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54F139/BEA

NXP Semiconductors

54F139/BEA by NXP Semiconductors

54F139/BEA by NXP Semiconductors is a TTL decoder with dual functions, featuring a 5V nominal voltage and a fast propagation delay of 9.5 ns. It operates in extreme temperatures from -55 °C to 125 °C. Ideal for military applications, it comes in a ceramic, glass-sealed package.

Median Price

$63.790

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 1,753 parts In-Stock

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$63.790

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$59.960

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$56.140

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DigiKey

USA . 1,753 parts In-Stock

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Digiode

USA . 4,412 parts In-Stock

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$64.125

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Vyrian

USA . 3,510 parts In-Stock

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$67.500

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Anansix

USA . 2,452 parts In-Stock

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Zilex Electronics Inc.

Canada . 220 parts In-Stock

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Resion

USA . 178 parts In-Stock

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ComSIT Distribution GmbH

Germany . 5 parts In-Stock

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Distributors (Availability)

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Corphita

USA . 3,348 parts In-Stock

1+ parts

$60.750

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Component Stockers USA

USA . 1,854 parts In-Stock

1+ parts

$69.150

100+ parts

$65.000

1k+ parts

$58.780

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1,854

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Native Components

USA . 59 parts In-Stock

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$158.030

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$151.709

59

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$151.709

Northwest PG Solutions

USA . 1,394 parts In-Stock

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$173.833

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UNI Independent Distributors

Spain . 6,050 parts In-Stock

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Overview

Elevate your projects with the 54F139/BEA from NXP Semiconductors, where reliability meets excellence. Crafted for precision in decoding and driving applications, this military-grade component excels in demanding environments with a broad temperature range. The ceramic, glass-sealed design ensures durability, while its fast switching capabilities empower innovative solutions. Partner with NXP and unlock unparalleled performance and quality tailored for your success!

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

The ceramic, glass-sealed construction ensures durability and resistance to environmental factors, making this product reliable in demanding conditions.

No. of Functions: 2

With two functions, this decoder/driver offers versatile applications, maximizing utility in various electronic circuits.

Package Shape: RECTANGULAR

The rectangular package shape is ideal for efficient use of space on printed circuit boards (PCBs), facilitating easier integration.

Nominal Supply Voltage / Vsup: 5 V

The 5 V nominal supply voltage is standard for many digital applications, ensuring compatibility with a wide range of circuits.

Load Capacitance (CL): 50 pF

A load capacitance of 50 pF enables effective signal handling, optimizing performance in fast-switching environments.

No. of Terminals: 16

With 16 terminals, this decoder/driver allows for multiple connections, providing flexibility in circuit design.

Package Style (Meter): IN-LINE

The in-line package style is convenient for assembly processes, easing the machine placement during manufacturing.

Propagation Delay (tpd): 9.5 ns

A propagation delay of 9.5 ns ensures quick response times, making it suitable for high-speed applications.

Maximum Operating Temperature: 125 °C

Designed to operate at temperatures up to 125 °C, this product is reliable in high-heat environments, ensuring longevity.

Minimum Operating Temperature: -55 °C

With a minimum operating temperature of -55 °C, this decoder/driver is suitable for extreme temperature applications.

Terminal Position: DUAL

The dual terminal position design enhances accessibility and ease of connection for various configurations.

Maximum Seated Height: 5.08 mm

A compact seated height of 5.08 mm allows for dense PCB layouts, maximizing space efficiency.

Width: 7.62 mm

The width of 7.62 mm is standard, ensuring compatibility with typical PCB layouts and reducing design complexities.

Output Polarity: INVERTED

The inverted output polarity can be beneficial in specific applications, making it suitable for unique circuit requirements.

Minimum Supply Voltage (Vsup): 4.5 V

A minimum supply voltage of 4.5 V provides flexibility for various power supply options while maintaining stable operation.

Temperature Grade: MILITARY

Being classified as military grade indicates robust reliability and performance in harsh environments, ensuring quality control.

Technology: TTL

The TTL (Transistor-Transistor Logic) technology enhances speed and power efficiency, making it suitable for modern applications.

Terminal Form: THROUGH-HOLE

The through-hole terminal form provides a strong mechanical connection, enhancing durability and stability in the assembly.

Terminal Pitch: 2.54 mm

A standard terminal pitch of 2.54 mm ensures easy handling and compatibility with common PCB layouts.

Maximum Supply Voltage (Vsup): 5.5 V

A maximum supply voltage of 5.5 V offers protection against over-voltage scenarios, prolonging the operational lifespan.

Maximum Power Supply Current (ICC): 20 mA

With a maximum current of 20 mA, this product is energy-efficient while providing adequate power for its functions.

Technical Specifications

Decoder & Drivers 54F139/BEA attributes and parameters. Explore more Decoder & Drivers devices from NXP Semiconductors

Specs

Family:

F/FAST

JESD-30 Code:

R-GDIP-T16

Load Capacitance (CL):

50 pF

No. of Functions:

2

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

INVERTED

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Maximum Power Supply Current (ICC):

20 mA

Propagation Delay (tpd):

9.5 ns

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

54F139/BEA Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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