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NC7SP19L6X

Onsemi

NC7SP19L6X by Onsemi

The Onsemi NC7SP19L6X is a CMOS Decoder & Driver with 48.3 ns propagation delay, 30 pF load capacitance, and 0.5 Amp max I (ol). Ideal for industrial applications, it operates at temperatures from -40 to 85 °C with a supply voltage range of 0.9V to 3.6V.

Median Price

$0.254

Lifecycle Status

EOL

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 159,380 parts In-Stock

1+ parts

-

100+ parts

$0.274

1k+ parts

$0.227

10k+ parts

$0.203

159,380

-

$0.274

$0.227

$0.203

DigiKey

USA . 149,550 parts In-Stock

1+ parts

-

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$0.220

149,550

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$0.220

Verical

USA . 89,580 parts In-Stock

1+ parts

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$0.254

89,580

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$0.254

Distributors (In-Stock)

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Vyrian

USA . 2,623 parts In-Stock

1+ parts

$0.165

100+ parts

-

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2,623

$0.165

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Digiode

USA . 1,658 parts In-Stock

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$0.167

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1,658

$0.167

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,437 parts In-Stock

1+ parts

$0.158

100+ parts

-

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2,437

$0.158

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Corohmni

South Africa . 334 parts In-Stock

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$0.165

100+ parts

-

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334

$0.165

-

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Component Stockers USA

USA . 142,976 parts In-Stock

1+ parts

$0.180

100+ parts

$0.170

1k+ parts

$0.150

10k+ parts

$0.150

142,976

$0.180

$0.170

$0.150

$0.150

Continental Prestige Electronics

USA . 159,380 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.211

10k+ parts

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159,380

-

-

$0.211

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Kepictronics

USA . 10,000 parts In-Stock

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Microchip USA

USA . 4,150 parts In-Stock

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4,150

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TANS Electronics

Latvia . 3,150 parts In-Stock

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3,150

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SupplyDigital Components

Austria . 2,211 parts In-Stock

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Supply Digital

USA . 2,131 parts In-Stock

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Kulean Microsystems

USA . 504 parts In-Stock

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504

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Perfect Parts

USA . 504 parts In-Stock

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504

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Problanco Electronics

Mexico . 468 parts In-Stock

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468

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UHIMA Technologies

Türkiye . 232 parts In-Stock

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232

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Overview

Enhance your electronic projects with the NC7SP19L6X by Onsemi, a top-tier manufacturer known for their superior quality and reliability. This decoder & driver is designed for efficiency and precision, offering a fast propagation delay of 48.3 ns and a low power supply voltage of 1.2V. Perfect for various applications, this surface-mount component features standard input conditioning and a compact rectangular package shape. With its high performance and ease of use, the NC7SP19L6X provides exceptional value and benefits to customers seeking seamless integration and optimal functionality in their designs.

Feature Benefit Bullets

Propagation Delay At Nominal Supply 48.3 ns

Low propagation delay ensures fast response time for decoding and driving signals, making this product suitable for high-speed applications.

Surface Mount YES

Surface mount capability makes it easy to integrate this decoder and driver into compact electronic designs, saving space and simplifying assembly.

Input Conditioning STANDARD

Standard input conditioning ensures compatibility with a wide range of input signal types, enhancing the versatility of this product for various applications.

Package Shape RECTANGULAR

Rectangular package shape provides ease of handling and placement within circuit designs, optimizing the layout and integration of this decoder and driver.

Nominal Supply Voltage / Vsup (V) 1.2

Operates at a common supply voltage of 1.2V, making it compatible with many standard power systems and simplifying power management in the overall circuit.

Load Capacitance (CL) 30 pF

Low load capacitance helps in reducing the overall power consumption and improving signal integrity, ensuring reliable operation in various electronic systems.

Power Supplies (V) 1.2/3.3

Support for multiple power supply voltages allows for flexible use in different system configurations, providing compatibility with a wider range of applications.

No. of Terminals 6

With a low number of terminals, this decoder and driver offers simplified connections and reduces the complexity of circuit layout and assembly.

Package Style (Meter) SMALL OUTLINE, VERY THIN PROFILE

Compact package style with a thin profile enables space-efficient integration in compact electronic devices, ideal for applications where size constraints are a priority.

Maximum I (ol) 0.5 Amp

High output current capability of 0.5A ensures compatibility with a variety of loads, making this product suitable for driving different types of devices.

Maximum Operating Temperature 85 °C

High maximum operating temperature rating of 85 °C ensures reliability and stable performance even in harsh environmental conditions or during extended operation.

Minimum Operating Temperature -40 °C

Wide operating temperature range from -40 °C to 85°C allows for reliable operation in both low and high-temperature environments, enhancing the versatility of this product.

Terminal Finish GOLD NICKEL

Gold nickel terminal finish offers better contact durability, corrosion resistance, and improved conductivity, ensuring long-term reliability and performance of the product.

Terminal Position DUAL

Dual terminal position provides flexibility in mounting and connection options, allowing for easier integration into various circuit layouts and designs.

Maximum Seated Height 0.55 mm

Low seated height of 0.55mm enables the product to be used in applications with strict height constraints, facilitating compact and space-saving electronic designs.

Width 1 mm

With a narrow width of 1mm, this decoder and driver can be easily accommodated in compact electronic layouts, ensuring efficient space utilization in tight designs.

Output Polarity COMPLEMENTARY

Complementary output polarity simplifies interfacing with other components and enhances signal integrity, ensuring accurate decoding and driving of signals in the circuit.

Minimum Supply Voltage (Vsup) 0.9 V

Support for a minimum supply voltage of 0.9V allows for operation in low-power scenarios, making this product suitable for energy-efficient electronic applications.

Maximum Time At Peak Reflow Temperature (s) 30

Extended peak reflow time of 30 seconds allows for robust soldering and assembly processes, ensuring reliable connections and performance in manufacturing.

Peak Reflow Temperature °C 260

High peak reflow temperature of 260 °C enables lead-free soldering and assembly, complying with modern environmental standards and industry requirements.

Length 1.45 mm

Compact length of 1.45mm allows for easy integration of this decoder and driver into tight electronic layouts, ensuring efficient utilization of space in miniaturized designs.

Temperature Grade INDUSTRIAL

Industrial temperature grade specification ensures reliable operation even in harsh industrial environments, making this product suitable for a wide range of industrial applications.

Technology CMOS

CMOS technology offers low power consumption, high noise immunity, and compatibility with various digital systems, ensuring efficient and reliable operation of this decoder and driver.

Terminal Form NO LEAD

No-lead terminal form provides environmentally friendly and RoHS-compliant soldering options, promoting sustainable manufacturing practices in accordance with industry standards.

Packing Method TR

Tape and reel packing method facilitates automated assembly processes, enabling efficient handling, storage, and deployment of this decoder and driver in mass production environments.

Terminal Pitch 0.5 mm

Narrow terminal pitch of 0.5mm increases the density of connections, allowing for compact circuit layouts and space-efficient integration in modern electronic designs.

Maximum Supply Voltage (Vsup) 3.6 V

Support for a maximum supply voltage of 3.6V ensures compatibility with various power sources and voltage levels, making this product versatile for different electronic applications.

Technical Specifications

Decoder & Drivers NC7SP19L6X attributes and parameters. Explore more Decoder & Drivers devices from Onsemi

Specs

Family:

P

Input Conditioning:

STANDARD

JESD-30 Code:

R-XDSO-N6

JESD-609 Code:

e4

Length:

1.45 mm

Load Capacitance (CL):

30 pF

Logic IC Type:

Maximum I (ol):

.5 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

6

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Polarity:

COMPLEMENTARY

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

SOLCC6,.04,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, VERY THIN PROFILE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2/3.3

Propagation Delay At Nominal Supply:

48.3 ns

Propagation Delay (tpd):

48.3 ns

Qualification:

Not Qualified

Maximum Seated Height:

.55 mm

Sub-Category:

Decoder/Drivers

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

.9 V

Nominal Supply Voltage / Vsup (V):

1.2

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

GOLD NICKEL

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1 mm

Trade Compliance

NC7SP19L6X Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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