Loading...

VND10N06TR

STMicroelectronics

VND10N06TR by STMicroelectronics

VND10N06TR by STMicroelectronics is a compact peripheral driver with built-in protections against transient, overcurrent, and thermal issues. It features a max output peak current of 10 A and fast turn-on/off times of 1.8 µs and 2.3 µs, ideal for efficient control in various applications. Its small outline design ensures easy integration into space-constrained environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,068 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,068

-

-

-

-

Vyrian

USA . 1,964 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,964

-

-

-

-

Anansix

USA . 523 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

523

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 164 parts In-Stock

1+ parts

$13.403

100+ parts

-

1k+ parts

$12.062

10k+ parts

-

164

$13.403

-

$12.062

-

MKK Technologies

India . 797 parts In-Stock

1+ parts

$25.203

100+ parts

-

1k+ parts

-

10k+ parts

-

797

$25.203

-

-

-

DigiPath Technology Company

USA . 797 parts In-Stock

1+ parts

$25.203

100+ parts

-

1k+ parts

-

10k+ parts

-

797

$25.203

-

-

-

Corphita

USA . 2,149 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,149

-

-

-

-

Parana Technologies

USA . 726 parts In-Stock

1+ parts

-

100+ parts

$16.025

1k+ parts

-

10k+ parts

-

726

-

$16.025

-

-

Overview

Unlock unmatched performance with the VND10N06TR from STMicroelectronics, a leader in innovative solutions. This robust peripheral driver ensures exceptional reliability with built-in protections against transient spikes, overcurrent, and thermal issues. Perfect for diverse applications, it delivers quick response times, making it ideal for any project. Elevate your designs with a trusted manufacturer that prioritizes quality and performance, providing peace of mind with every use!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy makes the product lightweight and resistant to environmental factors, enhancing its durability.

Surface Mount: YES

Surface mount technology allows for compact design and efficient use of board space, making it ideal for modern electronic applications.

Package Shape: RECTANGULAR

The rectangular shape optimizes layout and provides efficient mounting options, suitable for various applications.

Built-in Protections: TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL

Integrated protections ensure robustness and reliability, prolonging the product's lifespan, and safeguarding the connected circuits.

No. of Terminals: 2

Having only two terminals simplifies connection and reduces assembly complexity, making it user-friendly.

Package Style (Meter): SMALL OUTLINE

The small outline package style is advantageous for space-constrained designs, allowing for more compact circuit boards.

Terminal Position: SINGLE

A single terminal position streamlines the design and simplifies integration into various applications.

Maximum Seated Height: 2.63 mm

A low seated height facilitates the integration into low-profile designs, enhancing compatibility with space-limited projects.

Width: 6.1 mm

The compact width allows for denser packaging on circuit boards, optimizing overall layout efficiency.

Length: 6.5 mm

Short length contributes to minimizing board space usage while ensuring effective performance.

Terminal Form: GULL WING

Gull wing terminals provide reliable soldering and excellent mechanical stability, ensuring robust connections.

Turn-on Time: 1.8 us

A fast turn-on time enhances switching performance, making it suitable for high-speed applications.

Terminal Pitch: 2.28 mm

An optimal terminal pitch supports easier handling and soldering, improving manufacturing efficiency.

Nominal Output Peak Current Limit: 10 A

The ability to handle up to 10 A is ideal for demanding applications requiring strong power management capabilities.

Interface IC Type: BUFFER OR INVERTER BASED PERIPHERAL DRIVER

This makes the product versatile for a range of applications, providing flexibility in design configurations.

Turn-off Time: 2.3 us

A quick turn-off time minimizes power loss and improves efficiency, crucial for high-performance electronic circuits.

Output Current Flow Direction: SINK

Allows for effective current sinking configuration, which is advantageous in controlling connected devices.

Technical Specifications

Peripheral Drivers VND10N06TR attributes and parameters. Explore more Peripheral Drivers devices from STMicroelectronics

Specs

Built-in Protections:

TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL

JESD-30 Code:

R-PSSO-G2

Length:

6.5 mm

No. of Functions:

1

No. of Terminals:

2

Output Current Flow Direction:

SINK

Nominal Output Peak Current Limit:

10 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Maximum Seated Height:

2.63 mm

Surface Mount:

YES

Terminal Form:

Terminal Pitch:

2.28 mm

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Turn-off Time:

2.3 us

Turn-on Time:

1.8 us

Width:

6.1 mm

Trade Compliance

VND10N06TR Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 19