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NC7SZ18P6X

Onsemi

NC7SZ18P6X by Onsemi

NC7SZ18P6X by Onsemi is a 3-STATE output decoder with 10.5 ns propagation delay at 1.8V, suitable for industrial applications. It features a small outline package with dual terminals and operates within -40 to 85 °C temperature range. With a load capacitance of 15 pF, it supports surface mount installation and standard input conditioning.

Median Price

$0.108

Lifecycle Status

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31

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1k+

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Arrow

USA . 57,233 parts In-Stock

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DigiKey

USA . 12,623 parts In-Stock

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Mouser Electronics

USA . 12,314 parts In-Stock

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Newark

USA . 701 parts In-Stock

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Adafruit Industries

USA . 70 parts In-Stock

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Verical

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Flip Electronics (Authorized)

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Element14

Singapore . 17,545 parts In-Stock

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Farnell

UK . 17,135 parts In-Stock

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Avnet

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Chip1Stop

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Digiode

USA . 1,172 parts In-Stock

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Nova Conductors

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Forefront Electronics and Design

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Chip Stock

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Vyrian

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IBS Electronics

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NAC Semi

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Bristol Electronics

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Semi Source

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Connect4Technologies Inc.

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PC Components Company LLC

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ACDS - Activité Composants Distribution Service

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Ampacity Inc.

Singapore . 15,238 parts In-Stock

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Semicontronic

India . 15,096 parts In-Stock

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Corphita

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Corohmni

South Africa . 334 parts In-Stock

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Netroflash

USA . 2,000 parts In-Stock

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Continental Prestige Electronics

USA . 1,850 parts In-Stock

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Argo Parts USA

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Modulus Dynamics

Lithuania . 1,883 parts In-Stock

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Advanced Electronics

New Zealand . 70 parts In-Stock

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Aztec Data Supply Inc.

USA . 1,998 parts In-Stock

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Futuretech Components

Singapore . 269,980 parts In-Stock

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RC Electronics

USA . 68,575 parts In-Stock

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iBuyXS LLC

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Perfect Parts

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QUARKTWIN TECHNOLOGY LTD

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Problanco Electronics

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SupplyDigital Components

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Kulean Microsystems

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Kepictronics

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Eastek

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Cyclops Electronics Ltd (Excess)

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Glotronic Ltd.

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UHIMA Technologies

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Overview

Discover the innovative NC7SZ18P6X by Onsemi, a top-quality Decoder & Drivers component designed to elevate your electronic projects to new heights. With a focus on precision and reliability, Onsemi delivers cutting-edge technology that ensures seamless performance in various applications. This product boasts a fast propagation delay, low power consumption, and a wide operating temperature range, making it a versatile and efficient choice for your circuit design needs. Experience the value and benefits of the NC7SZ18P6X today and unlock endless possibilities for your projects!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used for the package body provides durability and protection for the internals of the decoder & driver.

Propagation Delay At Nominal Supply: 10.5 ns

The low propagation delay ensures fast response time for the decoder & driver, making it suitable for time-sensitive applications.

Surface Mount: YES

The surface mount capability allows for easy and convenient installation on PCBs, saving space and simplifying the assembly process.

Nominal Supply Voltage / Vsup (V): 1.8

The low nominal supply voltage of 1.8V makes this product energy-efficient and suitable for low-power applications.

Output Characteristics: 3-STATE

The 3-STATE output characteristic allows for high flexibility in controlling the output signal, enhancing the versatility of the decoder & driver.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85°C ensures reliable performance even in harsh operating conditions.

Technology: CMOS

The CMOS technology used in this product offers low power consumption and high noise immunity, making it an efficient and reliable choice for decoding and driving applications.

Technical Specifications

Decoder & Drivers NC7SZ18P6X attributes and parameters. Explore more Decoder & Drivers devices from Onsemi

Specs

Family:

LVC/LCX/Z

Input Conditioning:

STANDARD

JESD-30 Code:

R-PDSO-G6

JESD-609 Code:

e4

Length:

2 mm

Load Capacitance (CL):

15 pF

Logic IC Type:

Maximum I (ol):

32 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

6

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP6,.08

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Maximum Power Supply Current (ICC):

100 mA

Propagation Delay At Nominal Supply:

10.5 ns

Propagation Delay (tpd):

10.5 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Decoder/Drivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1.25 mm

Trade Compliance

NC7SZ18P6X Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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