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SN74LS139AD

Texas Instruments

SN74LS139AD by Texas Instruments

SN74LS139AD by Texas Instruments is a TTL decoder with 2 functions, 4 bits, and inverted output polarity. It has a propagation delay of 33 ns at 5V supply voltage, suitable for applications requiring fast response times in commercial temperature environments. This small outline package with gull wing terminals is ideal for surface mount designs with standard input conditioning.

Median Price

$0.540

Lifecycle Status

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24

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1k+

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Mouser Electronics

USA . 78 parts In-Stock

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$0.840

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-

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$0.492

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$0.468

78

$0.840

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$0.492

$0.468

Rochester

USA . 22,452 parts In-Stock

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-

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$0.472

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$0.392

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$0.349

22,452

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$0.472

$0.392

$0.349

DigiKey

USA . 22,452 parts In-Stock

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$0.590

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Verical

USA . 15,040 parts In-Stock

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$0.490

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$0.436

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$0.490

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Digiode

USA . 3,199 parts In-Stock

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$0.338

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Nova Conductors

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$0.339

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100

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Component Electronics Inc.

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$0.770

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$0.580

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$0.500

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108

$0.770

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$0.500

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DigiKey Marketplace

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$0.370

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$0.370

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Vyrian

USA . 12,788 parts In-Stock

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Chip Stock

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Mil-Aero Solutions, Inc.

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Bristol Electronics

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PC Components Company LLC

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Connector Distribution Corp

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810

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Right Parts Inc.

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810

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Microfarads

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Dark Horse Electronics

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Sogenti Electronics

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First Choice Components Inc.

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Semi Source

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Electronic Expediters

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Cogito LLC

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Ampacity Inc.

Singapore . 12,799 parts In-Stock

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$0.303

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$0.303

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Corphita

USA . 2,007 parts In-Stock

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$0.320

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$0.320

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Continental Prestige Electronics

USA . 3,508 parts In-Stock

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$0.339

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$0.333

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$0.339

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$0.333

Argo Parts USA

USA . 2,713 parts In-Stock

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$0.339

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$0.329

2,713

$0.339

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Netroflash

USA . 2,000 parts In-Stock

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$0.339

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$0.333

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$0.339

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Parana Technologies

USA . 135 parts In-Stock

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$18.509

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$18.620

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DigiPath Technology Company

USA . 1,425 parts In-Stock

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$20.381

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$18.751

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$20.797

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$17.054

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IDEA Electronic Components Group

UK . 1,196 parts In-Stock

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$19.757

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$18.717

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Corohmni

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Perfect Parts

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Assy Fe

Spain . 200 parts In-Stock

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Overview

Unlock the power of efficient signal decoding with the SN74LS139AD from Texas Instruments. Boasting top-notch quality and reliability, this decoder & driver offers unmatched performance in various applications. With a fast propagation delay of 33ns and inverted output polarity, this versatile component ensures seamless operation. Trust Texas Instruments to deliver cutting-edge technology and maximum value to your projects. Experience the difference with the SN74LS139AD, where precision meets innovation.

Feature Benefit Bullets

Package Body Material:

PLASTIC/EPOXY - This material provides durability and protection for the internal components, making it a reliable choice.

Propagation Delay At Nominal Supply:

33 ns - This quick response time ensures efficient operation and minimal lag in signal transmission.

Surface Mount:

YES - This makes installation easy and convenient, especially in compact spaces.

Input Conditioning:

STANDARD - Ensures compatibility with a wide range of input signals, making it versatile for different applications.

No. of Functions:

2 - Provides multiple functions in a single device, saving space and simplifying circuit design.

Package Shape:

RECTANGULAR - The compact shape enhances compatibility with various mounting configurations.

No. of Bits:

4 - Offers sufficient bit capacity for processing data and signals effectively.

Nominal Supply Voltage / Vsup (V):

5 - Operates at a common supply voltage, making it easy to integrate into existing systems.

Load Capacitance (CL):

15 pF - Suitable for driving capacitive loads, ensuring stable and reliable performance.

Power Supplies (V):

5 - Requires a standard power supply voltage, making it easy to incorporate into different setups.

No. of Terminals:

16 - Provides multiple connection points for versatile connectivity options.

Package Style (Meter):

SMALL OUTLINE - The small outline design saves space and allows for dense component placement on a circuit board.

Maximum I (ol):

8 Amp - Can deliver a high output current, suitable for driving demanding loads.

Propagation Delay (tpd):

38 ns - Offers a slight delay in signal transmission, allowing for data processing and synchronization.

Maximum Operating Temperature:

70 °C - Can operate efficiently within a wide temperature range, suitable for various environments.

Minimum Operating Temperature:

0 °C - Can function reliably even in low-temperature conditions, ensuring consistent performance.

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au) - Provides a durable and corrosion-resistant finish for long-term reliability.

Terminal Position:

DUAL - Allows for versatile mounting orientations to accommodate different circuit layouts.

Maximum Seated Height:

1.75 mm - The low profile design saves space and enables compact device integration.

Width:

3.9 mm - The slim width allows for efficient use of board space and facilitates compact circuit designs.

Output Polarity:

INVERTED - Offers inverted output signals, suitable for specific applications requiring this configuration.

Minimum Supply Voltage (Vsup):

4.75 V - Works within a narrow voltage range, ensuring stable and reliable operation.

Peak Reflow Temperature °C:

260 - Can withstand high-temperature reflow processes during assembly, ensuring robust construction.

Length:

9.9 mm - The compact length fits easily within a circuit layout, optimizing space utilization.

Temperature Grade:

COMMERCIAL - Suitable for standard commercial applications with moderate temperature requirements.

Technology:

TTL - Utilizes TTL technology for reliable and compatible signal processing in digital circuits.

Terminal Form:

GULL WING - The gull-wing form factor allows for easy board mounting and secure solder connections.

Packing Method:

TUBE - Convenient packaging method for storage and transportation, ensuring product protection and organization.

Terminal Pitch:

1.27 mm - The small terminal pitch allows for close connection spacing and compact circuit layouts.

Maximum Supply Voltage (Vsup):

5.25 V - Withstands slight voltage fluctuations without compromising performance.

Maximum Power Supply Current (ICC):

11 mA - Operates within a low power supply current range, conserving energy and reducing heat generation.

Technical Specifications

Decoder & Drivers SN74LS139AD attributes and parameters. Explore more Decoder & Drivers devices from Texas Instruments

Specs

Additional Features:

SCHOTTKY CLAMPED FOR HIGH PERFORMANCE

Family:

LS

Input Conditioning:

STANDARD

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

9.9 mm

Load Capacitance (CL):

15 pF

Logic IC Type:

Maximum I (ol):

8 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

4

No. of Functions:

2

No. of Terminals:

16

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Output Polarity:

INVERTED

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TUBE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

11 mA

Propagation Delay At Nominal Supply:

33 ns

Propagation Delay (tpd):

38 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Decoder/Drivers

Maximum Supply Voltage (Vsup):

5.25 V

Minimum Supply Voltage (Vsup):

4.75 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

3.9 mm

Trade Compliance

SN74LS139AD Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-334-7577, 5962013347577

NIIN

013347577

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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