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SNJ54156W-00

Texas Instruments

SNJ54156W-00 by Texas Instruments

SNJ54156W-00 by Texas Instruments is a TTL decoder with 2 functions, 16 terminals, and open-collector outputs. It operates b/w -55 to 125 °C and has a propagation delay of 34 ns. Ideal for military applications requiring fast response times in compact spaces.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,254 parts In-Stock

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Digiode

USA . 2,292 parts In-Stock

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Distributors (Availability)

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Parana Technologies

USA . 2,223 parts In-Stock

1+ parts

$9.640

100+ parts

-

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$10.231

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2,223

$9.640

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$10.231

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DigiPath Technology Company

USA . 659 parts In-Stock

1+ parts

$10.615

100+ parts

$9.766

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659

$10.615

$9.766

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ChromeModa Solutions

Germany . 4,036 parts In-Stock

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$10.832

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$8.882

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4,036

$10.832

$8.882

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IDEA Electronic Components Group

UK . 1,426 parts In-Stock

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$10.832

100+ parts

$10.290

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$9.749

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1,426

$10.832

$10.290

$9.749

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One Stop Electronics

USA . 469 parts In-Stock

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$19.000

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469

$19.000

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AZTECH Wire

Italy . 571 parts In-Stock

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$19.573

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Corphita

USA . 2,317 parts In-Stock

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Overview

Elevate your electronic projects with the SNJ54156W-00 from Texas Instruments, a top-tier manufacturer known for quality and reliability. As part of the Decoder & Drivers category, this product boasts a ceramic, glass-sealed package body material, ensuring durability and long-lasting performance. With a nominal supply voltage of 5V and a propagation delay of just 34ns, this decoder offers fast and efficient operation. Whether you're working on military-grade applications or commercial projects, the SNJ54156W-00 provides unmatched value, precision, and innovation that will take your designs to the next level. Trust in Texas Instruments for cutting-edge technology that delivers results.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

The ceramic and glass-sealed package body material ensures durability and protection for the internal components, making this decoder & driver reliable for extended use.

Surface Mount: YES

Being surface mountable allows for easy installation on circuit boards, making it convenient for integration into various electronic systems.

Nominal Supply Voltage / Vsup (V): 5

Operating at a standard voltage of 5V makes this decoder & driver compatible with a wide range of electronic devices and systems.

Output Characteristics: OPEN-COLLECTOR

The open-collector output allows for convenient connection to other components or devices, offering flexibility in design and compatibility.

Technology: TTL

Utilizing TTL technology ensures fast and reliable signal processing, making this decoder & driver suitable for high-performance applications.

Technical Specifications

Decoder & Drivers SNJ54156W-00 attributes and parameters. Explore more Decoder & Drivers devices from Texas Instruments

Specs

Additional Features:

FUNCTION 2 OUTPUT INVERTED

Family:

TTL/H/L

JESD-30 Code:

R-GDFP-F16

Length:

10.2 mm

Load Capacitance (CL):

15 pF

Logic IC Type:

No. of Functions:

2

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

OPEN-COLLECTOR

Output Polarity:

TRUE

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DFP

Package Shape:

Package Style (Meter):

FLATPACK

Maximum Power Supply Current (ICC):

35 mA

Propagation Delay (tpd):

34 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.03 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

6.73 mm

Trade Compliance

SNJ54156W-00 Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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