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54F138/B2A

NXP Semiconductors

54F138/B2A by NXP Semiconductors

54F138/B2A by NXP Semiconductors is a TTL decoder/driver with a 5V nominal voltage, featuring a fast propagation delay of 9.5 ns. It operates in extreme temperatures from -55 °C to 125 °C and supports surface mount applications. Ideal for military use, it has a compact chip carrier design with no lead terminals.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 3,526 parts In-Stock

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Anansix

USA . 1,773 parts In-Stock

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Vyrian

USA . 438 parts In-Stock

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438

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Zilex Electronics Inc.

Canada . 15 parts In-Stock

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One Stop Electronics

USA . 809 parts In-Stock

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$21.000

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809

$21.000

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UNI Independent Distributors

Spain . 3,914 parts In-Stock

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Corphita

USA . 1,779 parts In-Stock

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Northwest PG Solutions

USA . 844 parts In-Stock

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Native Components

USA . 147 parts In-Stock

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Overview

Unleash the power of precision with the 54F138/B2A from NXP Semiconductors! This high-quality decoder and driver is expertly designed for reliable performance in demanding environments, making it ideal for military applications. With thermal resilience and a compact chip carrier package, it offers exceptional efficiency while reducing board space. Trust NXP's legacy of innovation and elevate your designs with unmatched reliability and superior functionality!

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

The durable ceramic and metal-sealed co-fired package ensures high reliability and protection against environmental stresses, making this product suitable for demanding applications.

Surface Mount: YES

Surface mount capability allows for easy integration into compact designs, enhancing layout flexibility and reducing assembly costs.

Package Shape: SQUARE

A square package shape provides efficient use of PCB space and facilitates high-density designs.

Nominal Supply Voltage / Vsup (V): 5

Operating at a nominal supply voltage of 5V aligns with standard logic levels, ensuring compatibility with a wide range of digital circuits.

Load Capacitance (CL): 50 pF

A low load capacitance of 50 pF allows for faster switching speeds, improving overall circuit performance.

No. of Terminals: 20

With 20 terminals, this product offers multiple input/output options, catering to complex signal routing needs.

Package Style (Meter): CHIP CARRIER

The chip carrier style enhances thermal performance and provides a stable platform for high-frequency applications.

Propagation Delay (tpd): 9.5 ns

A propagation delay of 9.5 ns ensures quick response times, making this decoder/driver suitable for high-speed digital systems.

Maximum Operating Temperature: 125 °C

With a maximum operating temperature of 125 °C, this product is ideal for use in high-temperature environments, enhancing its versatility.

Minimum Operating Temperature: -55 °C

A minimum operating temperature of -55 °C ensures reliable performance in extreme cold conditions, making it suitable for aerospace and military applications.

Terminal Position: QUAD

The quad terminal position facilitates better signal routing and enhances the ease of soldering in array configurations.

Output Polarity: INVERTED

The inverted output polarity is beneficial for specific logical circuit designs, providing greater flexibility in circuit implementation.

Minimum Supply Voltage (Vsup): 4.5 V

With a minimum supply voltage of 4.5V, this device is flexible in various circuit configurations, making it easier to integrate into existing systems.

Temperature Grade: MILITARY

Rated for military temperature grades, this product meets stringent reliability and performance criteria required for defense applications.

Technology: TTL

Using TTL technology ensures compatibility with other TTL devices and allows for easy interfacing with a variety of digital components.

Terminal Form: NO LEAD

The no-lead terminal form offers reduction in space requirements on the PCB and enhances reliability through better solder joint performance.

Maximum Supply Voltage (Vsup): 5.5 V

With a maximum supply voltage of 5.5V, this product provides a safe operating range, reducing the risk of damage from voltage spikes.

Maximum Power Supply Current (ICC): 20 mA

A maximum power supply current of 20 mA allows for efficient power usage while providing sufficient drive capability for most applications.

Technical Specifications

Decoder & Drivers 54F138/B2A attributes and parameters. Explore more Decoder & Drivers devices from NXP Semiconductors

Specs

Additional Features:

3 ENABLE INPUTS

Family:

F/FAST

JESD-30 Code:

S-CQCC-N20

Load Capacitance (CL):

50 pF

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

INVERTED

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER

Maximum Power Supply Current (ICC):

20 mA

Propagation Delay (tpd):

9.5 ns

Qualification:

Not Qualified

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Position:

QUAD

Trade Compliance

54F138/B2A Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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