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54F138/BFA

NXP Semiconductors

54F138/BFA by NXP Semiconductors

54F138/BFA by NXP Semiconductors is a TTL decoder with a 5V nominal voltage, featuring a fast propagation delay of 9.5 ns and operating temperature range from -55 °C to 125 °C. It comes in a dual flatpack package with 16 terminals. Ideal for military applications requiring reliable performance in harsh conditions.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Vyrian

USA . 4,969 parts In-Stock

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Digiode

USA . 3,604 parts In-Stock

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Anansix

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Native Components

USA . 696 parts In-Stock

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One Stop Electronics

USA . 390 parts In-Stock

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UNI Independent Distributors

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Corphita

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Northwest PG Solutions

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Overview

Unlock the potential of your electronics projects with the NXP 54F138/BFA, a premier choice for decoders and drivers. Crafted with precision and durability in mind, this military-grade component ensures reliability in even the harshest environments. With fast response times and robust performance, it seamlessly integrates into various applications—from telecommunications to industrial systems—delivering quality you can trust and enhancing your product's value. Choose NXP for superior innovation!

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

The ceramic, metal-sealed co-fired package offers excellent durability and reliability, making it suitable for demanding applications.

Surface Mount: YES

Surface mounting allows for compact design and improved performance, particularly in high-density applications.

Package Shape: RECTANGULAR

The rectangular shape is advantageous for space-efficient layouts on circuit boards.

Nominal Supply Voltage / Vsup: 5V

Operating at a nominal voltage of 5V is standard for many digital devices, ensuring compatibility and ease of use.

Load Capacitance (CL): 50 pF

A load capacitance of 50 pF is optimal for maintaining signal integrity at higher speeds.

No. of Terminals: 16

With 16 terminals, this product provides ample connectivity options for various applications.

Package Style (Meter): FLATPACK

The flatpack style facilitates better thermal management and is favorable for automated assembly processes.

Propagation Delay (tpd): 9.5 ns

A short propagation delay of 9.5 ns allows for faster signaling, boosting overall performance in high-speed applications.

Maximum Operating Temperature: 125 °C

Capable of operating at high temperatures, this product is suited for use in harsh environments.

Minimum Operating Temperature: -55 °C

The ability to function in extremely low temperatures makes it ideal for aerospace and military applications.

Terminal Position: DUAL

Dual terminal positioning enhances footprint usage and simplifies PCB design.

Output Polarity: INVERTED

Inverted output polarity may be required for specific signal processing applications, providing design flexibility.

Minimum Supply Voltage (Vsup): 4.5V

Operating down to 4.5V allows for flexibility in supply choices, accommodating lower-voltage systems.

Temperature Grade: MILITARY

Designed to military specifications, ensuring reliability in mission-critical applications.

Technology: TTL

Using TTL technology for faster switching speeds and robustness enhances overall performance in digital circuits.

Terminal Form: FLAT

Flat terminals enable easy soldering and ensure good electrical contact, promoting reliability.

Maximum Supply Voltage (Vsup): 5.5V

A maximum voltage of 5.5V ensures that the product can handle slight variations in supply voltage without failure.

Maximum Power Supply Current (ICC): 20 mA

With a reasonably low maximum supply current, this product is energy-efficient, making it ideal for battery-powered applications.

Technical Specifications

Decoder & Drivers 54F138/BFA attributes and parameters. Explore more Decoder & Drivers devices from NXP Semiconductors

Specs

Additional Features:

3 ENABLE INPUTS

Family:

F/FAST

JESD-30 Code:

R-CDFP-F16

Load Capacitance (CL):

50 pF

Logic IC Type:

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

INVERTED

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

DFP

Package Shape:

Package Style (Meter):

FLATPACK

Maximum Power Supply Current (ICC):

20 mA

Propagation Delay (tpd):

9.5 ns

Qualification:

Not Qualified

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Position:

DUAL

Trade Compliance

54F138/BFA Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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