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VND10N06-1

STMicroelectronics

VND10N06-1 by STMicroelectronics

VND10N06-1 by STMicroelectronics is a MOS technology peripheral driver with built-in protections for transient, over current, and over voltage. It has an output peak current limit of 10A and features Schmitt trigger input characteristics. This IN-LINE package style device is ideal for applications requiring buffer or inverter based peripheral drivers.

Median Price

-

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

ComSIT Distribution GmbH

Germany . 8,460 parts In-Stock

1+ parts

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8,460

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Vyrian

USA . 5,515 parts In-Stock

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5,515

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Anansix

USA . 1,948 parts In-Stock

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1,948

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Digiode

USA . 1,710 parts In-Stock

1+ parts

-

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1,710

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LittleDiode

UK . 4 parts In-Stock

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4

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 113 parts In-Stock

1+ parts

$9.710

100+ parts

-

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113

$9.710

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IDEA Electronic Components Group

UK . 1,258 parts In-Stock

1+ parts

$13.774

100+ parts

-

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$12.397

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1,258

$13.774

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$12.397

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MKK Technologies

India . 926 parts In-Stock

1+ parts

$25.902

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926

$25.902

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DigiPath Technology Company

USA . 926 parts In-Stock

1+ parts

$25.902

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926

$25.902

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Metaverse IC Inc.

Canada . 56,986 parts In-Stock

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56,986

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Kepictronics

USA . 13,000 parts In-Stock

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13,000

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Authorized Procurement Solutions

USA . 6,500 parts In-Stock

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6,500

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QUARKTWIN TECHNOLOGY LTD

USA . 4,273 parts In-Stock

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4,273

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Microchip USA

USA . 4,077 parts In-Stock

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4,077

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Corphita

USA . 3,158 parts In-Stock

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3,158

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Parana Technologies

USA . 1,975 parts In-Stock

1+ parts

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$16.469

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1,975

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$16.469

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Overview

Unlock the full potential of your electronic devices with the VND10N06-1 by STMicroelectronics. As a leader in the industry, STMicroelectronics ensures top-notch quality and reliability in their products, including this peripheral driver. Ideal for a wide range of applications, this product offers built-in protections against transient, over current, over voltage, and thermal issues. With its high output peak current limit of 10A and fast turn-on/off times, the VND10N06-1 provides unmatched value, benefits, and advantages to customers looking for superior performance in their designs. Elevate your projects with STMicroelectronics' cutting-edge technology.

Feature Benefit Bullets

Package Shape: RECTANGULAR

Rectangular shape allows for easy integration into different systems or circuits.

Built-in Protections: TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL

Multiple built-in protections ensure the safety and longevity of connected devices and the driver itself.

No. of Terminals: 3

Minimal number of terminals simplifies connection and reduces chances of errors.

Output Characteristics: OPEN-DRAIN

Open-drain output allows for flexibility and compatibility with various systems.

Terminal Finish: MATTE TIN

Matte tin finish provides good solderability and ensures reliable connections.

Maximum Seated Height: 7.4 mm

Low seated height makes the driver suitable for applications with space constraints.

Width: 2.3 mm

Compact width enables easy placement on a circuit board.

Output Polarity: TRUE

True output polarity ensures accurate signal transmission.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide sturdy connections and ease of soldering.

Input Characteristics: SCHMITT TRIGGER

Schmitt trigger input characteristics help in noise immunity and signal conditioning.

Technical Specifications

Peripheral Drivers VND10N06-1 attributes and parameters. Explore more Peripheral Drivers devices from STMicroelectronics

Specs

Built-in Protections:

TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL

Input Characteristics:

SCHMITT TRIGGER

JESD-30 Code:

R-XSIP-T3

JESD-609 Code:

e3

Length:

6.5 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

3

Output Characteristics:

OPEN-DRAIN

Output Current Flow Direction:

SINK

Nominal Output Peak Current Limit:

10 A

Output Polarity:

TRUE

Package Body Material:

UNSPECIFIED

Package Code:

SIP

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

7.4 mm

Surface Mount:

NO

Technology:

MOS

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

2.25 mm

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Turn-off Time:

2.3 us

Turn-on Time:

1.8 us

Width:

2.3 mm

Trade Compliance

VND10N06-1 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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