruments is a 16-terminal decoder with 15.4ns propagation delay at 3.3V, suitable for military applications. It features inverted output polarity, CMOS technology, and operates b/w -55 to 125 °C. The package is small outline with surface mount capability and nickel palladium gold terminal finish.

Median Price

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Lifecycle Status

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4

In-Stock Inventory

1k+

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Adafruit Industries

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Vyrian

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Digiode

USA . 3,197 parts In-Stock

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Nova Conductors

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Corohmni

South Africa . 234 parts In-Stock

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$14.167

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AZTECH Wire

Italy . 277 parts In-Stock

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Parana Technologies

USA . 101 parts In-Stock

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$21.042

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$21.279

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ChromeModa Solutions

Germany . 2,153 parts In-Stock

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$23.643

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$19.387

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IDEA Electronic Components Group

UK . 1,448 parts In-Stock

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$22.461

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Semicontronic

India . 32 parts In-Stock

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$57.000

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$55.575

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$55.290

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Ampacity Inc.

Singapore . 32 parts In-Stock

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DigiPath Technology Company

USA . 2,365 parts In-Stock

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Continental Prestige Electronics

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Advanced Electronics

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Overview

Elevate your electronic designs with the CD74AC138M96E4 by Texas Instruments, a top-tier manufacturer known for delivering high-quality Decoder & Drivers. This versatile component offers fast propagation delay and standard input conditioning, making it ideal for a wide range of applications. With a compact small outline package and inverted output polarity, this product is perfect for military-grade projects requiring precision and reliability. Trust Texas Instruments to provide innovative solutions that exceed your expectations in performance and value. Upgrade your projects today with the CD74AC138M96E4 and experience the difference!

Feature Benefit Bullets

Package Body Material

PLASTIC/EPOXY - This material provides durability and protection for the components inside, making it a reliable choice.

Propagation Delay At Nominal Supply

15.4 ns - Fast propagation delay ensures quick response time, ideal for applications requiring high speed data processing.

Surface Mount

YES - Surface mount design allows for easy mounting on PCBs, saving space and making installation more convenient.

Input Conditioning

STANDARD - Standard input conditioning ensures compatibility with a wide range of input signals, making it versatile for different applications.

Package Shape

RECTANGULAR - Rectangular shape allows for efficient use of space on a circuit board, optimizing overall layout and design.

Nominal Supply Voltage / Vsup (V)

3.3 - Operating at a nominal voltage of 3.3V ensures compatibility with common power supplies, making integration easier.

Load Capacitance (CL)

50 pF - With a low load capacitance, this product is able to drive capacitive loads without compromising performance.

Power Supplies (V)

3.3/5 - Compatible with both 3.3V and 5V power supplies, offering flexibility in different system configurations.

No. of Terminals

16 - Having 16 terminals allows for multiple connections, enabling complex circuit configurations and functionalities.

Package Style (Meter)

SMALL OUTLINE - The small outline package style saves space and reduces overall footprint, ideal for compact designs.

Maximum I (ol)

12 Amp - High maximum output current allows for driving larger loads, making it suitable for applications requiring high power output.

Propagation Delay (tpd)

138 ns - Low propagation delay ensures minimal delay in signal transmission, enhancing overall system performance.

Maximum Operating Temperature

125 °C - With a high maximum operating temperature, this product can withstand harsh environmental conditions, increasing its durability.

Minimum Operating Temperature

55 °C - Operating at temperatures as low as -55°C makes this product suitable for a wide range of applications, even in cold environments.

Terminal Finish

NICKEL PALLADIUM GOLD - This terminal finish provides excellent conductivity and corrosion resistance, ensuring long-term reliability.

Terminal Position

DUAL - Dual terminal position offers flexibility in mounting orientation, allowing for versatile use in various system configurations.

Maximum Seated Height

1.75 mm - Low seated height makes this product suitable for compact designs with height restrictions, saving space in the overall system.

Width

3.9 mm - Narrow width allows for efficient use of space on a PCB, optimizing layout and design.

Output Polarity

INVERTED - Inverted output polarity provides compatibility with different input signals, offering versatility in system integration.

Minimum Supply Voltage (Vsup)

1.5 V - Operating at a minimum voltage of 1.5V ensures compatibility with lower voltage power supplies, expanding its usability.

Maximum Time At Peak Reflow Temperature (s)

30 - With a maximum reflow time of 30 seconds, this product is easy to install and solder onto a PCB, saving time during assembly.

Peak Reflow Temperature °C

260 - With a high peak reflow temperature, this product can withstand the soldering process without damage, ensuring reliability during manufacturing.

Length

9.9 mm - Compact length allows for efficient use of space on a PCB, optimizing overall size and layout.

Temperature Grade

MILITARY - Military-grade temperature grade ensures reliability and performance in extreme temperature conditions, making it suitable for rugged applications.

Technology

CMOS - CMOS technology offers low power consumption and high noise immunity, making this product energy-efficient and reliable in noisy environments.

Terminal Form

GULL WING - Gull wing terminal form provides mechanical stability and ease of soldering, ensuring secure connections during operation.

Packing Method

TR - TR packing method offers protection during transportation and storage, preventing damage and ensuring product integrity.

Terminal Pitch

1.27 mm - With a small terminal pitch, this product allows for dense PCB layouts and compact designs, saving space and optimizing circuit density.

Maximum Supply Voltage (Vsup)

5.5 V - With a maximum supply voltage of 5.5V, this product can handle higher supply voltages, offering flexibility in different system configurations.

Technical Specifications

Decoder & Drivers CD74AC138M96E4 attributes and parameters. Explore more Decoder & Drivers devices from Texas Instruments

Specs

Additional Features:

TWO ACTIVE-LOW AND ONE ACTIVE-HIGH ENABLE INPUTS

Family:

AC

Input Conditioning:

STANDARD

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

9.9 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

12 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

INVERTED

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3/5

Propagation Delay At Nominal Supply:

15.4 ns

Propagation Delay (tpd):

138 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Decoder/Drivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.5 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

CD74AC138M96E4 Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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