Loading...

54F154/BKA

NXP Semiconductors

54F154/BKA by NXP Semiconductors

54F154/BKA by NXP Semiconductors is a TTL decoder/driver with a 5V nominal supply and an 11.5 ns propagation delay. It features a ceramic, metal-sealed flatpack design, suitable for military applications with extreme temperature ranges (-55 °C to 125 °C). With 24 terminals and inverted output polarity, it ensures reliable performance in demanding environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,040 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,040

-

-

-

-

Anansix

USA . 1,822 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,822

-

-

-

-

Vyrian

USA . 356 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

356

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 1,254 parts In-Stock

1+ parts

$6.000

100+ parts

-

1k+ parts

-

10k+ parts

-

1,254

$6.000

-

-

-

UNI Independent Distributors

Spain . 8,006 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,006

-

-

-

-

Corphita

USA . 2,086 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,086

-

-

-

-

Native Components

USA . 321 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

321

-

-

-

-

Northwest PG Solutions

USA . 91 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

91

-

-

-

-

Overview

Unlock unparalleled performance with the 54F154/BKA from NXP Semiconductors, a leader in high-quality electronic components. Engineered for reliability in demanding environments, this robust decoder and driver elevates your designs with swift response times and superior temperature resilience. Ideal for military and industrial applications, it ensures efficient operation while facilitating seamless integration into your systems—enhancing functionality and durability for exceptional value.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

The durable ceramic and metal-sealed construction ensures reliability and protection against environmental factors, making it suitable for harsh conditions.

Surface Mount: YES

Surface mount capability allows for compact designs and easier integration into modern electronic circuits, enhancing space efficiency.

Package Shape: RECTANGULAR

The rectangular shape provides flexibility in layout options and can easily fit into various PCB designs.

Nominal Supply Voltage / Vsup: 5 V

Operating at a standard 5V supply voltage makes it compatible with a wide range of devices and systems.

Load Capacitance (CL): 50 pF

A low load capacitance ensures that the device can drive multiple loads without significant signal degradation.

No. of Terminals: 24

The 24 terminals offer sufficient connectivity for multiple inputs and outputs, facilitating versatile applications.

Package Style (Meter): FLATPACK

The flatpack design contributes to a lower profile, which is beneficial for compact and efficient circuit designs.

Propagation Delay (tpd): 11.5 ns

A low propagation delay results in faster signal processing, improving the overall performance in high-speed applications.

Maximum Operating Temperature: 125 °C

Designed for high-temperature operation, this product is ideal for demanding applications in harsh environmental conditions.

Minimum Operating Temperature: -55 °C

Operational down to -55 °C, it is suitable for use in extreme cold environments, making it reliable in aerospace and military applications.

Terminal Position: DUAL

Dual terminal positioning allows for flexible mounting options, accommodating various circuit designs.

Output Polarity: INVERTED

The inverted output is advantageous for specific applications requiring signal inversion, enhancing versatility.

Minimum Supply Voltage (Vsup): 4.5 V

The minimum supply voltage of 4.5 V ensures functional operation in a variety of power supply scenarios.

Temperature Grade: MILITARY

With a military-grade temperature specification, it guarantees high reliability and performance in critical applications.

Technology: TTL

Utilizing TTL technology allows for compatibility with a wide range of digital circuits, ensuring integration across various systems.

Terminal Form: FLAT

Flat terminals enable efficient soldering and mounting processes, which is beneficial for high-production environments.

Maximum Supply Voltage (Vsup): 5.5 V

The ability to handle up to 5.5 V supply voltage provides a margin of safety for power supply variations.

Maximum Power Supply Current (ICC): 40 mA

A maximum current capacity of 40 mA ensures that the device can efficiently drive other components in a circuit.

Technical Specifications

Decoder & Drivers 54F154/BKA attributes and parameters. Explore more Decoder & Drivers devices from NXP Semiconductors

Specs

Family:

F/FAST

JESD-30 Code:

R-CDFP-F24

Load Capacitance (CL):

50 pF

No. of Functions:

1

No. of Terminals:

24

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

INVERTED

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

DFP

Package Shape:

Package Style (Meter):

FLATPACK

Maximum Power Supply Current (ICC):

40 mA

Propagation Delay (tpd):

11.5 ns

Qualification:

Not Qualified

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Position:

DUAL

Trade Compliance

54F154/BKA Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20