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SN74HCT137DW

Texas Instruments

SN74HCT137DW by Texas Instruments

SN74HCT137DW by Texas Instruments is a CMOS decoder & driver with 16 terminals, operating at temperatures from -40 to 85°C. It has a supply voltage of 5V and comes in a small outline rectangular package suitable for surface mounting applications. Ideal for industrial use due to its robust design and gull wing terminal form.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,482 parts In-Stock

1+ parts

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4,482

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Vyrian

USA . 2,812 parts In-Stock

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2,812

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Resion

USA . 395 parts In-Stock

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395

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Distributors (Availability)

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AZTECH Wire

Italy . 850 parts In-Stock

1+ parts

$10.226

100+ parts

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850

$10.226

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Parana Technologies

USA . 274 parts In-Stock

1+ parts

$16.020

100+ parts

-

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$16.364

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274

$16.020

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$16.364

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DigiPath Technology Company

USA . 2,099 parts In-Stock

1+ parts

$17.640

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2,099

$17.640

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ChromeModa Solutions

Germany . 2,850 parts In-Stock

1+ parts

$18.000

100+ parts

$14.760

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2,850

$18.000

$14.760

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IDEA Electronic Components Group

UK . 105 parts In-Stock

1+ parts

$18.000

100+ parts

$17.100

1k+ parts

$16.200

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105

$18.000

$17.100

$16.200

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One Stop Electronics

USA . 1,218 parts In-Stock

1+ parts

$44.000

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1,218

$44.000

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Corphita

USA . 696 parts In-Stock

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696

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Overview

Unlock the power of precision with the SN74HCT137DW by Texas Instruments. This top-of-the-line decoder & driver delivers unmatched quality and reliability, making it the perfect choice for a wide range of applications. With Texas Instruments' reputation for excellence in manufacturing, you can trust that this product will exceed your expectations. Experience seamless performance and unparalleled efficiency with the SN74HCT137DW, providing you with the value, benefits, and advantages you need to succeed in today's competitive market.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material ensures durability and reliability of the product, making it suitable for long-term use in various applications.

Surface Mount: YES

Surface mount capability allows for easy installation and integration into circuit boards, saving space and simplifying assembly processes.

Package Shape: RECTANGULAR

Rectangular package shape provides efficient use of space, allowing for compact design and optimal placement on PCBs.

Nominal Supply Voltage / Vsup (V): 5

Operating at a nominal supply voltage of 5V ensures compatibility with standard power sources, making it versatile and easy to incorporate into existing systems.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, this product can withstand high temperatures, ensuring reliability in demanding industrial environments.

Technical Specifications

Decoder & Drivers SN74HCT137DW attributes and parameters. Explore more Decoder & Drivers devices from Texas Instruments

Specs

JESD-30 Code:

R-PDSO-G16

Logic IC Type:

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

5

Qualification:

Not Qualified

Sub-Category:

Decoder/Drivers

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Trade Compliance

SN74HCT137DW Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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