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VND10N06-E

STMicroelectronics

VND10N06-E by STMicroelectronics

VND10N06-E by STMicroelectronics is a peripheral driver with built-in protections for transient, over current, over voltage, and thermal issues. It has a max seated height of 2.4 mm and a nominal output peak current limit of 10 A. This small outline package is commonly used as a buffer or inverter based peripheral driver in various applications.

Median Price

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Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

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Chip Stock

USA . 44,798 parts In-Stock

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Vyrian

USA . 7,272 parts In-Stock

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Digiode

USA . 3,292 parts In-Stock

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3,292

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ComSIT Distribution GmbH

Germany . 2,100 parts In-Stock

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2,100

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Anansix

USA . 1,720 parts In-Stock

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1,720

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Nova Conductors

Japan . 84 parts In-Stock

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84

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Euro-Tech

UK . 10 parts In-Stock

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10

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Distributors (Availability)

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Corohmni

South Africa . 493 parts In-Stock

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$0.715

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493

$0.715

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IDEA Electronic Components Group

UK . 1,281 parts In-Stock

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$8.004

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$7.204

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1,281

$8.004

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$7.204

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Microchip USA

USA . 310 parts In-Stock

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$8.888

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310

$8.888

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Aztec Data Supply Inc.

USA . 2,143 parts In-Stock

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$11.330

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2,143

$11.330

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AZTECH Wire

Italy . 785 parts In-Stock

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$11.586

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785

$11.586

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MKK Technologies

India . 2,041 parts In-Stock

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$15.051

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$15.051

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DigiPath Technology Company

USA . 2,041 parts In-Stock

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$15.051

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$15.051

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Semicontronic

India . 934 parts In-Stock

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$32.500

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$31.688

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$31.525

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934

$32.500

$31.688

$31.525

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Ampacity Inc.

Singapore . 162 parts In-Stock

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$47.500

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162

$47.500

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Component Stockers USA

USA . 462 parts In-Stock

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$99.990

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Perfect Parts

USA . 55,944 parts In-Stock

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Lixinc

USA . 12,811 parts In-Stock

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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Continental Prestige Electronics

USA . 1,026 parts In-Stock

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Formix International (Excess)

India . 830 parts In-Stock

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830

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Argo Parts USA

USA . 491 parts In-Stock

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491

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Parana Technologies

USA . 373 parts In-Stock

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$9.570

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373

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Corphita

USA . 219 parts In-Stock

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Bastille Electronics

Australia . 100 parts In-Stock

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Overview

Discover the VND10N06-E by STMicroelectronics, a high-quality peripheral driver that offers unparalleled advantages in its category. Manufactured by STMicroelectronics, a trusted industry leader, this product is built with advanced features including transient protection, over current and voltage protection, and thermal protection. With its compact design and surface mount capability, the VND10N06-E is versatile and suitable for various applications. Unlock the value and benefits of this driver, such as its fast turn-on and turn-off time, nominal output peak current limit of 10A, and sink output current flow direction. Trust STMicroelectronics to deliver reliable and efficient solutions tailored to your needs.

Feature Benefit Bullets

Package Body Material:

PLASTIC/EPOXY - This material choice ensures durability and resistance to various environmental conditions, making the peripheral driver reliable for long-term use.

Surface Mount:

YES - With surface mount capability, this peripheral driver can be easily mounted onto printed circuit boards, saving space and simplifying the manufacturing process.

No. of Functions:

1 - This peripheral driver offers a single function, providing a specific and dedicated task, ensuring efficient and straightforward operation.

Package Shape:

RECTANGULAR - The rectangular package shape allows for easy placement and integration within different electronic systems, ensuring flexibility and compatibility.

Built-in Protections:

TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL - The peripheral driver comes with multiple built-in protections such as transient, over current, over voltage, and thermal protections, which ensure the safety and longevity of the connected devices and the peripheral driver itself.

No. of Terminals:

2 - With only two terminals, the peripheral driver offers simplicity in installation and wiring, reducing potential points of failure and improving overall reliability.

Package Style (Meter):

SMALL OUTLINE - The small outline package style allows for compact and space-saving integration within electronic systems, making it ideal for projects with limited space availability.

Terminal Position:

SINGLE - The single terminal positions simplify the connection and wiring process, enhancing ease of use and reducing potential errors during installation.

Maximum Seated Height:

2.4 mm - The low maximum seated height enables the peripheral driver to be easily integrated into slimmer or compact devices without adding significant bulk.

Width:

6.1 mm - With a compact width, the peripheral driver can be seamlessly incorporated into various electronic systems, providing versatility and space-saving advantages.

Length:

6.5 mm - The modest length allows for efficient placement and integration of the peripheral driver in tight spaces or crowded PCBs, ensuring flexibility and versatility.

Terminal Form:

GULL WING - The gull-wing terminal form facilitates a secure and reliable connection, reducing the risk of disconnection or intermittent connections.

Turn-on Time:

2.3 us - The fast turn-on time ensures quick response and activation, allowing the peripheral driver to efficiently meet system requirements or react to changing conditions.

Terminal Pitch:

2.28 mm - The terminal pitch of 2.28 mm provides appropriate spacing for reliable connections, ensuring ease of installation and reducing the likelihood of short circuits.

Nominal Output Peak Current Limit:

10 A - With a high nominal output peak current limit of 10 A, this peripheral driver is capable of delivering sufficient power to connected devices, making it suitable for demanding applications.

Interface IC Type:

BUFFER OR INVERTER BASED PERIPHERAL DRIVER - This interface IC type specifies that the peripheral driver can handle buffering or inversion tasks, enabling seamless communication and integration between different electronic components.

Turn-off Time:

1.8 us - The fast turn-off time ensures prompt deactivation or switching, improving system efficiency and responsiveness.

Output Current Flow Direction:

SINK - The sink output current flow direction implies that the peripheral driver is capable of drawing current from connected devices or components, making it an appropriate choice for many applications involving sinking current.

Technical Specifications

Peripheral Drivers VND10N06-E attributes and parameters. Explore more Peripheral Drivers devices from STMicroelectronics

Specs

Built-in Protections:

TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL

JESD-30 Code:

R-PSSO-G2

Length:

6.5 mm

No. of Functions:

1

No. of Terminals:

2

Output Current Flow Direction:

SINK

Nominal Output Peak Current Limit:

10 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum Seated Height:

2.4 mm

Surface Mount:

YES

Terminal Form:

Terminal Pitch:

2.28 mm

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Turn-off Time:

1.8 us

Turn-on Time:

2.3 us

Width:

6.1 mm

Trade Compliance

VND10N06-E Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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