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SN54LS249J-00

Texas Instruments

SN54LS249J-00 by Texas Instruments

SN54LS249J-00 by Texas Instruments is a TTL decoder with 16 terminals, operating b/w -55 to 125 °C. It has a propagation delay of 100 ns and open-collector output characteristics. Ideal for military-grade applications due to its ceramic package material and standard input conditioning, with a supply voltage range of 4.5V to 5.5V.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,715 parts In-Stock

1+ parts

-

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7,715

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Digiode

USA . 3,205 parts In-Stock

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3,205

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 2,165 parts In-Stock

1+ parts

$7.192

100+ parts

-

1k+ parts

$7.700

10k+ parts

-

2,165

$7.192

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$7.700

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DigiPath Technology Company

USA . 1,483 parts In-Stock

1+ parts

$7.919

100+ parts

$7.286

1k+ parts

-

10k+ parts

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1,483

$7.919

$7.286

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ChromeModa Solutions

Germany . 2,496 parts In-Stock

1+ parts

$8.081

100+ parts

$6.626

1k+ parts

-

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2,496

$8.081

$6.626

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IDEA Electronic Components Group

UK . 1,733 parts In-Stock

1+ parts

$8.081

100+ parts

-

1k+ parts

$7.273

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1,733

$8.081

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$7.273

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AZTECH Wire

Italy . 867 parts In-Stock

1+ parts

$12.739

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867

$12.739

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One Stop Electronics

USA . 1,541 parts In-Stock

1+ parts

$62.000

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1,541

$62.000

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Corphita

USA . 3,155 parts In-Stock

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3,155

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Overview

Discover the cutting-edge SN54LS249J-00 by Texas Instruments, a top-tier manufacturer renowned for its quality and reliability. This decoder & driver device offers unparalleled performance in various applications. From its ceramic glass-sealed body to its open-collector output characteristics, this product stands out in terms of durability and efficiency. With a wide operating temperature range and low power consumption, the SN54LS249J-00 provides exceptional value and benefits to customers looking for top-notch performance in their electronic designs. Trust Texas Instruments to deliver superior technology that exceeds expectations.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

Ceramic and glass-sealed packaging ensures durability and reliability, making this product suitable for harsh environments.

Nominal Supply Voltage / Vsup (V): 5

Standard 5V supply voltage allows for easy integration into existing systems.

Propagation Delay (tpd): 100 ns

Fast propagation delay ensures quick response times in decoding and driving signals.

Minimum Operating Temperature: -55 °C

Wide operating temperature range makes this product suitable for both extreme cold and hot environments.

Maximum Operating Temperature: 125 °C

High maximum operating temperature ensures reliability even in hot conditions.

Technology: TTL

TTL technology offers high speed and low power consumption, making this product efficient and reliable.

Technical Specifications

Decoder & Drivers SN54LS249J-00 attributes and parameters. Explore more Decoder & Drivers devices from Texas Instruments

Specs

Family:

LS

Input Conditioning:

STANDARD

JESD-30 Code:

R-GDIP-T16

Length:

19.56 mm

Load Capacitance (CL):

15 pF

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

OPEN-COLLECTOR

Output Polarity:

TRUE

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Maximum Power Supply Current (ICC):

15 mA

Propagation Delay (tpd):

100 ns

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

SN54LS249J-00 Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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