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SNJ54156J

Texas Instruments

SNJ54156J by Texas Instruments

SNJ54156J by Texas Instruments is a TTL decoder with 2 functions, operating at 5V. It features a propagation delay of 34ns and open-collector output characteristics. Ideal for military-grade applications requiring inverted output polarity and a temperature range from -55 to 125°C.

Median Price

$10.564

Lifecycle Status

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8

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Freelance Electronics

USA . 2 parts In-Stock

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LWI Electronics Inc

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One Stop Electronics

USA . 1,575 parts In-Stock

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AZTECH Wire

Italy . 857 parts In-Stock

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Parana Technologies

USA . 1,845 parts In-Stock

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DigiPath Technology Company

USA . 292 parts In-Stock

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ChromeModa Solutions

Germany . 6,911 parts In-Stock

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IDEA Electronic Components Group

UK . 1,746 parts In-Stock

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Overview

Enhance your electronic projects with the SNJ54156J decoder and driver by Texas Instruments. Known for their high-quality components, Texas Instruments delivers reliable products for various applications. This versatile device offers customers the value of fast propagation delay, inverted output polarity, and military-grade temperature tolerance. With its dual-terminal design and open-collector output characteristics, the SNJ54156J provides unmatched performance and efficiency. Upgrade your circuit designs with this top-of-the-line component and experience the benefits of precision engineering at its finest.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

This material provides high reliability and durability, making the product suitable for harsh environmental conditions.

Nominal Supply Voltage / Vsup (V): 5

Stable supply voltage ensures consistent performance and reliable operation.

Propagation Delay (tpd): 34 ns

Low propagation delay ensures fast response time and efficient signal processing.

Minimum Operating Temperature: -55 °C

Wide operating temperature range allows the product to be used in extreme cold conditions.

Output Characteristics: OPEN-COLLECTOR

Open-collector output allows for easy interfacing with different types of circuits and devices.

Technical Specifications

Decoder & Drivers SNJ54156J attributes and parameters. Explore more Decoder & Drivers devices from Texas Instruments

Specs

Additional Features:

USABLE AS 1 TO 8 DEMULTIPLEXER

Family:

TTL/H/L

JESD-30 Code:

R-CDIP-T16

Length:

19.56 mm

Load Capacitance (CL):

15 pF

Logic IC Type:

No. of Functions:

2

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

OPEN-COLLECTOR

Output Polarity:

INVERTED

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

35 mA

Propagation Delay (tpd):

34 ns

Qualification:

Not Qualified

Screening Level:

38535Q/M;38534H;883B

Maximum Seated Height:

5.08 mm

Sub-Category:

Decoder/Drivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7.62 mm

Trade Compliance

SNJ54156J Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-201-2468, 5962012012468, 5962-99-797-8324, 5962997978324

NIIN

012012468, 997978324

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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