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SN54248W-10

Texas Instruments

SN54248W-10 by Texas Instruments

SN54248W-10 by Texas Instruments is a TTL decoder with 16 terminals, operating at a supply voltage range of 4.5V to 5.5V. It has a propagation delay of 100ns and can handle load capacitance up to 15pF. Ideal for military applications due to its temperature grade and flatpack package style.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,715 parts In-Stock

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8,715

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Digiode

USA . 4,501 parts In-Stock

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4,501

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,105 parts In-Stock

1+ parts

$7.427

100+ parts

-

1k+ parts

$7.915

10k+ parts

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1,105

$7.427

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$7.915

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DigiPath Technology Company

USA . 1,404 parts In-Stock

1+ parts

$8.178

100+ parts

$7.524

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-

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1,404

$8.178

$7.524

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IDEA Electronic Components Group

UK . 712 parts In-Stock

1+ parts

$8.345

100+ parts

$7.928

1k+ parts

$7.510

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-

712

$8.345

$7.928

$7.510

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ChromeModa Solutions

Germany . 692 parts In-Stock

1+ parts

$8.345

100+ parts

$6.843

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692

$8.345

$6.843

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AZTECH Wire

Italy . 548 parts In-Stock

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$10.381

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548

$10.381

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One Stop Electronics

USA . 470 parts In-Stock

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$26.000

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470

$26.000

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Corphita

USA . 209 parts In-Stock

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Overview

Enhance your electronics projects with the premium quality SN54248W-10 by Texas Instruments, a leading manufacturer in the industry. This Decoder & Drivers package boasts a MILITARY-grade temperature grade and true output polarity, ensuring reliability and precision in your applications. With a flatpack package style and dual terminal position, this versatile component offers seamless integration and efficient performance. Trust in Texas Instruments to deliver top-notch technology that exceeds expectations and enhances your designs. Elevate your projects with the SN54248W-10 and experience the difference in quality and value it brings to your work.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

The ceramic, glass-sealed package body material ensures durability and reliability for long-term use.

Surface Mount: YES

Being surface mountable makes it easier to integrate into circuit boards, saving space and improving the overall layout.

Nominal Supply Voltage / Vsup (V): 5

Having a standard supply voltage of 5V makes it compatible with a wide range of systems and applications.

Propagation Delay (tpd): 100 ns

The low propagation delay of 100 ns ensures fast signal processing, ideal for time-sensitive applications.

Temperature Grade: MILITARY

The military-grade temperature tolerance ensures stable performance in harsh environmental conditions.

Technology: TTL

Using TTL technology ensures compatibility with other TTL devices, making it easier to integrate into existing systems.

Technical Specifications

Decoder & Drivers SN54248W-10 attributes and parameters. Explore more Decoder & Drivers devices from Texas Instruments

Specs

Family:

TTL/H/L

Input Conditioning:

STANDARD

JESD-30 Code:

R-GDFP-F16

Length:

10.2 mm

Load Capacitance (CL):

15 pF

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

TRUE

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DFP

Package Shape:

Package Style (Meter):

FLATPACK

Maximum Power Supply Current (ICC):

90 mA

Propagation Delay (tpd):

100 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.03 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

6.73 mm

Trade Compliance

SN54248W-10 Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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