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54F138LMQB

Texas Instruments

54F138LMQB by Texas Instruments

The Texas Instruments 54F138LMQB is a TTL decoder with 20 terminals, operating b/w -55 to 125 °C. It has a propagation delay of 12 ns and inverted output polarity. Suitable for military applications, it features a ceramic-metal package body and standard input conditioning.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 5,397 parts In-Stock

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Digiode

USA . 4,273 parts In-Stock

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Anansix

USA . 2,450 parts In-Stock

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PAR Electronics

UK . 1 parts In-Stock

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Parana Technologies

USA . 890 parts In-Stock

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$10.027

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$10.584

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$10.027

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DigiPath Technology Company

USA . 1,789 parts In-Stock

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$11.041

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ChromeModa Solutions

Germany . 2,574 parts In-Stock

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$11.266

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$9.238

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IDEA Electronic Components Group

UK . 2,263 parts In-Stock

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$11.266

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$10.703

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$10.139

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AZTECH Wire

Italy . 417 parts In-Stock

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$18.074

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Native Components

USA . 975 parts In-Stock

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$45.360

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$43.546

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$43.546

Northwest PG Solutions

USA . 1,930 parts In-Stock

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$49.896

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One Stop Electronics

USA . 1,506 parts In-Stock

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Corphita

USA . 2,006 parts In-Stock

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Supply Digital

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Kepictronics

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Overview

Upgrade your electronic projects with the high-quality 54F138LMQB decoder & driver by Texas Instruments. Designed with precision and reliability in mind, this versatile component is perfect for a wide range of applications. With its advanced technology and military-grade temperature grade, you can trust that it will deliver exceptional performance every time. Experience the value and benefits of Texas Instruments' expertise in semiconductor manufacturing with the 54F138LMQB - your key to unlocking endless possibilities in electronics.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

Ceramic and metal-sealed cofired package body material provides excellent durability and reliability, making this product suitable for demanding industrial applications.

Input Conditioning: STANDARD

Standard input conditioning ensures compatibility with a wide range of input signals, making this decoder & driver versatile and easy to integrate into various systems.

Nominal Supply Voltage / Vsup (V): 5

Operating at a nominal supply voltage of 5V allows for easy power supply integration and compatibility with common power sources.

Propagation Delay (tpd): 12 ns

A low propagation delay of 12 ns results in fast response times, making this decoder & driver suitable for applications that require quick signal processing.

Temperature Grade: MILITARY

Military-grade temperature specifications ensure reliable operation in harsh environmental conditions, making this product ideal for military and aerospace applications.

Technology: TTL

Using TTL technology provides high-speed performance and compatibility with TTL logic systems, making this decoder & driver suitable for digital signal processing applications.

Technical Specifications

Decoder & Drivers 54F138LMQB attributes and parameters. Explore more Decoder & Drivers devices from Texas Instruments

Specs

Family:

F/FAST

Input Conditioning:

STANDARD

JESD-30 Code:

S-CQCC-N20

Length:

8.89 mm

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

INVERTED

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER

Propagation Delay (tpd):

12 ns

Maximum Seated Height:

1.905 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

8.89 mm

Trade Compliance

54F138LMQB Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-240-5119, 5962012405119, 5962-01-295-2341, 5962012952341

NIIN

012405119, 012952341

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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