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54F139/BFA

NXP Semiconductors

54F139/BFA by NXP Semiconductors

54F139/BFA by NXP Semiconductors is a dual-function TTL decoder with a propagation delay of just 9.5 ns. It operates within a supply voltage range of 4.5-5.5 V and supports load capacitance up to 50 pF, making it ideal for military applications in harsh environments. Its ceramic, metal-sealed package ensures durability and reliability.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Digiode

USA . 3,143 parts In-Stock

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Anansix

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Vyrian

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Native Components

USA . 743 parts In-Stock

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Northwest PG Solutions

USA . 1,584 parts In-Stock

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One Stop Electronics

USA . 1,209 parts In-Stock

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UNI Independent Distributors

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Corphita

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Overview

Unlock superior performance with the 54F139/BFA from NXP Semiconductors, a leading name in innovation and quality. Engineered for reliability in challenging environments, this versatile decoder and driver excels in military and industrial applications. With its robust ceramic package and low propagation delay, it ensures rapid and accurate signal processing. Trust NXP to deliver unmatched value, enhancing your designs with efficiency and durability that stand the test of time.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

The durable ceramic and metal-sealed co-fired package enhances reliability and minimizes environmental stress, making it suitable for harsh applications.

Surface Mount: YES

Surface mount capability allows for efficient PCB space utilization and facilitates automated assembly, improving manufacturing efficiency.

No. of Functions: 2

Having two functions increases versatility, allowing for more complex operations within a single device, thus saving space and costs.

Package Shape: RECTANGULAR

The rectangular package shape is a standard form factor, ensuring ease of integration into existing designs and providing good thermal performance.

Nominal Supply Voltage / Vsup: 5V

Operating at a nominal supply voltage of 5V makes this product compatible with various digital logic systems, simplifying design integration.

Load Capacitance (CL): 50 pF

Low load capacitance improves switching speed and enhances overall circuit performance, making it ideal for high-speed applications.

No. of Terminals: 16

The 16 terminals provide ample connections for multiple input and output paths, increasing system flexibility and capability.

Package Style (Meter): FLATPACK

The flatpack style minimizes height and contributes to a low-profile design, ideal for compact electronic assemblies.

Propagation Delay (tpd): 9.5 ns

A propagation delay of 9.5 ns indicates high-speed operation, making it suitable for applications requiring rapid signal processing.

Maximum Operating Temperature: 125 °C

A maximum operating temperature of 125 °C ensures reliable performance in high-temperature environments, suitable for military and industrial applications.

Minimum Operating Temperature: -55 °C

The ability to operate down to -55 °C makes this product ideal for extreme environmental conditions, enhancing its application range.

Terminal Position: DUAL

Dual terminal position enhances flexibility in design and layout, allowing for better routing options on circuit boards.

Output Polarity: INVERTED

Inverted output polarity is beneficial for specific logic implementations, allowing designers to simplify circuit designs dependent on this behavior.

Minimum Supply Voltage (Vsup): 4.5 V

A minimum supply voltage of 4.5 V allows for operation in a range of lower voltage configurations, increasing compatibility with various systems.

Temperature Grade: MILITARY

Rated for military-grade applications, this component meets stringent reliability standards essential for defense and aerospace sectors.

Technology: TTL

Utilizing TTL technology ensures fast switching speeds and compatibility with existing TTL logic systems, which are widely used in electronics.

Terminal Form: FLAT

Flat terminals support surface-mount technology, which not only saves space but also improves assembly reliability and reduces production costs.

Maximum Supply Voltage (Vsup): 5.5 V

A maximum supply voltage of 5.5 V provides a reasonable range for operation, ensuring robust performance without compromising safety margins.

Maximum Power Supply Current (ICC): 20 mA

With a maximum power supply current of 20 mA, this product offers efficient power management while ensuring sufficient drive capability for connected loads.

Technical Specifications

Decoder & Drivers 54F139/BFA attributes and parameters. Explore more Decoder & Drivers devices from NXP Semiconductors

Specs

Family:

F/FAST

JESD-30 Code:

R-CDFP-F16

Load Capacitance (CL):

50 pF

No. of Functions:

2

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

INVERTED

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

DFP

Package Shape:

Package Style (Meter):

FLATPACK

Maximum Power Supply Current (ICC):

20 mA

Propagation Delay (tpd):

9.5 ns

Qualification:

Not Qualified

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Position:

DUAL

Trade Compliance

54F139/BFA Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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