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VND10N06

STMicroelectronics

VND10N06 by STMicroelectronics

VND10N06 by STMicroelectronics is a MOS technology peripheral driver with built-in protections for transient, over current, and over voltage. It features an output peak current limit of 10A and Schmitt trigger input characteristics. This small outline package driver is ideal for applications requiring buffer or inverter based interface ICs.

Median Price

$3.080

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Component Electronics Inc.

Canada . 225 parts In-Stock

1+ parts

$3.080

100+ parts

$2.310

1k+ parts

$2.000

10k+ parts

-

225

$3.080

$2.310

$2.000

-

Chip Stock

USA . 45,013 parts In-Stock

1+ parts

-

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45,013

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Digiode

USA . 4,542 parts In-Stock

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4,542

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Vyrian

USA . 2,916 parts In-Stock

1+ parts

-

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2,916

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ComSIT Distribution GmbH

Germany . 1,942 parts In-Stock

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1,942

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Anansix

USA . 1,471 parts In-Stock

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1,471

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LittleDiode

UK . 8 parts In-Stock

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8

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 218 parts In-Stock

1+ parts

$11.252

100+ parts

-

1k+ parts

$10.126

10k+ parts

-

218

$11.252

-

$10.126

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AZTECH Wire

Italy . 552 parts In-Stock

1+ parts

$19.010

100+ parts

-

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552

$19.010

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MKK Technologies

India . 1,102 parts In-Stock

1+ parts

$21.158

100+ parts

-

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1,102

$21.158

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DigiPath Technology Company

USA . 1,102 parts In-Stock

1+ parts

$21.158

100+ parts

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1,102

$21.158

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Component Stockers USA

USA . 708 parts In-Stock

1+ parts

$99.990

100+ parts

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708

$99.990

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Microchip USA

USA . 247 parts In-Stock

1+ parts

$105.153

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247

$105.153

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RC Electronics

USA . 50,000 parts In-Stock

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50,000

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Kepictronics

USA . 13,000 parts In-Stock

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13,000

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A-Z Elektronik GmbH

Germany . 6,518 parts In-Stock

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6,518

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Authorized Procurement Solutions

USA . 6,500 parts In-Stock

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6,500

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Perfect Parts

USA . 3,870 parts In-Stock

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3,870

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Parana Technologies

USA . 2,303 parts In-Stock

1+ parts

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$13.453

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2,303

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$13.453

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Corphita

USA . 588 parts In-Stock

1+ parts

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588

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Cyclops Electronics Ltd (Excess)

UK . 60 parts In-Stock

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60

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Overview

Unleash the power of innovation with the VND10N06 by STMicroelectronics. As a leading manufacturer in the industry, STMicroelectronics delivers top-notch quality and reliability in their products. The VND10N06 falls under the category of Peripheral Drivers, making it versatile for a wide range of applications. With built-in protections against transient, over current, over voltage, and thermal issues, this product ensures peace of mind for customers. Experience the value and benefits of this product with its high output peak current limit of 10A and fast turn-on/off times. Trust STMicroelectronics to provide you with cutting-edge technology that exceeds expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides a lightweight and durable construction for easy handling and long-lasting performance.

Built-in Protections: TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL

Ensures safety and protection against various factors that can damage the device, increasing its reliability.

Output Characteristics: OPEN-DRAIN

Allows for easy interfacing with external devices by providing an open-drain output.

Technology: MOS

Utilizes MOS technology for efficient and reliable operation.

Input Characteristics: SCHMITT TRIGGER

Uses Schmitt trigger input for noise immunity and precise switching, enhancing the performance of the peripheral driver.

Nominal Output Peak Current Limit: 10 A

Provides a high output current limit for powering various external devices, making it versatile and suitable for different applications.

Technical Specifications

Peripheral Drivers VND10N06 attributes and parameters. Explore more Peripheral Drivers devices from STMicroelectronics

Specs

Built-in Protections:

TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL

Input Characteristics:

SCHMITT TRIGGER

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Length:

6.5 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

2

Output Characteristics:

OPEN-DRAIN

Output Current Flow Direction:

SINK

Nominal Output Peak Current Limit:

10 A

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

2.63 mm

Surface Mount:

YES

Technology:

MOS

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

Terminal Pitch:

2.28 mm

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Turn-off Time:

2.3 us

Turn-on Time:

1.8 us

Width:

6.1 mm

Trade Compliance

VND10N06 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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