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SN74HC138DBRE4

Texas Instruments

SN74HC138DBRE4 by Texas Instruments

SN74HC138DBRE4 by Texas Instruments is a CMOS Decoder & Drivers with 16 terminals. It operates at a supply voltage range of 2-6V and has a propagation delay of 45ns. With inverted output polarity, it is ideal for industrial applications requiring standard input conditioning and a load capacitance of 50pF.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 5,935 parts In-Stock

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Nova Conductors

Japan . 700 parts In-Stock

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700

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Digiode

USA . 592 parts In-Stock

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592

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AZTECH Wire

Italy . 509 parts In-Stock

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$9.685

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509

$9.685

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One Stop Electronics

USA . 190 parts In-Stock

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$13.000

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$13.000

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Corohmni

South Africa . 270 parts In-Stock

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$21.120

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Parana Technologies

USA . 1,349 parts In-Stock

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$29.597

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$61.011

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$29.597

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DigiPath Technology Company

USA . 1,098 parts In-Stock

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$32.590

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$29.983

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ChromeModa Solutions

Germany . 2,680 parts In-Stock

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$33.255

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$27.269

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IDEA Electronic Components Group

UK . 2,116 parts In-Stock

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$33.255

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$31.592

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$29.930

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Semicontronic

India . 1,056 parts In-Stock

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$42.000

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$40.950

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$40.740

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Ampacity Inc.

Singapore . 969 parts In-Stock

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Argo Parts USA

USA . 3,053 parts In-Stock

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Continental Prestige Electronics

USA . 1,515 parts In-Stock

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Corphita

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Bastille Electronics

Australia . 300 parts In-Stock

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Overview

Unlock the potential of your electronic designs with the Texas Instruments SN74HC138DBRE4. As a leader in semiconductor innovation, Texas Instruments delivers top-quality Decoder & Drivers that are reliable and efficient. This versatile component is perfect for a wide range of applications, offering fast propagation delay and a compact design. With a nominal supply voltage of 5V and a maximum operating temperature of 85°C, this product provides exceptional performance and durability. Trust Texas Instruments to provide the value and benefits you need for your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used in the package body provides good protection for the internal components and ensures durability.

Surface Mount: YES

Being surface mountable makes it easy to integrate this decoder & driver into various electronic circuits and designs.

Nominal Supply Voltage / Vsup (V): 5

The 5V nominal supply voltage is commonly used in many electronic systems, making this product compatible with a wide range of applications.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, this decoder & driver can handle industrial environments with high temperature requirements.

Technology: CMOS

The CMOS technology used in this product ensures low power consumption and high noise immunity, making it an efficient choice for various applications.

Technical Specifications

Decoder & Drivers SN74HC138DBRE4 attributes and parameters. Explore more Decoder & Drivers devices from Texas Instruments

Specs

Additional Features:

3 ENABLE INPUTS

Family:

HC/UH

Input Conditioning:

STANDARD

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

6.2 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

4 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Polarity:

INVERTED

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP16,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/6

Propagation Delay At Nominal Supply:

45 ns

Propagation Delay (tpd):

225 ns

Qualification:

Not Qualified

Maximum Seated Height:

2 mm

Sub-Category:

Decoder/Drivers

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5.3 mm

Trade Compliance

SN74HC138DBRE4 Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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