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JM38510/01001BFA

Texas Instruments

JM38510/01001BFA by Texas Instruments

JM38510/01001BFA by Texas Instruments is a 16-terminal decoder with inverted output polarity, operating at -55 to 125 °C. Featuring a propagation delay of 30 ns and load capacitance of 15 pF, it is ideal for military-grade applications requiring standard input conditioning and a nominal voltage of 5 V.

Median Price

$9.706

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (In-Stock)

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Freelance Electronics

USA . 4 parts In-Stock

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$9.706

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Vyrian

USA . 4,114 parts In-Stock

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Digiode

USA . 540 parts In-Stock

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Mil-Aero Solutions, Inc.

USA . 336 parts In-Stock

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Electronic Expediters

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Resion

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NAC Semi

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Sunrise Surplus Inc.

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One Stop Electronics

USA . 1,220 parts In-Stock

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$4.000

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Parana Technologies

USA . 1,949 parts In-Stock

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$11.626

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$12.021

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DigiPath Technology Company

USA . 391 parts In-Stock

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$12.802

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$11.778

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AZTECH Wire

Italy . 295 parts In-Stock

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ChromeModa Solutions

Germany . 4,902 parts In-Stock

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IDEA Electronic Components Group

UK . 164 parts In-Stock

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Overview

Elevate your electronic projects with the top-notch quality of the JM38510/01001BFA decoder and drivers by Texas Instruments. Designed with precision and reliability in mind, this ceramic, glass-sealed package offers exceptional performance in a wide range of applications. With a nominal supply voltage of 5V and fast propagation delay of 30ns, this versatile component ensures efficient signal decoding and driving. Whether you're working on military-grade systems or commercial electronics, this Texas Instruments product delivers unmatched value and benefits to meet all your project requirements.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

This material provides durability and protection for the components inside, ensuring a longer lifespan for the product.

Surface Mount: YES

Allows for easy installation on circuit boards, saving time and effort during assembly.

Nominal Supply Voltage / Vsup (V): 5

Stable supply voltage ensures consistent performance of the product under various conditions.

Propagation Delay (tpd): 30 ns

Low propagation delay ensures fast response time, making this product suitable for high-speed applications.

Maximum Operating Temperature: 125 °C

Wide operating temperature range allows this product to be used in harsh environments without compromising performance.

Technology: TTL

TTL technology provides reliable and robust logic operations, making this product dependable for various applications.

Technical Specifications

Decoder & Drivers JM38510/01001BFA attributes and parameters. Explore more Decoder & Drivers devices from Texas Instruments

Specs

Family:

TTL/H/L

Input Conditioning:

STANDARD

JESD-30 Code:

R-GDFP-F16

Length:

10.2 mm

Load Capacitance (CL):

15 pF

Logic IC Type:

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

INVERTED

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DFP

Package Shape:

Package Style (Meter):

FLATPACK

Maximum Power Supply Current (ICC):

41 mA

Propagation Delay (tpd):

30 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.03 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

6.73 mm

Trade Compliance

JM38510/01001BFA Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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