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VND1NV04

STMicroelectronics

VND1NV04 by STMicroelectronics

VND1NV04 by STMicroelectronics is a compact peripheral driver with built-in protections against transient, overcurrent, and thermal issues. It features a max output peak current of 1.7 A and fast turn-on time of 1 µs. Ideal for buffer or inverter applications in space-constrained designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip Stock

USA . 64,400 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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64,400

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Vyrian

USA . 2,216 parts In-Stock

1+ parts

-

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-

1k+ parts

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2,216

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Digiode

USA . 942 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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942

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-

-

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Anansix

USA . 593 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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593

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip USA

USA . 308 parts In-Stock

1+ parts

$10.615

100+ parts

-

1k+ parts

-

10k+ parts

-

308

$10.615

-

-

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IDEA Electronic Components Group

UK . 10 parts In-Stock

1+ parts

$11.929

100+ parts

-

1k+ parts

$10.736

10k+ parts

-

10

$11.929

-

$10.736

-

Advanced Electronics

New Zealand . 70 parts In-Stock

1+ parts

$13.879

100+ parts

$12.630

1k+ parts

$11.381

10k+ parts

-

70

$13.879

$12.630

$11.381

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AZTECH Wire

Italy . 660 parts In-Stock

1+ parts

$18.980

100+ parts

-

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10k+ parts

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660

$18.980

-

-

-

MKK Technologies

India . 1,964 parts In-Stock

1+ parts

$22.431

100+ parts

-

1k+ parts

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10k+ parts

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1,964

$22.431

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DigiPath Technology Company

USA . 1,964 parts In-Stock

1+ parts

$22.431

100+ parts

-

1k+ parts

-

10k+ parts

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1,964

$22.431

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Infinite Electronics LLP (Excess)

. 56,485 parts In-Stock

1+ parts

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100+ parts

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56,485

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RC Electronics

USA . 13,500 parts In-Stock

1+ parts

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13,500

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-

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Kepictronics

USA . 13,000 parts In-Stock

1+ parts

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13,000

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-

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Corphita

USA . 1,861 parts In-Stock

1+ parts

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100+ parts

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1,861

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Parana Technologies

USA . 1,174 parts In-Stock

1+ parts

-

100+ parts

$14.263

1k+ parts

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1,174

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$14.263

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Perfect Parts

USA . 560 parts In-Stock

1+ parts

-

100+ parts

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560

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Overview

Elevate your design with the VND1NV04 by STMicroelectronics, a cutting-edge peripheral driver that excels in delivering reliability and performance. Engineered with built-in protections against transients, overcurrent, and thermal issues, this compact solution ensures your applications run smoothly and safely. Trust in STMicroelectronics’ renowned quality and innovation to enhance your products, streamline operations, and achieve unparalleled efficiency. Maximize value while minimizing risks!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material ensures durability and protection against environmental factors, making it suitable for various applications.

Surface Mount: YES

Being surface mount compatible allows for easy integration into modern circuit designs, saving space and enabling high-density arrangements.

Package Shape: RECTANGULAR

A rectangular package shape optimizes board space and provides a compact form factor, essential for smaller electronic devices.

Built-in Protections: TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL

Multiple built-in protections ensure the device operates safely under various conditions, enhancing reliability and longevity.

No. of Terminals: 2

Having only two terminals simplifies connection, making installation and repair easier and more efficient.

Package Style (Meter): SMALL OUTLINE

The small outline package style reduces board space usage, making it ideal for compact electronic designs.

Terminal Position: SINGLE

A single terminal position streamlines design and simplifies PCB layout, contributing to ease of integration.

Maximum Seated Height: 2.63 mm

A low seated height maximizes compatibility with compact designs and minimizes signal degradation in high-speed applications.

Width: 6.1 mm

Compact width contributes to space efficiency on the PCB, enabling more components to fit in constrained layouts.

Length: 6.5 mm

Short length allows for flexible placement within circuit designs, facilitating optimal routing of signals and minimizing trace lengths.

Terminal Form: GULL WING

Gull wing terminal form enhances solderability and reliability in connections, making assembly easier and ensuring good electrical contact.

Turn-on Time: 1 us

Fast turn-on time enhances responsiveness and speed in peripheral devices, making it suitable for high-performance applications.

Terminal Pitch: 2.25 mm

The terminal pitch of 2.25 mm strikes a balance between compactness and ease of handling during assembly processes.

Nominal Output Peak Current Limit: 1.7 A

A peak current limit of 1.7 A provides sufficient power for driving most peripheral devices, making this product versatile.

Interface IC Type: BUFFER OR INVERTER BASED PERIPHERAL DRIVER

Being a buffer or inverter based driver allows for a variety of signal conditioning and control applications, increasing its applicability.

Turn-off Time: 5.5 us

A relatively fast turn-off time contributes to efficient operation, particularly in pulse applications where timing is critical.

Output Current Flow Direction: SINK

Output current sinking capability allows for simple interfacing with various devices and makes the design more flexible.

Technical Specifications

Peripheral Drivers VND1NV04 attributes and parameters. Explore more Peripheral Drivers devices from STMicroelectronics

Specs

Built-in Protections:

TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL

JESD-30 Code:

R-PSSO-G2

Length:

6.5 mm

No. of Functions:

1

No. of Terminals:

2

Output Current Flow Direction:

SINK

Nominal Output Peak Current Limit:

1.7 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Maximum Seated Height:

2.63 mm

Surface Mount:

YES

Terminal Form:

Terminal Pitch:

2.25 mm

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Turn-off Time:

5.5 us

Turn-on Time:

1 us

Width:

6.1 mm

Trade Compliance

VND1NV04 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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