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74HCT238D,652

NXP Semiconductors

74HCT238D,652 by NXP Semiconductors

NXP Semiconductors' 74HCT238D,652 is a CMOS decoder with 53ns propagation delay at 5V. It has 16 terminals, operates b/w -40 to 125 °C, and supports a load capacitance of 50pF. Ideal for automotive applications due to its small outline package and true output polarity.

Median Price

$0.664

Lifecycle Status

Suppliers In-Stock

16

In-Stock Inventory

1k+

Distributors (Authorized)

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Farnell

UK . 16,043 parts In-Stock

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$0.965

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$0.602

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$0.510

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$0.965

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Rochester

USA . 15,838 parts In-Stock

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$0.652

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$0.541

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$0.483

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Verical

USA . 14,000 parts In-Stock

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$0.677

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$0.604

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Arrow

USA . 1,962 parts In-Stock

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Chip1Stop

Japan . 1,796 parts In-Stock

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DigiKey

USA . 367 parts In-Stock

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Nova Conductors

Japan . 10 parts In-Stock

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Digiode

USA . 2,602 parts In-Stock

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Chip Stock

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Vyrian

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LIBRA Elektronik GmbH

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Anansix

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Connector Distribution Corp

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Right Parts Inc.

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Corphita

USA . 2,052 parts In-Stock

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AZTECH Wire

Italy . 9,542 parts In-Stock

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Continental Prestige Electronics

USA . 1,367 parts In-Stock

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$0.602

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Corohmni

South Africa . 82 parts In-Stock

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Perfect Parts

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Authorized Procurement Solutions

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UNI Independent Distributors

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Argo Parts USA

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Microchip USA

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Supply Digital

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Netroflash

USA . 100 parts In-Stock

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Overview

Experience unparalleled quality and reliability with the 74HCT238D,652 by NXP Semiconductors. As a leading manufacturer in the industry, NXP Semiconductors delivers top-notch Decoder & Drivers products like this one, designed to meet your needs with precision. Whether you're in automotive or industrial applications, this product offers exceptional value with its fast propagation delay, low power consumption, and wide operating temperature range. Trust NXP Semiconductors to provide cutting-edge solutions that exceed expectations and enhance your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material helps in reducing the overall weight of the product and makes it easier to handle and install.

Propagation Delay At Nominal Supply: 53 ns

The low propagation delay ensures fast signal processing and response, making this product suitable for applications where quick reaction times are required.

Surface Mount: YES

Being surface mountable makes the product suitable for automated assembly processes, saving time and effort in production.

Input Conditioning: STANDARD

Standard input conditioning ensures compatibility with a wide range of input signals, making this product versatile and easy to integrate into different systems.

Nominal Supply Voltage / Vsup (V): 5

Operating at a commonly used supply voltage of 5V makes the product compatible with a wide range of systems and power sources.

Load Capacitance (CL): 50 pF

The low load capacitance helps in reducing power consumption and minimizes signal distortion, improving the overall performance of the product.

Power Supplies (V): 5

Having a single power supply voltage simplifies the power management and circuit design, making the product more cost-effective and easier to use.

No. of Terminals: 16

Having a sufficient number of terminals allows for versatile connections and configurations, enhancing the flexibility and usability of the product.

Maximum I (ol): 4 Amp

The high maximum output current capability allows the product to drive heavy loads without the need for additional external components, making it a reliable and efficient choice.

Maximum Operating Temperature: 125 °C

The wide operating temperature range enables the product to function reliably in harsh environmental conditions, making it suitable for a variety of applications.

Technology: CMOS

The CMOS technology used in the product provides low power consumption, high noise immunity, and compatibility with a wide range of systems, ensuring reliable performance and efficiency.

Technical Specifications

Decoder & Drivers 74HCT238D,652 attributes and parameters. Explore more Decoder & Drivers devices from NXP Semiconductors

Specs

Additional Features:

3 ENABLE INPUTS

Family:

HCT

Input Conditioning:

STANDARD

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

9.9 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

4 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Propagation Delay At Nominal Supply:

53 ns

Propagation Delay (tpd):

53 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Decoder/Drivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

74HCT238D,652 Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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