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SN74LVC1G19DCKR

Texas Instruments

SN74LVC1G19DCKR by Texas Instruments

Texas Instruments SN74LVC1G19DCKR is a 3-STATE decoder with 5.2 ns propagation delay at 1.8V, suitable for industrial applications. It operates b/w -40 to 85°C, has a load capacitance of 50 pF, and supports surface mount installation.

Median Price

$0.124

Lifecycle Status

Suppliers In-Stock

23

In-Stock Inventory

1k+

Distributors (Authorized)

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Chip1Stop

Japan . 2,506 parts In-Stock

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$0.124

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Texas Instruments

USA . 214,495 parts In-Stock

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$0.169

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$0.115

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$0.059

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Mouser Electronics

USA . 4,753 parts In-Stock

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$0.220

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$0.113

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$0.098

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4,753

$0.220

$0.113

$0.098

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Rochester

USA . 68,940 parts In-Stock

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-

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$0.100

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$0.083

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$0.074

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$0.100

$0.083

$0.074

DigiKey

USA . 68,940 parts In-Stock

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$0.130

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Verical

USA . 39,225 parts In-Stock

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$0.093

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Arrow

USA . 3,000 parts In-Stock

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$0.083

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$0.083

Distributors (In-Stock)

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Digiode

USA . 329 parts In-Stock

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$0.078

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329

$0.078

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Nova Conductors

Japan . 91 parts In-Stock

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TME

Poland . 332 parts In-Stock

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$0.210

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$0.109

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$0.090

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$0.088

332

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$0.088

Vyrian

USA . 62,878 parts In-Stock

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Chip Stock

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ACDS - Activité Composants Distribution Service

France . 3,000 parts In-Stock

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Dan-Mar Components

USA . 3,000 parts In-Stock

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Cyclops Electronics Ltd

UK . 2,969 parts In-Stock

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Bristol Electronics

USA . 2,175 parts In-Stock

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$0.211

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$0.126

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$0.084

2,175

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$0.084

Prism Electronics

USA . 1,434 parts In-Stock

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PC Components Company LLC

USA . 1,415 parts In-Stock

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ComSIT Distribution GmbH

Germany . 782 parts In-Stock

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782

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Inventory MP

USA . 154 parts In-Stock

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Component Sense

UK . 100 parts In-Stock

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100

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Cogito LLC

Ukraine . 24 parts In-Stock

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Semtec, LLC

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Distributors (Availability)

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CoreStaff

Japan . 5 parts In-Stock

1+ parts

$0.057

100+ parts

$0.054

1k+ parts

$0.053

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5

$0.057

$0.054

$0.053

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Ampacity Inc.

Singapore . 62,906 parts In-Stock

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$0.070

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Semicontronic

India . 62,709 parts In-Stock

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$0.070

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$0.068

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Corphita

USA . 4,264 parts In-Stock

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Continental Prestige Electronics

USA . 6,360 parts In-Stock

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Netroflash

USA . 500 parts In-Stock

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Argo Parts USA

USA . 131 parts In-Stock

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Advanced Electronics

New Zealand . 1,000 parts In-Stock

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Microchip USA

USA . 3,851 parts In-Stock

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$0.718

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Corohmni

South Africa . 93 parts In-Stock

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$9.979

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Parana Technologies

USA . 1,701 parts In-Stock

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$16.470

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$1,529.521

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$14.823

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$14.823

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DigiPath Technology Company

USA . 1,759 parts In-Stock

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$18.136

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ChromeModa Solutions

Germany . 5,149 parts In-Stock

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$18.506

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$15.175

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IDEA Electronic Components Group

UK . 1,222 parts In-Stock

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$17.581

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$16.655

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GreenTree Electronics

Israel . 54,000 parts In-Stock

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Kepictronics

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Authorized Procurement Solutions

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Assy Fe

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Overview

Unleash the power of innovation with the SN74LVC1G19DCKR by Texas Instruments. As a leader in the industry, Texas Instruments delivers top-quality Decoder & Drivers that offer unmatched performance and reliability. Ideal for a wide range of applications, this product boasts a fast propagation delay and low power consumption, making it a cost-effective solution for your project needs. Experience the value of cutting-edge technology and elevate your designs with the SN74LVC1G19DCKR from Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides good durability and protection for the internal components of the decoder & driver.

Propagation Delay At Nominal Supply: 5.2 ns

Low propagation delay ensures fast signal processing, making this product suitable for high-speed applications.

Surface Mount: YES

Easy to install and saves space on the circuit board, ideal for compact designs.

Nominal Supply Voltage / Vsup (V): 1.8

Low supply voltage helps in reducing power consumption and heat generation.

Maximum I (ol): 32 Amp

High output current capacity allows for driving of demanding loads without the need for external amplification.

Temperature Grade: INDUSTRIAL

Can operate reliably in industrial temperature ranges, making it suitable for harsh environments.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and compatibility with a wide range of digital systems.

Technical Specifications

Decoder & Drivers SN74LVC1G19DCKR attributes and parameters. Explore more Decoder & Drivers devices from Texas Instruments

Specs

Family:

LVC/LCX/Z

Input Conditioning:

STANDARD

JESD-30 Code:

R-PDSO-G6

JESD-609 Code:

e4

Length:

2 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

32 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

1

No. of Terminals:

6

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP6,.08

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Maximum Power Supply Current (ICC):

.01 mA

Propagation Delay At Nominal Supply:

5.2 ns

Propagation Delay (tpd):

16.1 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Decoder/Drivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

1.25 mm

Trade Compliance

SN74LVC1G19DCKR Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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