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54F154/BLA

NXP Semiconductors

54F154/BLA by NXP Semiconductors

54F154/BLA by NXP Semiconductors is a TTL decoder/driver with a 5V nominal voltage and an inverted output polarity. It features a fast propagation delay of 11.5 ns and operates in extreme temperatures from -55 °C to 125 °C, ideal for military applications. Its ceramic, glass-sealed package ensures durability in harsh environments.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 2,677 parts In-Stock

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Anansix

USA . 1,743 parts In-Stock

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Vyrian

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One Stop Electronics

USA . 1,035 parts In-Stock

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$4.000

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UNI Independent Distributors

Spain . 6,283 parts In-Stock

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Corphita

USA . 2,622 parts In-Stock

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Northwest PG Solutions

USA . 1,475 parts In-Stock

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Native Components

USA . 667 parts In-Stock

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Overview

Unlock unparalleled performance and reliability with the 54F154/BLA from NXP Semiconductors. Designed for demanding applications, this military-grade decoder & driver ensures robust functionality in extreme conditions. Its high-quality ceramic and glass-sealed construction delivers exceptional durability, while a swift propagation delay of just 11.5 ns enhances system efficiency. Choose NXP for trusted technology that empowers your designs with precision and longevity.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

The ceramic, glass-sealed package provides excellent durability and protection against environmental factors, making the product highly reliable in harsh conditions.

Package Shape: RECTANGULAR

Rectangular packages are standardized and commonly used, allowing for easy integration into various circuit designs and layouts.

Nominal Supply Voltage / Vsup: 5 V

A nominal supply voltage of 5V makes this product compatible with a wide range of electronic systems, simplifying power management.

Load Capacitance (CL): 50 pF

With a load capacitance of 50 pF, this decoder/driver can effectively drive standard capacitive loads typical in digital circuits.

No. of Terminals: 24

The 24 terminals provide a versatile connection configuration, allowing for complex circuit designs and multiple interface options.

Package Style (Meter): IN-LINE

In-line package styles facilitate easy mounting and integration into PCB layouts, improving assembly efficiency.

Propagation Delay (tpd): 11.5 ns

A propagation delay of 11.5 ns ensures fast switching times, making the product suitable for high-speed applications.

Maximum Operating Temperature: 125 °C

A maximum operating temperature of 125 °C indicates the product is designed for high-temperature environments, making it reliable for demanding applications.

Minimum Operating Temperature: -55 °C

The capability to operate down to -55 °C makes this product ideal for use in extreme cold environments, expanding its application range.

Terminal Position: DUAL

Dual terminal positioning enhances connection flexibility in circuit designs and can facilitate better signal integrity.

Output Polarity: INVERTED

Inverted output polarity can be advantageous for specific circuit designs, allowing for easier signal integration into existing logic.

Minimum Supply Voltage (Vsup): 4.5 V

The lower minimum supply voltage of 4.5V helps ensure reliable operation in multiple power scenarios, accommodating different system requirements.

Temperature Grade: MILITARY

Military-grade temperature resilience guarantees reliability and performance in demanding military applications and environments.

Technology: TTL

Using TTL technology enhances speed and drive capability, suitable for modern digital applications that require robust performance.

Terminal Form: THROUGH-HOLE

Through-hole terminals facilitate stronger mechanical connections and are easier to solder, making assembly more straightforward.

Maximum Supply Voltage (Vsup): 5.5 V

A maximum supply voltage of 5.5V ensures the device can handle slight voltage fluctuations without compromising its performance.

Maximum Power Supply Current (ICC): 40 mA

A maximum current of 40 mA makes this decoder/driver efficient in terms of power consumption, providing necessary drive strength without excess energy use.

Technical Specifications

Decoder & Drivers 54F154/BLA attributes and parameters. Explore more Decoder & Drivers devices from NXP Semiconductors

Specs

Family:

F/FAST

JESD-30 Code:

R-GDIP-T24

Load Capacitance (CL):

50 pF

No. of Functions:

1

No. of Terminals:

24

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

INVERTED

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Maximum Power Supply Current (ICC):

40 mA

Propagation Delay (tpd):

11.5 ns

Qualification:

Not Qualified

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Position:

DUAL

Trade Compliance

54F154/BLA Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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