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CD74HC238E

Texas Instruments

CD74HC238E by Texas Instruments

CD74HC238E by Texas Instruments is an 8-bit decoder with a propagation delay of 30ns. It operates at a supply voltage range of 2-6V and has a max power supply current of 0.16mA. Ideal for military-grade applications due to its CMOS technology and temperature range from -55 to 125°C.

Median Price

$1.215

Lifecycle Status

Suppliers In-Stock

54

In-Stock Inventory

1k+

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Chip1Stop

Japan . 1,096 parts In-Stock

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Texas Instruments

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DigiKey

USA . 6,078 parts In-Stock

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$1.270

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Mouser Electronics

USA . 2,138 parts In-Stock

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Farnell

UK . 431 parts In-Stock

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Newark

USA . 63 parts In-Stock

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Element14

Singapore . 91 parts In-Stock

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Arrow

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Verical

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Component Electronics Inc.

Canada . 75 parts In-Stock

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Nova Conductors

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Digiode

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American Microsemiconductor Inc.

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Corohmni

South Africa . 840 parts In-Stock

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Semicontronic

India . 15,501 parts In-Stock

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$0.442

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Corphita

USA . 1,637 parts In-Stock

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Continental Prestige Electronics

USA . 906 parts In-Stock

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Parana Technologies

USA . 1,781 parts In-Stock

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$12.170

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$12.583

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ChromeModa Solutions

Germany . 4,860 parts In-Stock

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IDEA Electronic Components Group

UK . 671 parts In-Stock

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Perfect Parts

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USA . 1,899 parts In-Stock

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iodParts Technologies Inc.

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Overview

Experience unparalleled quality and reliability with the CD74HC238E decoder & driver by Texas Instruments. This innovative product offers a wide range of applications, providing versatile solutions for your electronic projects. With a focus on value and benefits, Texas Instruments ensures that you receive top-notch performance and efficiency. Trust in the leading manufacturer to deliver cutting-edge technology that exceeds expectations. Elevate your designs with the CD74HC238E and unlock endless possibilities in the world of electronics.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components, ensuring a long lifespan for the product.

Propagation Delay At Nominal Supply: 30 ns

Low propagation delay ensures fast response times, making this decoder and driver ideal for high-speed applications.

Nominal Supply Voltage / Vsup (V): 4.5

This optimal supply voltage ensures reliable performance and efficiency for the decoder and drivers.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this product can withstand tough environmental conditions without compromising performance.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making this decoder and driver energy-efficient and reliable.

Technical Specifications

Decoder & Drivers CD74HC238E attributes and parameters. Explore more Decoder & Drivers devices from Texas Instruments

Specs

Additional Features:

TWO ACTIVE LOW AND ONE ACTIVE HIGH ENABLE INPUTS

Family:

HC/UH

Input Conditioning:

STANDARD

JESD-30 Code:

R-PDIP-T16

JESD-609 Code:

e4

Length:

19.305 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

5.2 Amp

No. of Bits:

8

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Packing Method:

TUBE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

2/6

Maximum Power Supply Current (ICC):

.16 mA

Propagation Delay At Nominal Supply:

30 ns

Propagation Delay (tpd):

225 ns

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Sub-Category:

Decoder/Drivers

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

4.5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7.62 mm

Trade Compliance

CD74HC238E Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-444-8189, 5962014448189

NIIN

014448189

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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