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SN74LVC138APWTE4

Texas Instruments

SN74LVC138APWTE4 by Texas Instruments

SN74LVC138APWTE4 by Texas Instruments is a CMOS Decoder & Driver with 16 terminals. It operates at a supply voltage range of 1.65V to 3.6V and has a propagation delay of 22ns. This IC is suitable for industrial applications requiring inverted output polarity and standard input conditioning, with a compact package style ideal for surface mount assembly.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 6,770 parts In-Stock

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Digiode

USA . 4,307 parts In-Stock

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Nova Conductors

Japan . 10 parts In-Stock

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10

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AZTECH Wire

Italy . 443 parts In-Stock

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$7.583

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Parana Technologies

USA . 506 parts In-Stock

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$12.167

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$12.581

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506

$12.167

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DigiPath Technology Company

USA . 381 parts In-Stock

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$13.398

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$13.398

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ChromeModa Solutions

Germany . 4,819 parts In-Stock

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$13.671

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$11.210

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$13.671

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IDEA Electronic Components Group

UK . 423 parts In-Stock

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$13.671

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$12.987

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$12.304

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One Stop Electronics

USA . 1,601 parts In-Stock

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$16.000

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Ampacity Inc.

Singapore . 1,557 parts In-Stock

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$17.000

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Semicontronic

India . 409 parts In-Stock

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$25.000

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$24.375

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$24.250

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Corohmni

South Africa . 924 parts In-Stock

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Advanced Electronics

New Zealand . 1,000 parts In-Stock

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Continental Prestige Electronics

USA . 4,591 parts In-Stock

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Corphita

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Argo Parts USA

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Bastille Electronics

Australia . 96 parts In-Stock

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Overview

Experience the superior quality and reliability of Texas Instruments with the SN74LVC138APWTE4 Decoder & Driver. Perfect for a variety of applications, this product offers fast propagation delay and low power consumption, making it ideal for industrial use. With its inverted output polarity and standard input conditioning, this decoder provides efficient performance in a compact and durable package. Trust Texas Instruments to deliver innovative solutions that exceed your expectations and enhance your projects. Unlock the full potential of your designs with the SN74LVC138APWTE4.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and reliability to the product, making it a good choice for long-term use.

Propagation Delay At Nominal Supply: 6.7 ns

The low propagation delay ensures fast signal processing, making this product ideal for applications requiring quick response times.

Surface Mount: YES

The surface mount feature allows for easy installation and space-saving on PCBs, making this product convenient and practical for compact designs.

Input Conditioning: STANDARD

The standard input conditioning ensures compatibility with a wide range of signal inputs, making this product versatile and suitable for various applications.

Package Shape: RECTANGULAR

The rectangular package shape enables efficient placement on a PCB, optimizing space utilization and making this product ideal for designs with space constraints.

Nominal Supply Voltage / Vsup (V): 1.8

The low nominal supply voltage enhances energy efficiency and reduces power consumption, making this product a cost-effective and environmentally friendly choice.

Power Supplies (V): 3.3

The dual power supplies provide flexibility in voltage selection, allowing compatibility with different power sources and making this product versatile and adaptable.

No. of Terminals: 16

The ample number of terminals enables connectivity to multiple external components, enhancing functionality and expanding the capabilities of this product.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The compact package style with a thin profile and shrink pitch saves space on PCBs and enhances aesthetics, making this product suitable for sleek and modern designs.

Maximum I (ol): 24 Amp

The high maximum output current capacity allows for driving demanding loads, making this product suitable for power-intensive applications.

Propagation Delay (tpd): 22 ns

The low propagation delay ensures minimal signal lag, enabling real-time data processing and making this product ideal for high-speed applications.

Maximum Operating Temperature: 85°C

The high maximum operating temperature range ensures reliable performance in harsh environmental conditions, making this product suitable for industrial applications.

Minimum Operating Temperature: -40°C

The low minimum operating temperature range ensures functionality in cold environments, making this product suitable for outdoor and automotive applications.

Terminal Finish: NICKEL PALLADIUM GOLD

The terminal finish provides corrosion resistance and ensures stable electrical connections, making this product durable and reliable in various operating conditions.

Terminal Position: DUAL

The dual terminal position allows for flexible mounting orientation, enhancing installation options and making this product adaptable to different layouts.

Maximum Seated Height: 1.2 mm

The low maximum seated height enables a slim profile on PCBs, optimizing space utilization and making this product suitable for compact designs.

Width: 4.4 mm

The compact width saves space on PCBs, making this product suitable for designs with limited board space and multiple components.

Output Polarity: INVERTED

The inverted output polarity ensures compatibility with specific applications requiring this configuration, making this product versatile and customizable.

Minimum Supply Voltage (Vsup): 1.65 V

The low minimum supply voltage allows operation in low-power conditions, making this product energy-efficient and suitable for battery-powered applications.

Maximum Time At Peak Reflow Temperature (s): 30

The specified reflow time ensures proper soldering and assembly, ensuring the reliability and longevity of this product in manufacturing processes.

Peak Reflow Temperature °C: 260

The high peak reflow temperature capability ensures compatibility with standard soldering processes, making this product easy to integrate into production lines.

Length: 5 mm

The compact length saves space on PCBs, enabling efficient board layout and making this product suitable for designs with size constraints.

Temperature Grade: INDUSTRIAL

The industrial temperature grade rating ensures reliable performance in demanding operating conditions, making this product suitable for rugged industrial applications.

Technology: CMOS

The CMOS technology offers low power consumption and noise immunity, making this product energy-efficient and reliable for various digital applications.

Terminal Form: GULL WING

The gull wing terminal form facilitates easy soldering and assembly, ensuring a secure and stable connection in manufacturing processes.

Packing Method: TR

The tape and reel packing method simplifies handling and storage, ensuring efficient manufacturing processes and making this product convenient for bulk production.

Terminal Pitch: 0.65 mm

The narrow terminal pitch allows for high-density mounting on PCBs, optimizing space utilization and enabling compact designs with multiple components.

Maximum Supply Voltage (Vsup): 3.6 V

The high maximum supply voltage tolerance ensures compatibility with various power sources and voltage levels, making this product versatile and adaptable to different operating conditions.

Technical Specifications

Decoder & Drivers SN74LVC138APWTE4 attributes and parameters. Explore more Decoder & Drivers devices from Texas Instruments

Specs

Additional Features:

TWO ACTIVE-LOW AND ONE ACTIVE-HIGH ENABLE INPUTS

Family:

LVC/LCX/Z

Input Conditioning:

STANDARD

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

5 mm

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Polarity:

INVERTED

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

6.7 ns

Propagation Delay (tpd):

22 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Decoder/Drivers

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Trade Compliance

SN74LVC138APWTE4 Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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