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5962-8406201VFA

Texas Instruments

5962-8406201VFA by Texas Instruments

Texas Instruments 5962-8406201VFA is an 8-bit decoder with a propagation delay of 45ns at 5V. It has a max operating temperature of 125°C and is MILITARY grade suitable for applications requiring fast response times and high reliability in harsh environments.

Median Price

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Lifecycle Status

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3

In-Stock Inventory

1k+

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Digiode

USA . 6,233 parts In-Stock

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Vyrian

USA . 3,451 parts In-Stock

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Anansix

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Native Components

USA . 455 parts In-Stock

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$0.048

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$0.046

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AZTECH Wire

Italy . 701 parts In-Stock

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$5.409

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IDEA Electronic Components Group

UK . 3,643 parts In-Stock

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One Stop Electronics

USA . 1,182 parts In-Stock

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DigiPath Technology Company

USA . 1,211 parts In-Stock

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MKK Technologies

India . 1,155 parts In-Stock

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ChromeModa Solutions

Germany . 1,263 parts In-Stock

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$33.050

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$27.101

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Authorized Procurement Solutions

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Microchip USA

USA . 4,962 parts In-Stock

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Corphita

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Northwest PG Solutions

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Parana Technologies

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Overview

Enhance your electronic projects with the top-tier quality of Texas Instruments' 5962-8406201VFA decoder & driver. This ceramic, glass-sealed package boasts a lightning-fast propagation delay of 45 ns, making it ideal for military-grade applications. With 8 bits, this rectangular flatpack offers inverted output polarity and standard input conditioning. Trust in Texas Instruments to deliver reliable, high-performance components that exceed expectations. Elevate your designs with the unmatched precision and efficiency of the 5962-8406201VFA.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

Ceramic and glass-sealed package body material provides high durability, ensuring the product can withstand harsh environments and temperature fluctuations.

Propagation Delay At Nominal Supply: 45 ns

Low propagation delay ensures quick response times, making it suitable for time-sensitive applications.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation on circuit boards, saving space and simplifying the manufacturing process.

Nominal Supply Voltage / Vsup (V): 5

Operates at a standard 5V supply voltage, making it compatible with a wide range of components and systems.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, the product can function reliably in challenging thermal conditions without overheating.

Technical Specifications

Decoder & Drivers 5962-8406201VFA attributes and parameters. Explore more Decoder & Drivers devices from Texas Instruments

Specs

Additional Features:

3 ENABLE INPUTS

Family:

HC/UH

Input Conditioning:

STANDARD

JESD-30 Code:

R-GDFP-F16

JESD-609 Code:

e0

Length:

10.16 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

5.2 Amp

No. of Bits:

8

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

INVERTED

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

QFF

Package Equivalence Code:

FL16,.3

Package Shape:

Package Style (Meter):

FLATPACK

Packing Method:

TUBE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

2/6

Maximum Power Supply Current (ICC):

.16 mA

Propagation Delay At Nominal Supply:

45 ns

Propagation Delay (tpd):

270 ns

Qualification:

Qualified

Screening Level:

MIL-PRF-38535

Maximum Seated Height:

2.03 mm

Sub-Category:

Decoder/Driver

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

6.73 mm

Trade Compliance

5962-8406201VFA Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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