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VND10BSP13TR

STMicroelectronics

VND10BSP13TR by STMicroelectronics

VND10BSP13TR by STMicroelectronics is a robust peripheral driver with a max supply voltage of 26V and built-in protections against overcurrent, thermal issues, and transients. It operates in extreme temperatures from -40 °C to 125°C. Ideal for automotive applications, it features an open-source output with a peak current limit of 3.4A.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,317 parts In-Stock

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5,317

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Digiode

USA . 2,998 parts In-Stock

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2,998

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Anansix

USA . 790 parts In-Stock

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790

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip USA

USA . 214 parts In-Stock

1+ parts

$6.662

100+ parts

-

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214

$6.662

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IDEA Electronic Components Group

UK . 453 parts In-Stock

1+ parts

$10.515

100+ parts

-

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$9.463

10k+ parts

-

453

$10.515

-

$9.463

-

AZTECH Wire

Italy . 936 parts In-Stock

1+ parts

$15.570

100+ parts

-

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936

$15.570

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MKK Technologies

India . 952 parts In-Stock

1+ parts

$19.772

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952

$19.772

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DigiPath Technology Company

USA . 952 parts In-Stock

1+ parts

$19.772

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952

$19.772

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Authorized Procurement Solutions

USA . 2,500 parts In-Stock

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2,500

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Parana Technologies

USA . 2,034 parts In-Stock

1+ parts

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$12.572

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2,034

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$12.572

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iodParts Technologies Inc.

India . 600 parts In-Stock

1+ parts

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600

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Corphita

USA . 426 parts In-Stock

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426

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Overview

Elevate your designs with the VND10BSP13TR from STMicroelectronics—a robust peripheral driver crafted to deliver exceptional performance and reliability. With built-in protections against transients, overcurrent, and thermal issues, this high-quality component ensures your projects not only thrive but excel in harsh automotive environments. Experience unmatched value and efficiency, empowering you to unleash innovative applications while enjoying peace of mind in your engineering solutions.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy ensures durability and resistance to environmental factors, making this product reliable for long-term usage.

Surface Mount: YES

Being surface mount compatible allows for easy integration into compact designs, saving space on printed circuit boards.

Maximum Supply Voltage: 26 V

A high maximum supply voltage enables this driver to be used in a variety of applications, supporting diverse operational requirements.

Package Shape: RECTANGULAR

The rectangular shape optimizes space efficiency and makes layout simpler on PCBs.

Built-in Protections: TRANSIENT; OVER CURRENT; THERMAL; UNDER VOLTAGE

Robust built-in protections enhance the safety and reliability of the device, preventing potential damage from electrical faults.

No. of Terminals: 10

With 10 terminals, this product provides flexible connectivity options for a variety of applications.

Package Style (Meter): SMALL OUTLINE, HEAT SINK/SLUG

This style allows for effective heat dissipation while maintaining a compact design, ideal for limited space environments.

Minimum Supply Voltage: 6 V

A low minimum supply voltage makes it suitable for battery-operated applications, enhancing its versatility.

Maximum Operating Temperature: 125 °C

The ability to operate at high temperatures ensures performance reliability even in extreme conditions, making it suitable for automotive applications.

Output Characteristics: OPEN-SOURCE

Open-source output characteristics promote versatility in design and allow for easy integration with various systems.

Minimum Operating Temperature: -40 °C

The wide temperature range allows this product to function effectively in harsh environments, increasing its application scope.

Terminal Finish: TIN

The tin finish provides good solderability and corrosion resistance, ensuring reliable connections during assembly.

Terminal Position: DUAL

Dual terminal position facilitates easier layout on PCBs, enhancing design flexibility.

Maximum Seated Height: 3.75 mm

A low seated height aids in maintaining a slim profile in designs, which is critical in space-constrained applications.

Width: 7.5 mm

A compact width allows for efficient use of space in PCB designs, making it easier to pack multiple components.

Output Polarity: TRUE

True output polarity ensures reliability and predictability in performance, important for automotive and industrial devices.

Length: 9.4 mm

The small length helps in fitting the driver in tight spaces, enhancing overall design flexibility.

Temperature Grade: AUTOMOTIVE

Automotive grade specifications ensure that this device can withstand the demanding conditions present in automotive applications.

Terminal Form: GULL WING

Gull wing terminals provide a secure and effective soldering area, ensuring strong and reliable connections.

Maximum Supply Current: 0.1 mA

Low maximum supply current promotes energy efficiency, making this driver effective in power-sensitive applications.

Input Characteristics: SCHMITT TRIGGER

Schmitt trigger input characteristics enhance signal integrity, reducing noise issues in signal processing.

Nominal Supply Voltage: 13 V

A nominal supply voltage of 13 V is optimal for many automotive and peripheral applications, providing a stable operational environment.

Turn-on Time: 200 µs

Fast turn-on time enables quick response to control signals, improving overall system performance.

Terminal Pitch: 1.27 mm

The standard terminal pitch allows for easy compatibility with existing PCB designs, reducing layout challenges.

Nominal Output Peak Current Limit: 3.4 A

A peak current limit of 3.4 A supports high-performance applications, handling greater loads efficiently.

Interface IC Type: BUFFER OR INVERTER BASED PERIPHERAL DRIVER

This classification allows it to serve a wide range of functions in various circuits, increasing its usability.

Turn-off Time: 500 µs

With a turn-off time of 500 µs, this driver can effectively manage dynamic loads, ensuring system stability.

Output Current Flow Direction: SOURCE

Source current flow direction provides flexibility in circuit design, making it easier to configure for various applications.

Technical Specifications

Peripheral Drivers VND10BSP13TR attributes and parameters. Explore more Peripheral Drivers devices from STMicroelectronics

Specs

Built-in Protections:

TRANSIENT; OVER CURRENT; THERMAL; UNDER VOLTAGE

Input Characteristics:

SCHMITT TRIGGER

JESD-30 Code:

R-PDSO-G10

JESD-609 Code:

e3

Length:

9.4 mm

No. of Functions:

1

No. of Terminals:

10

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

OPEN-SOURCE

Output Current Flow Direction:

SOURCE

Nominal Output Peak Current Limit:

3.4 A

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG

Qualification:

Not Qualified

Maximum Seated Height:

3.75 mm

Maximum Supply Current:

.1 mA

Maximum Supply Voltage:

26 V

Minimum Supply Voltage:

6 V

Nominal Supply Voltage:

13 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Turn-off Time:

500 us

Turn-on Time:

200 us

Width:

7.5 mm

Trade Compliance

VND10BSP13TR Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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