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NC7SZ18L6X-L22175

Onsemi

NC7SZ18L6X-L22175 by Onsemi

The Onsemi NC7SZ18L6X-L22175 is a CMOS Decoder & Driver with 10.5 ns propagation delay, 1.8V nominal voltage, and 32 Amp max I (ol). Ideal for industrial applications requiring fast signal processing in compact spaces due to its small outline package style and low power consumption.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,720 parts In-Stock

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Digiode

USA . 2,374 parts In-Stock

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Distributors (Availability)

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Microchip USA

USA . 6,567 parts In-Stock

1+ parts

$0.758

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6,567

$0.758

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AZTECH Wire

Italy . 1,111 parts In-Stock

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$15.060

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QUARKTWIN TECHNOLOGY LTD

USA . 15,892 parts In-Stock

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TANS Electronics

Latvia . 7,768 parts In-Stock

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7,768

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Kulean Microsystems

USA . 5,591 parts In-Stock

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Problanco Electronics

Mexico . 4,495 parts In-Stock

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4,495

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SupplyDigital Components

Austria . 3,679 parts In-Stock

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Corphita

USA . 1,584 parts In-Stock

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UHIMA Technologies

Türkiye . 990 parts In-Stock

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990

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Corohmni

South Africa . 68 parts In-Stock

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Overview

Discover the NC7SZ18L6X-L22175 by Onsemi, a cutting-edge Decoder & Drivers component that offers lightning-fast propagation delay at 10.5 ns, making it perfect for high-speed applications. With a compact form factor and advanced technology, this product is designed to provide reliable performance in industrial settings. Onsemi's reputation for quality and innovation ensures that customers can trust in the durability and precision of this decoder. Upgrade your projects with the NC7SZ18L6X-L22175 and experience seamless operation and enhanced efficiency like never before.

Feature Benefit Bullets

Propagation Delay At Nominal Supply: 10.5 ns

Low propagation delay ensures fast operation and efficient data processing.

Surface Mount: YES

Surface mount capability enables easy integration onto circuit boards.

Input Conditioning: STANDARD

Standard input conditioning ensures compatibility with various input signals.

Nominal Supply Voltage / Vsup (V): 1.8

Low nominal supply voltage for power efficiency and compatibility with various systems.

Maximum Operating Temperature: 85 °C

Wide operating temperature range suitable for industrial environments.

Technical Specifications

Decoder & Drivers NC7SZ18L6X-L22175 attributes and parameters. Explore more Decoder & Drivers devices from Onsemi

Specs

Family:

LVC/LCX/Z

Input Conditioning:

STANDARD

JESD-30 Code:

R-XDSO-N6

JESD-609 Code:

e4

Length:

1.45 mm

Load Capacitance (CL):

15 pF

Logic IC Type:

Maximum I (ol):

32 Amp

No. of Functions:

1

No. of Terminals:

6

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

SOLCC6,.04,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, VERY THIN PROFILE

Packing Method:

TR

Power Supplies (V):

3.3

Maximum Power Supply Current (ICC):

100 mA

Propagation Delay At Nominal Supply:

10.5 ns

Propagation Delay (tpd):

10.5 ns

Qualification:

Not Qualified

Maximum Seated Height:

.55 mm

Sub-Category:

Decoder/Drivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Width:

1 mm

Trade Compliance

NC7SZ18L6X-L22175 Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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