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CD74HC138M96G4

Texas Instruments

CD74HC138M96G4 by Texas Instruments

CD74HC138M96G4 by Texas Instruments is a 16-terminal decoder with 45ns propagation delay at 4.5V, suitable for military applications. It features inverted output polarity, CMOS technology, and operates b/w -55 to 125°C. The package is small outline with gull wing terminals for surface mount assembly.

Median Price

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Lifecycle Status

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3

In-Stock Inventory

1k+

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Vyrian

USA . 3,315 parts In-Stock

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Digiode

USA . 3,180 parts In-Stock

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Nova Conductors

Japan . 300 parts In-Stock

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One Stop Electronics

USA . 196 parts In-Stock

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$11.000

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AZTECH Wire

Italy . 211 parts In-Stock

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$19.658

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Parana Technologies

USA . 2,273 parts In-Stock

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$21.115

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DigiPath Technology Company

USA . 43 parts In-Stock

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$23.250

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$21.390

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IDEA Electronic Components Group

UK . 2,117 parts In-Stock

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$23.725

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$22.539

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$21.352

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ChromeModa Solutions

Germany . 520 parts In-Stock

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$23.725

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Ampacity Inc.

Singapore . 614 parts In-Stock

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$59.000

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Perfect Parts

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Continental Prestige Electronics

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Argo Parts USA

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Corphita

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Bastille Electronics

Australia . 300 parts In-Stock

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Overview

Unlock the power of efficient signal decoding with the CD74HC138M96G4 by Texas Instruments. With a reputation for quality and reliability, Texas Instruments delivers top-notch products in the Decoder & Drivers category. This versatile decoder offers fast propagation delay and standard input conditioning, making it ideal for a wide range of applications. From industrial automation to consumer electronics, this product provides value, efficiency, and precision. Upgrade your designs with Texas Instruments and experience unparalleled performance.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material ensures durability and resistance to environmental factors, making the product suitable for a variety of applications.

Propagation Delay At Nominal Supply: 45 ns

Low propagation delay provides fast response time, allowing for efficient processing of signals.

Surface Mount: YES

Surface mount capability enables easy installation and space-saving design, perfect for compact electronic devices.

Nominal Supply Voltage / Vsup (V): 4.5

Operates at a standard supply voltage, ensuring compatibility with most electronic systems.

Input Conditioning: STANDARD

Standard input conditioning simplifies the integration process and ensures compatibility with other components.

No. of Terminals: 16

Provides flexibility for connecting multiple inputs and outputs, making it suitable for complex circuit designs.

Output Polarity: INVERTED

Inverted output polarity offers versatility in signal processing and allows for a wider range of applications.

Maximum Operating Temperature: 125 °C

High maximum operating temperature ensures reliability in harsh environments and under varying conditions.

Technology: CMOS

CMOS technology offers low power consumption, high speed, and compatibility with a wide range of applications.

Technical Specifications

Decoder & Drivers CD74HC138M96G4 attributes and parameters. Explore more Decoder & Drivers devices from Texas Instruments

Specs

Additional Features:

TWO ACTIVE LOW AND ONE ACTIVE HIGH ENABLE INPUTS

Family:

HC/UH

Input Conditioning:

STANDARD

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

9.9 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

4 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

INVERTED

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/6

Propagation Delay At Nominal Supply:

45 ns

Propagation Delay (tpd):

225 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Decoder/Drivers

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

4.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

CD74HC138M96G4 Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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