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VND10B(011Y)

STMicroelectronics

VND10B(011Y) by STMicroelectronics

VND10B(011Y) by STMicroelectronics is a robust peripheral driver with a max supply voltage of 26V, operating temp range from -40 °C to 125°C, and built-in protections against transients and thermal issues. It supports automotive applications with a peak output current of 5.2A. Ideal for buffer or inverter-based systems, it features a compact flange mount design for easy integration.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,923 parts In-Stock

1+ parts

-

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2,923

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Digiode

USA . 2,423 parts In-Stock

1+ parts

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2,423

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Anansix

USA . 1,027 parts In-Stock

1+ parts

-

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1,027

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip USA

USA . 195 parts In-Stock

1+ parts

$4.149

100+ parts

-

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195

$4.149

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IDEA Electronic Components Group

UK . 2,122 parts In-Stock

1+ parts

$8.935

100+ parts

-

1k+ parts

$8.042

10k+ parts

-

2,122

$8.935

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$8.042

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MKK Technologies

India . 364 parts In-Stock

1+ parts

$16.802

100+ parts

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364

$16.802

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DigiPath Technology Company

USA . 364 parts In-Stock

1+ parts

$16.802

100+ parts

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364

$16.802

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AZTECH Wire

Italy . 896 parts In-Stock

1+ parts

$19.960

100+ parts

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896

$19.960

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Component Stockers USA

USA . 273 parts In-Stock

1+ parts

$99.990

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273

$99.990

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Corphita

USA . 248 parts In-Stock

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248

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Parana Technologies

USA . 73 parts In-Stock

1+ parts

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$10.683

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73

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$10.683

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Overview

Elevate your designs with the VND10B(011Y) from STMicroelectronics, the trusted leader in innovative semiconductor solutions. This robust peripheral driver excels in automotive applications, offering exceptional thermal and transient protection for reliable performance under harsh conditions. With a wide operating voltage range and impressive output capabilities, it empowers engineers with flexibility and peace of mind, significantly enhancing system efficiency and longevity. Choose quality and dependability for your next project!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of durable plastic/epoxy ensures reliable performance in various environmental conditions, making it suitable for automotive applications.

Maximum Supply Voltage: 26 V

This high maximum supply voltage allows for versatility in application, accommodating a wide range of system designs.

Package Shape: RECTANGULAR

A rectangular package shape optimizes space utilization on PCBs, enabling efficient design and layout in electronic devices.

Built-in Protections: TRANSIENT; THERMAL; UNDER VOLTAGE

Integrated protections enhance the reliability and safety of the device, preventing damage from voltage spikes, overheating, and low supply conditions.

Power Supplies (V): 8/16

Compatible with multiple voltage supplies, this peripheral driver can be used in various applications, enhancing flexibility.

No. of Terminals: 7

With seven terminals, this driver provides sufficient connectivity for reliable interfacing with other components.

Package Style (Meter): FLANGE MOUNT

Flange mount design allows easy and secure installation, contributing to robust mechanical stability in the application.

Minimum Supply Voltage: 6 V

This low minimum supply voltage enables operation in low-power systems, making it energy-efficient.

Maximum Operating Temperature: 125 °C

The ability to operate at high temperatures is vital for automotive applications, ensuring functionality even in harsh environments.

Minimum Operating Temperature: -40 °C

The extended operating temperature range allows the product to function reliably in extreme climates, catering to diverse operational needs.

Terminal Finish: TIN LEAD

Tin lead finish improves solderability and connection stability, ensuring long-term performance in electronic assemblies.

Terminal Position: ZIG-ZAG

Zig-zag terminal positioning can facilitate better layout on the PCB, enhancing space management and component placement.

Temperature Grade: AUTOMOTIVE

Designed specifically for automotive standards, this product ensures durability and reliability in automotive applications.

Maximum Output Current: 5.2 A

A high maximum output current allows this driver to manage demanding loads effectively, making it suitable for high-performance applications.

Terminal Form: THROUGH-HOLE

Through-hole technology provides stronger mechanical connections, increasing the robustness of the device in operational conditions.

Nominal Supply Voltage: 13 V

The nominal supply voltage aligns well with common automotive battery voltages, ensuring compatibility and ease of integration.

Turn-on Time: 200 µs

A quick turn-on time enhances the responsiveness of the system, improving overall performance in time-sensitive applications.

Terminal Pitch: 1.27 mm

The 1.27 mm terminal pitch allows for efficient layout designs, facilitating compact and organized PCB configurations.

Driver No. of Bits: 2

With two bits, this driver can handle multiple signals simultaneously, increasing the complexity and functionality of the designs.

Nominal Output Peak Current Limit: 3.4 A

The output peak current limit efficiently manages surge conditions without damaging the driver, ensuring long-term reliability.

Interface IC Type: BUFFER OR INVERTER BASED PERIPHERAL DRIVER

This versatile interface type allows for integration with various control circuits, enhancing compatibility across multiple applications.

Turn-off Time: 500 µs

A 500 µs turn-off time ensures the driver can quickly disengage, contributing to safety and efficiency in the overall system operation.

Output Current Flow Direction: SOURCE

Output sourcing capability indicates the driver can supply current to loads effectively, making it suitable for a wide range of peripherals.

Technical Specifications

Peripheral Drivers VND10B(011Y) attributes and parameters. Explore more Peripheral Drivers devices from STMicroelectronics

Specs

Built-in Protections:

TRANSIENT; THERMAL; UNDER VOLTAGE

Driver No. of Bits:

2

JESD-30 Code:

R-PZFM-T7

JESD-609 Code:

e0

No. of Functions:

1

No. of Terminals:

7

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Current Flow Direction:

SOURCE

Maximum Output Current:

5.2 A

Nominal Output Peak Current Limit:

3.4 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

ZIP

Package Equivalence Code:

ZIP7H,.2,.7TB

Package Shape:

Package Style (Meter):

FLANGE MOUNT

Power Supplies (V):

8/16

Qualification:

Not Qualified

Sub-Category:

Peripheral Drivers

Maximum Supply Voltage:

26 V

Minimum Supply Voltage:

6 V

Nominal Supply Voltage:

13 V

Surface Mount:

NO

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

ZIG-ZAG

Turn-off Time:

500 us

Turn-on Time:

200 us

Trade Compliance

VND10B(011Y) Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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