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VND10B(012Y)

STMicroelectronics

VND10B(012Y) by STMicroelectronics

VND10B(012Y) by STMicroelectronics is a robust peripheral driver with a max supply voltage of 26V and an output current of 5.2A. It features built-in protections against transients, thermal issues, and under-voltage. Ideal for automotive applications, it operates in extreme temperatures from -40 °C to 125°C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,700 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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2,700

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-

-

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Vyrian

USA . 2,378 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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2,378

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Anansix

USA . 628 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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628

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R&J Components

USA . 150 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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150

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-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 385 parts In-Stock

1+ parts

$7.203

100+ parts

-

1k+ parts

$6.482

10k+ parts

-

385

$7.203

-

$6.482

-

Microchip USA

USA . 258 parts In-Stock

1+ parts

$7.568

100+ parts

-

1k+ parts

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10k+ parts

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258

$7.568

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-

-

MKK Technologies

India . 958 parts In-Stock

1+ parts

$13.544

100+ parts

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958

$13.544

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DigiPath Technology Company

USA . 958 parts In-Stock

1+ parts

$13.544

100+ parts

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10k+ parts

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958

$13.544

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-

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Corphita

USA . 3,816 parts In-Stock

1+ parts

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3,816

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Parana Technologies

USA . 1,332 parts In-Stock

1+ parts

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100+ parts

$8.612

1k+ parts

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10k+ parts

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1,332

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$8.612

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Overview

Unlock the potential of your automotive applications with the VND10B(012Y) from STMicroelectronics, a leading name in innovation and quality. This robust peripheral driver ensures reliable performance under extreme conditions, thanks to its built-in protections against transients and thermal events. With exceptional efficiency and a compact design, it enhances system reliability while simplifying integration, delivering unmatched value for your projects. Experience the difference with STMicroelectronics—where excellence drives success!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy enhances durability and resistance to environmental factors, making it suitable for automotive applications.

Maximum Supply Voltage: 26 V

A high maximum supply voltage indicates versatility for various peripheral devices requiring higher operating voltages.

Package Shape: RECTANGULAR

The rectangular shape optimizes space on PCBs, allowing for efficient layouts even in compact areas.

Built-in Protections: TRANSIENT; THERMAL; UNDER VOLTAGE

Integrated protection features ensure reliability and longevity of the device, reducing risks of damage in adverse conditions.

Power Supplies (V): 8/16

Flexible operating voltage ranges from 8V to 16V make this driver compatible with a wide variety of systems.

No. of Terminals: 7

Seven terminals allow for multiple connections, enhancing the device’s functionality and integration potential.

Package Style (Meter): FLANGE MOUNT

Flange mount packaging provides stability during installation, which is essential for automotive applications.

Minimum Supply Voltage: 6 V

A low minimum supply voltage allows for operation in low-power scenarios, improving energy efficiency.

Maximum Operating Temperature: 125 °C

High-temperature tolerance ensures operation in extreme automotive environments, enhancing reliability.

Minimum Operating Temperature: -40 °C

Wide operational temperature range makes the device suitable for harsh climatic conditions, typical in automotive applications.

Terminal Finish: TIN LEAD

Tin-lead terminals provide good solderability and electrical contact, ensuring robust connections in electronic assemblies.

Terminal Position: SINGLE

Single terminal position simplifies connection and reduces complexity in design, allowing easier integration in circuits.

Temperature Grade: AUTOMOTIVE

Automotive grade temperature classification indicates suitability for automotive applications with stringent requirements.

Maximum Output Current: 5.2 A

A maximum output current of 5.2 A allows the driver to manage high-load peripherals, enhancing operational capabilities.

Terminal Form: THROUGH-HOLE

Through-hole terminals ensure secure connections, making them ideal for applications requiring high reliability.

Nominal Supply Voltage: 13 V

Nominal voltage of 13V is ideal for automotive systems, aligning with standard operating conditions.

Turn-on Time: 200 µs

Fast turn-on time leads to quicker response in controlling peripherals, improving overall system performance.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm is compatible with a variety of PCB layouts, facilitating easier design integration.

Driver No. of Bits: 2

With 2 bits, the driver is capable of managing multiple signals, enhancing versatility in peripheral control.

Interface IC Type: BUFFER OR INVERTER BASED PERIPHERAL DRIVER

This type of interface ensures proper signal integrity and manipulation, crucial for reliable peripheral operation.

Turn-off Time: 500 µs

Moderate turn-off time contributes to controlled deactivation of peripherals, preventing signal bouncing and ensuring system stability.

Output Current Flow Direction: SOURCE

Source output current configuration is suitable for driving peripherals effectively, ensuring reliable operation.

Technical Specifications

Peripheral Drivers VND10B(012Y) attributes and parameters. Explore more Peripheral Drivers devices from STMicroelectronics

Specs

Built-in Protections:

TRANSIENT; THERMAL; UNDER VOLTAGE

Driver No. of Bits:

2

JESD-30 Code:

R-PSFM-T7

JESD-609 Code:

e0

No. of Functions:

1

No. of Terminals:

7

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Current Flow Direction:

SOURCE

Maximum Output Current:

5.2 A

Package Body Material:

PLASTIC/EPOXY

Package Equivalence Code:

SIP7,.1,50TB

Package Shape:

Package Style (Meter):

FLANGE MOUNT

Power Supplies (V):

8/16

Qualification:

Not Qualified

Sub-Category:

Peripheral Drivers

Maximum Supply Voltage:

26 V

Minimum Supply Voltage:

6 V

Nominal Supply Voltage:

13 V

Surface Mount:

NO

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

SINGLE

Turn-off Time:

500 us

Turn-on Time:

200 us

Trade Compliance

VND10B(012Y) Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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