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VND1NV0413TR

STMicroelectronics

VND1NV0413TR by STMicroelectronics

VND1NV0413TR by STMicroelectronics is a compact peripheral driver with built-in protections against transient, overcurrent, and thermal issues. It features a max output peak current of 1.7 A and fast turn-on/off times of 1 µs and 5.5 µs, ideal for efficient control in automotive applications. Its small outline design ensures easy surface mounting in space-constrained environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,703 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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8,703

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-

-

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Anansix

USA . 2,758 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,758

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-

-

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Digiode

USA . 1,263 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,263

-

-

-

-

J2 Sourcing AB

Sweden . 1,223 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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1,223

-

-

-

-

Bristol Electronics

USA . 167 parts In-Stock

1+ parts

-

100+ parts

-

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167

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 675 parts In-Stock

1+ parts

$1.500

100+ parts

-

1k+ parts

-

10k+ parts

-

675

$1.500

-

-

-

IDEA Electronic Components Group

UK . 2,093 parts In-Stock

1+ parts

$6.948

100+ parts

-

1k+ parts

$6.253

10k+ parts

-

2,093

$6.948

-

$6.253

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Microchip USA

USA . 450 parts In-Stock

1+ parts

$8.795

100+ parts

-

1k+ parts

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10k+ parts

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450

$8.795

-

-

-

MKK Technologies

India . 85 parts In-Stock

1+ parts

$13.065

100+ parts

-

1k+ parts

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85

$13.065

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DigiPath Technology Company

USA . 85 parts In-Stock

1+ parts

$13.065

100+ parts

-

1k+ parts

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10k+ parts

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85

$13.065

-

-

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AZTECH Wire

Italy . 398 parts In-Stock

1+ parts

$22.130

100+ parts

-

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10k+ parts

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398

$22.130

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-

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Kepictronics

USA . 3,200 parts In-Stock

1+ parts

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100+ parts

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3,200

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Parana Technologies

USA . 229 parts In-Stock

1+ parts

-

100+ parts

$8.307

1k+ parts

-

10k+ parts

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229

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$8.307

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Corphita

USA . 72 parts In-Stock

1+ parts

-

100+ parts

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72

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Overview

Elevate your designs with the VND1NV0413TR from STMicroelectronics, a trusted leader in innovative solutions. This compact peripheral driver combines robust performance with built-in protections against transients, overcurrent, and thermal issues, ensuring reliability in any application. Ideal for automotive and industrial uses, its swift response time enhances efficiency, giving you peace of mind and empowering your projects to thrive in demanding environments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy enhances durability and reliability, making this driver suitable for a wide range of peripheral applications.

Surface Mount: YES

Surface mount capability allows for efficient space-saving designs, making it ideal for compact electronic devices.

Package Shape: RECTANGULAR

Rectangular shape optimizes PCB layout, facilitating easier integration into various designs.

Built-in Protections: TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL

Multiple built-in protections safeguard the device against potential damage, ensuring reliable long-term operation.

No. of Terminals: 2

With only two terminals, this driver simplifies connections and is perfect for straightforward peripheral interfacing.

Package Style (Meter): SMALL OUTLINE

Small outline packages reduce the overall footprint, making this driver suitable for space-constrained applications.

Terminal Finish: MATTE TIN

Matte tin terminal finish provides good solderability and reliability in connections, ensuring robust performance.

Terminal Position: SINGLE

A single terminal position streamlines design processes and makes it easier to integrate into existing systems.

Maximum Seated Height: 2.63 mm

A low maximum seated height allows for deeper placements in compact devices, facilitating flexible design options.

Width: 6.1 mm

Compact width aids in creating slimmer designs, enhancing aesthetic appeal and functionality in various devices.

Length: 6.5 mm

The length is designed to maintain a balanced physical profile, ensuring ease in system integration.

Terminal Form: GULL WING

Gull wing terminals allow for better solder joint visibility and easier inspection, which is crucial for quality control.

Turn-on Time: 1 us

Rapid turn-on time enables quick response in applications requiring fast switching, ensuring efficient operation.

Terminal Pitch: 2.25 mm

A 2.25 mm terminal pitch provides a good balance between compactness and easiness of handling during soldering.

Nominal Output Peak Current Limit: 1.7 A

Capable of handling 1.7 A peak current, this driver can manage substantial loads, making it versatile for many peripherals.

Interface IC Type: BUFFER OR INVERTER BASED PERIPHERAL DRIVER

Being a buffer or inverter based peripheral driver, it supports various interface applications, enhancing its usability.

Turn-off Time: 5.5 us

Quick turn-off time ensures efficient power management and reduces potential interference in sensitive applications.

Output Current Flow Direction: SINK

The ability to sink current allows the driver to effectively interface with various devices, providing flexibility in design.

Technical Specifications

Peripheral Drivers VND1NV0413TR attributes and parameters. Explore more Peripheral Drivers devices from STMicroelectronics

Specs

Built-in Protections:

TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Length:

6.5 mm

No. of Functions:

1

No. of Terminals:

2

Output Current Flow Direction:

SINK

Nominal Output Peak Current Limit:

1.7 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Qualification:

Not Qualified

Maximum Seated Height:

2.63 mm

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

2.25 mm

Terminal Position:

SINGLE

Turn-off Time:

5.5 us

Turn-on Time:

1 us

Width:

6.1 mm

Trade Compliance

VND1NV0413TR Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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